Min-Lang
Min-Lang Chen, Taipei TW
Patent application number | Description | Published |
---|---|---|
20090266806 | MEMORY-LIKE HEAT SOURCE DEVICE - A memory-like heat source device includes a substrate, a conductive layer disposed on the substrate, and at least one simulative heat source region. The simulative heat source region has at least one passive element and a simulative package. The passive element is disposed on the conductive layer and electrically connected to the conductive layer. Once being powered on, the passive element generates thermal energy and is covered by the simulative package. Therefore, a structure extremely similar to a thermal state in a practical memory is constituted. | 10-29-2009 |
20090294429 | CHIP-LIKE HEAT SOURCE EQUIPMENT - A chip-like heat source equipment includes a simulation package, a thermal conductor, a heat source, a thermal grease, and an insulating pad. The thermal conductor is disposed in the simulation package, and has a simulated heat source region on one side. The heat source is disposed on another side of the thermal conductor having the simulated heat source region. The insulating pad is covered on the other side of the thermal conductor having the simulated heat source region and the heat source, such that the heat energy generated by the heat source is transferred to the simulated heat source region via the thermal conductor. In this manner, a structure having the heat generating states similar to that of the real chip is formed. | 12-03-2009 |
20090303679 | MEMORY MODULE - A memory module includes a circuit board and a heat sink. The circuit board is disposed with multiple chip packages separated from each other by a spacing. The heat sink is attached to the chip packages and opened with multiple holes corresponding to the spacings. Thereby, a thermal air flow chamber is formed for an airflow to enter the spacings and exchange heat with the chip packages. | 12-10-2009 |
Min-Lang Chen, New Taipei City TW
Patent application number | Description | Published |
---|---|---|
20150070844 | LIQUID-COOLING MODULE AND ELECTRONIC DEVICE USING THE SAME - A liquid-cooling module includes a liquid-providing component, a liquid-receiving component and at least one heat dissipating assembly. The liquid-providing component has a liquid inlet and a plurality of liquid-providing openings, while the liquid inlet is used for being connected to a cooler. The liquid-receiving component has a plurality of liquid-receiving openings and a liquid outlet, and the liquid outlet is used for being connected to the cooler. The at least one heat dissipating assembly includes a flow tube. One end of the flow tube is detachably connected to one of the plurality of liquid-providing openings, and the other end of the flow tube is connected on one of the plurality of liquid-receiving openings. | 03-12-2015 |
Min-Lang Huang, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20130043234 | HEATING DEVICE AND TEMPERATURE CONTROL DEVICE - A heating device and a temperature control device are provided. The heating device includes a heating element, and a heat conducting film disposed on the surface of the heating element, wherein the heat conducting film has a surface area that is larger than the contact area between the heat conducting film and the heating element. The heat conducting film is used for uniformly conducting heat generated by the heating element. Therefore, the existing non-uniform heating and slow heat dissipation problems for the heating element having a large surface area can be solved. Furthermore, because the metallic heat conducting film has good heat conduction, the heat can be quickly spread over a larger area to prevent localized overheating and damage to the heating element itself or the electrical product. | 02-21-2013 |
Min-Lang Tsai, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20150361121 | METHOD OF PREPARING CHITIN NANOFIBERS - The present invention discloses a method of preparing chitin nanofibers. By increasing the saturated moisture content of chitin and instantaneously releasing the pressure under a high temperature and high pressure environment, water within the chitin micro-particles is quickly evaporated and thus generated a high vapor pressure. Consequently, the interaction in chitin fiber is broken, and therefore the chitin nanofibers are obtained. | 12-17-2015 |
Min-Lang Wang, Tainan City TW
Patent application number | Description | Published |
---|---|---|
20160134229 | WATER RESISTANT ROOF ASSEMBLY STRUCTURE INTEGRATED WITH SOLAR PANELS - A water resistant roof assembly structure integrated with solar panels, for constructing a roof of a building, includes multiple support units arranged at a distance from one another, multiple solar modules disposed across every two adjacent support units, and multiple clamping units. Each support unit includes two carrying sections, a connecting section and two water discharging sections. Each water discharging section includes a valley portion adjacent to the carrying section, and a peak portion away from and having a height as the carrying section. Two sides of each solar module are respectively leaned against the carrying section and the water discharging section of one of the support units. A water discharging channel is formed between the solar module and the water discharging section to limit rainwater to flow towards two sides of the building. Each clamping unit includes a fixing portion, two extension portions and two pressing portions. | 05-12-2016 |