Patent application number | Description | Published |
20100073671 | ALIGNMENT MARK AND DEFECT INSPECTION METHOD - A defect inspection method is disclosed. A first type defect inspection system is used to perform a first defect inspection by aligning to an alignment mark on a wafer as a reference point for the first defect inspection. A fabrication process is performed on the wafer thereafter, and a second defect inspection is performed by using a second type defect inspection system to align the alignment mark on the wafer as the reference point for the second defect inspection. | 03-25-2010 |
20100213554 | GATE STRUCTURE AND METHOD FOR TRIMMING SPACERS - A gate structure includes a gate disposed on a substrate, a first spacer disposed on the substrate and surrounding the gate and a second spacer disposed on the first spacer and surrounding the gate, the second spacer is lower than the first spacer. | 08-26-2010 |
20100327451 | ALIGNMENT MARK - An alignment mark for defect inspection is disclosed. The alignment mark includes: a semiconductor substrate; a first type well disposed in the semiconductor substrate; a second type doping region disposed in the first type well; a dielectric layer disposed on the semiconductor substrate to cover the first type well and the second type doping region; and a plurality of conductive plugs formed in the dielectric layer for connecting to the second type doping region. | 12-30-2010 |
20110006437 | OPENING STRUCTURE - An opening structure includes a semiconductor substrate, at least one dielectric layer disposed on the semiconductor substrate, wherein the dielectric layer has a plurality of openings exposing the semiconductor substrate, and each of the openings has a sidewall, a dielectric thin film covering at least a portion of the sidewall of each of the openings, and a metal layer filled in the openings. | 01-13-2011 |
20110143511 | Method of fabricating n-channel metal-oxide semiconductor transistor - A method of fabricating an NMOS transistor, in which, an epitaxial silicon layer is formed before a salicide process is performed, then a nickel layer needed for the salicide process is formed, and, thereafter, a rapid thermal process is performed to allow the nickel layer to react with the epitaxial silicon layer and the silicon substrate under the epitaxial silicon layer to form a nickel silicide layer. | 06-16-2011 |
20120001338 | OPENING STRUCTURE - An opening structure is disclosed. The opening structure includes: a semiconductor substrate; at least one dielectric layer disposed on the semiconductor substrate, wherein the dielectric layer has a plurality of openings exposing the semiconductor substrate, and each of the openings has a sidewall; a dielectric thin film covering at least a portion of the sidewall of each of the openings; an etch stop layer disposed between the semiconductor substrate and the dielectric layer and extending partially into the openings to isolate the dielectric thin film from the semiconductor substrate; and a metal layer filled in the openings. | 01-05-2012 |
20120256273 | METHOD OF UNIFYING DEVICE PERFORMANCE WITHIN DIE - A method of unifying device performance within an integrated circuit die includes providing a layout of an integrated circuit die with multiple functional circuit blocks; filling a field between the multiple functional circuit blocks with dummy diffusion patterns; and filling the field between the multiple functional circuit blocks with dummy gate patterns such that the dummy gate patterns and the dummy diffusion patterns are completely overlapped. | 10-11-2012 |
20130234261 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF - A semiconductor structure includes a gate structure disposed on a substrate and having an outer spacer, a recess disposed in the substrate and adjacent to the gate structure, a doped epitaxial material filling up the recess, a cap layer including an undoped epitaxial material and disposed on the doped epitaxial material, a lightly doped drain disposed below the cap layer and sandwiched between the doped epitaxial material and the cap layer, and a silicide disposed on the cap layer and covering the doped epitaxial material to cover the cap layer together with the outer spacer without directly contacting the lightly doped drain. | 09-12-2013 |