Mizunaga
Atsushi Mizunaga, Kasugai-Shi, Aichi JP
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20160038845 | TRAVELING TOY WHEEL - A traveling toy wheel whose simple configuration allows multiple devices to be enjoyed and can further change fine offsets is provided. The traveling toy wheel includes a first rim member to which a tire is mounted and a second rim member which includes a fitting portion into which a wheel hub of a traveling toy is fitted. Fitting holes as fixing portions are provided in one of the first rim member or the second rim member and elastic convex pieces as fixed portions are provided in the other of the first and second rim members. When the elastic convex pieces are fitted in the fitting holes, the first rim member and the second rim member are jointed relatively unmovably. A plurality of fitting holes are arranged at different positions, so that it is possible to easily adjust an offset of the wheel. | 02-11-2016 |
Hideki Mizunaga, Fukuoka-Shi JP
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20160001860 | OCEAN EXPLORATION APPARATUS AND OCEAN EXPLORATION METHOD - An ocean exploration apparatus including: a probe body; a buoyancy adjusting section that adjusts buoyancy generated in the probe body; a posture adjusting section that adjusts a posture of the probe body; a position information acquiring section that acquires position information of the probe body; a wing section that moves the probe body using a lifting force applied from seawater; a sensor section that is provided in the probe body and measures an electromagnetic field; and a control section that controls operations of the buoyancy adjusting section, the posture adjusting section, the position information acquiring section, and the sensor section according to predetermined conditions. | 01-07-2016 |
Kouichi Mizunaga, Koshi-Shi JP
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20090020072 | Chemical solution vaporizing tank and chemical solution treating system - An object is to suppress differences in concentration between processing gases supplied to a plurality of works in a chemical solution vaporizing tank. The chemical solution vaporizing tank includes a tank body having a plurality of vaporizing chambers formed by laterally and airtightly partitioning an internal space of the tank body, a chemical solution passage located under a liquid level in each vaporizing chamber and formed at each partition member for passing the chemical solution between the vaporizing chambers, and a gas passage located above the liquid level in each vaporizing chamber and formed at the partition member to communicate the vaporizing chambers with each other for uniformizing pressures in the respective vaporizing chambers. A quantity of the channel layer in each vaporizing chamber is controlled by managing, e.g., the liquid level. | 01-22-2009 |
20100199911 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus including: a heating part for heating a wafer; a transport part through which a wafer is transported; a first transfer arm that receives a wafer from the heating part and places the wafer on the transport part; and a second transfer arm including a pair of plate-like tweezers that receives the wafer placed on the transport part from the transport part and transfers the wafer. The transport part includes a cooling plate having a cooling surface on which a wafer is placed. The cooling plate includes a temperature-adjusting channel through which a temperature-adjusting water is circulated for cooling the cooling plate to a temperature lower than a temperature of the heating process of the heating part. The cooling surface is provided with a recess that is similar in shape to and slightly larger than a planar shape of the pair of tweezers. | 08-12-2010 |
Kouichi Mizunaga, Koshi City JP
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20110085299 | Substrate cooling apparatus, substrate cooling method, and storage medium - A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity. | 04-14-2011 |
20120088203 | Heat Treatment Apparatus and Heat Treatment Method - Disclosed is a heat treatment apparatus which includes a plurality of first disposing support members having an extendable elastic member to provide a first gap distance between a substrate disposing surface of a heat treatment plate and the rear surface of the substrate; a plurality of second disposing support members providing a second gap distance, which is smaller than the first gap distance, between the substrate disposing surface and the rear surface of the substrate; and a plurality of suction holes disposed at the substrate disposing surface of the heat treatment plate and sucking a space of the gap between the substrate disposing surface and the rear surface of the substrate, in which the substrate supported on the first disposing support member is sucked by the suction holes, such that the first disposing support member is contracted and the substrate is supported on the second disposing support member. | 04-12-2012 |
Satoshi Mizunaga, Nirasaki-Shi JP
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20120015525 | METHOD OF CLEANING A THIN FILM FORMING APPARATUS, THIN FILM FORMING METHOD, AND THIN FILM FORMING APPARATUS - A method of cleaning a thin film forming apparatus, for removing deposits adhering to an inside thereof after supplying a film-forming gas into a reaction chamber to form a amorphous carbon film on a workpiece, includes a heating operation of heating at least one of an inside of the reaction chamber and an inside of an exhaust pipe connected to the reaction chamber to a predetermined temperature; and a removing operation of supplying a cleaning gas containing oxygen gas and hydrogen gas into at least one of the inside of the reaction chamber and the inside of the exhaust pipe heated in the heating operation, heating the cleaning gas to the predetermined temperature to activate the oxygen gas and the hydrogen gas contained in the cleaning gas, and thereafter removing the deposits adhering to the inside of the thin film forming apparatus by the oxygen gas and the hydrogen gas activated. | 01-19-2012 |
Satoshi Mizunaga, Nirasaki City JP
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20130109195 | FILM FORMING APPARATUS AND METHOD OF OPERATING THE SAME | 05-02-2013 |
20130109196 | FILM FORMING APPARATUS AND METHOD OF OPERATING THE SAME | 05-02-2013 |
20140011368 | METHOD AND APPARATUS OF FORMING CARBON FILM - According to an embodiment of present disclosure, a method of forming a carbon film on a substrate to be processed is provided. The method includes loading a substrate to be processed with a carbon film formed thereon into a processing chamber of a film forming apparatus (Process | 01-09-2014 |
Sunao Mizunaga, Tokyo JP
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20090212826 | HYSTERESIS COMPARATOR - Disclosed herein is a hysteresis comparator for performing a binarization determination with respect to an input signal having a consecutively varying voltage level based on two threshold voltages having different voltage levels and generating an output signal based on a result of the determination. The hysteresis comparator includes a top peak detector for detecting a top peak of the input signal and generating a top peak detect voltage based on the detected top peak, a bottom peak detector for detecting a bottom peak of the input signal and generating a bottom peak detect voltage based on the detected bottom peak, a threshold voltage generator for generating the first and second threshold voltages within a range between a voltage level of the top peak detect voltage and a voltage level of the bottom peak detect voltage, and a voltage comparison circuit for comparing the voltage level of the input signal with the voltage levels of the first and second threshold voltages to perform the binarization determination with respect to the input signal, and generating the output signal based on the determination result. | 08-27-2009 |