Patent application number | Description | Published |
20100273286 | Method Of Fabricating An Integrated CMOS-MEMS Device - An embodiment of a method is provided that includes providing a substrate having a frontside and a backside. A CMOS device is formed on the substrate. A MEMS device is also formed on the substrate. Forming the MEMS device includes forming a MEMS mechanical structure on the frontside of the substrate. The MEMS mechanical structure is then released. A protective layer is formed on the frontside of the substrate. The protective layer is disposed on the released MEMS mechanical structure (e.g., protects the MEMS structure). The backside of the substrate is processed while the protective layer is disposed on the MEMS mechanical structure. | 10-28-2010 |
20110032129 | INTEGRATED CIRCUITS, LIQUID CRYSTAL DISPLAY (LCD) DRIVERS, AND SYSTEMS - An integrated circuit includes a digital-to-analog converter (DAC) circuit including at least one first channel type DAC and at least one second channel type DAC. The integrated circuit includes a plurality of sample and hold (S/H) circuits. Each of the S/H circuits is coupled with one of the DAC circuit. The S/H circuits are capable of receiving signals from the DAC circuit and outputting the signals in parallel. | 02-10-2011 |
20110261084 | DAC ARCHITECTURE FOR LCD SOURCE DRIVER - A two-stage digital-to-analog converter for outputting an analog voltage in response to a M-bit digital input code includes a two-bit serial charge redistribution digital-to-analog converter having a high reference voltage input node for receiving a high reference voltage and a low reference voltage input node for receiving a low reference voltage, and a voltage selector. The voltage selector sets the high reference voltage and low reference voltage to selected levels depending on at least a portion of the M-bit digital input code. | 10-27-2011 |
20120025389 | Hermetic Wafer Level Packaging - Provided is a wafer level packaging. The packaging includes a first semiconductor wafer having a transistor device and a first bonding layer that includes a first material. The packaging includes a second semiconductor wafer having a second bonding layer that includes a second material different from the first material, one of the first and second materials being aluminum-based, and the other thereof being titanium-based. Wherein a portion of the second wafer is diffusively bonded to the first wafer through the first and second bonding layers. | 02-02-2012 |
20120218132 | INTEGRATED CIRCUITS, LIQUID CRYSTAL DISPLAY (LCD) DRIVERS, AND SYSTEMS - An integrated circuit includes a digital-to-analog converter (DAC) circuit including at least one first channel type DAC and at least one second channel type DAC. The integrated circuit includes a plurality of sample and hold (S/H) circuits. Each of the S/H circuits is coupled with the DAC circuit. The S/H circuits are capable of receiving signals from the DAC circuit and outputting the signals in parallel. | 08-30-2012 |
20140154841 | Hermetic Wafer Level Packaging - Provided is a wafer level packaging. The packaging includes a first semiconductor wafer having a transistor device and a first bonding layer that includes a first material. The packaging includes a second semiconductor wafer having a second bonding layer that includes a second material different from the first material, one of the first and second materials being aluminum-based, and the other thereof being titanium-based. Wherein a portion of the second wafer is diffusively bonded to the first wafer through the first and second bonding layers. | 06-05-2014 |
20150014827 | UV PROTECTION FOR LIGHTLY DOPED REGIONS - An integrated circuit device includes a lightly doped region such as the base region of a bipolar junction transistor within a semiconductor body. The device further includes a UV barrier layer formed over the lightly doped region. The UV barrier protects the lightly doped region from damage that can occur during high energy plasma etching or UV irradiation to erase EPROM. | 01-15-2015 |
20150155880 | INTEGRATED CIRCUITS, LIQUID CRYSTAL DISPLAY (LCD) DRIVERS, AND SYSTEMS - An integrated circuit includes a digital-to-analog converter (DAC) circuit including at least one first channel type digital-to-analog converter (DAC) and at least one second channel type DAC. The integrated circuit further includes a plurality of sample and hold (S/H) circuits, each of the plurality of S/H circuits being coupled with a single DAC of the DAC circuit. A number of the at least one first channel type DAC is different than a number of the at least one second channel type DAC. | 06-04-2015 |