Patent application number | Description | Published |
20100130346 | METHOD OF PRESSURELESS SINTERING PRODUCTION OF DENSIFIED CERAMIC COMPOSITES - Methods of making and compositions of dense sintered ceramic nano- and micro-composite materials that are highly stable in a variety of conditions and exhibit superior toughness and strength. Liquid feed flame spray pyrolysis techniques form a plurality of nanoparticles (e.g., powder), each having a core region including a first metal oxide composition comprising Ce and/or Zr or other metals and a shell region including a second metal oxide composition comprising Al or other metals. In certain aspects, the core region comprises a partially stabilized tetragonal ZrO | 05-27-2010 |
20100210099 | METHODS OF FORMING A METAL SILICIDE LAYER FOR SEMICONDUCTOR DEVICES - Methods of forming a metal silicide layer are provided that include exposing polysilicon through just dry etching (JDE) and recessesing an oxide layer through chemical dry etching (CDE). In particular, dry etching is primarily performed to an extent to expose the polysilicon. Then, CDE is secondarily performed to expose the polysilicon. The CDE process includes selecting an etchant source among combinations of NF | 08-19-2010 |
20110117721 | METHOD OF FORMING ISOLATION LAYER STRUCTURE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THE SAME - An isolation layer structure includes first to fourth oxide layer patterns. The first and third oxide layer patterns are sequentially formed in a first trench defined by a first recessed top surface of a substrate and sidewalls of gate structures on the substrate in a first region. The first trench has a first width, and the first and third oxide layer patterns have no void therein. The second and fourth oxide layer patterns are sequentially formed in a second trench defined by a second recessed top surface of the substrate and sidewalls of gate structures on the substrate in a second region. The second trench has a second width larger than the first width, and the fourth oxide layer pattern has a void therein. | 05-19-2011 |
20110298036 | ISOLATION LAYER STRUCTURE, METHOD OF FORMING THE SAME AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THE SAME - An isolation layer structure includes first to fourth oxide layer patterns. The first and third oxide layer patterns are sequentially formed in a first trench defined by a first recessed top surface of a substrate and sidewalls of gate structures on the substrate in a first region. The first trench has a first width, and the first and third oxide layer patterns have no void therein. The second and fourth oxide layer patterns are sequentially formed in a second trench defined by a second recessed top surface of the substrate and sidewalls of gate structures on the substrate in a second region. The second trench has a second width larger than the first width, and the fourth oxide layer pattern has a void therein. | 12-08-2011 |
20130054409 | IN-APPLICATION PURCHASING METHOD AND METHOD FOR PROCESSING IN-APPLICATION PURCHASE - An in-application purchase processing method by a purchase processing server. The method includes: receiving a purchase request message of digital goods related to applications from a terminal; transmitting billing results of the digital goods to the terminal; receiving a download approval request message from the terminal; generating an authentication key for download approval and transmitting the authentication key to the terminal; receiving a download request message of the digital goods including the authentication key from the terminal; and transmitting a execution file of the digital goods in the application to the terminal. | 02-28-2013 |
20130159719 | APPARATUS AND METHOD FOR SIGNING APPLICATION - When a signature apparatus cooperating with a market server receives signature request information for an optional application from the market server to sign an application, the signature apparatus determines whether an authentication note has been issued corresponding to application identification information included in the signature request information based on the application identification information. When the authentication note has not been issued; the signature apparatus issues the authentication note using the application identification information, generates signature information for the to application using the application identification information, and signs the application including the authentication note and the signature information. | 06-20-2013 |
20130337312 | SEPARATOR FOR ELECTROCHEMICAL DEVICES AND METHOD OF MANUFACTURING THE SEPARATOR - There are provided a separator for electrochemical devices and a method of manufacturing the separator, and more particularly, a thin film separator for electrochemical devices which is improved in thermal stability and can be high-density charged for high capacity by employing a coating layer formed of an inorganic oxide thin film directly on a porous substrate and a method of manufacturing the separator using a film deposition method. | 12-19-2013 |
20140307624 | METHOD AND APPARATUS FOR SCHEDULING VIDEO TRAFFIC IN WIRELESS COMMUNICATION SYSTEM - A method of scheduling video traffic in a wireless communication system includes detecting codec information and a number of video frames included in at least one video traffic. The method also includes predicting a reproduction time of the at least one video traffic by using the codec information and the number of video frames. The method also includes performing scheduling of the at least one video traffic based on the predicted reproduction time. | 10-16-2014 |
Patent application number | Description | Published |
20090248475 | OPEN MOBILE BUSINESS SUPPORTING SYSTEM AND METHOD - An open mobile business supporting method and system are disclosed for effectively supporting various business models desired by a contents/service provider by providing single interface that can integrally use various resources of a mobile communication system. Low-level functions, which can be grouped as a unit function and performed in a mobile communication system, are selected among service logics of a CP/SP and defined as biz logic. The biz logic is performed according to a request of CP/SP by cooperating with a mobile communication system and various legacy systems. The result of performing the biz logic is returned to the CP/SP. | 10-01-2009 |
20090298465 | LEGACY COOPERATION DEVICE AND PROCESSING METHOD - A legacy cooperation device and processing method for a mobile communication system to be cooperated in an open mobile business supporting system is disclosed. In one embodiment, the method includes i) setting up a plurality of biz objects that perform a determination process based on a service process and a result thereof of a legacy system of a mobile communication system, ii) providing an API (application program interface) for each of the setup biz objects, iii) receiving a result of performing a predetermined biz object from a legacy system through the provided API and iv) requesting a service process to a corresponding legacy system according to the requested biz object, receiving a result of performing the service process, and returning the received result to the legacy system that requests the service process. | 12-03-2009 |
20090299885 | BILLING DEVICE AND PROCESSING METHOD - A billing device and processing method is disclosed. In one embodiment, the method includes i) collecting a billing log according to performing a biz template at the business logic processing unit, ii) verifying validity of the collected billing log, iii) performing a standardizing process on the verified billing log, iv) generating billing data by applying a predetermined billing policy according to the standardized billing log, v) generating a billing file (MDR) to transmit to a billing legacy system of a mobile communication system using the generated billing data and vi) transmitting the generated billing file (MDR) to the billing legacy system. | 12-03-2009 |
20100100526 | BUSINESS LOGIC DEVICE AND PROCESSING METHOD - A business logic device and processing method is disclosed. In one embodiment, the method includes i) receiving a request message for performing a biz template from the open interface processing unit, ii) analyzing the received biz template performing request message and performing the biz template by cooperating with a legacy cooperation processing unit and iii) composing a message for a result of performing the stored biz template and transmitting the composed message to the open interface processing unit. | 04-22-2010 |
Patent application number | Description | Published |
20090247123 | Method for Providing Security Services by Using Mobile Terminal Password and Mobile Terminal Thereof - A security service providing method using a mobile terminal password and a mobile terminal thereof. A normal password and an emergency password are stored in a smart card in advance. When a password for using a special service is input by a mobile terminal user, the input password is compared with the normal password and the emergency password. When the input password corresponds to the normal password, a special service requested by the user is provided. When the input password corresponds to the emergency password, a predetermined emergency process is performed. According to the emergency process, an emergency message is transmitted to the outside through a predetermined emergency networking process, predetermined virtual process information is displayed, or an abnormal process message for indicating unavailability of provision of the requested special service is displayed to the mobile terminal. Therefore, security is guaranteed and reliability is provided to the user who uses a special service through a mobile terminal by providing an emergency process performance function to the limited function of the password used for identification and authentication. | 10-01-2009 |
20140200945 | SYSTEM AND METHOD FOR CREATING BUILDING INFORMATION MODELING OBJECT BREAKDOWN STRUCTURE - Disclosed herein is a system and method for generating a BIM geometry breakdown structure. The system includes a geometry breakdown system (GBS) range setting module, a GBS geometric object coding module, and a GBS geometric object coding module. The GBS range setting module sets the range of a GBS based on BIM framework variables. The GBS element definition module generates “standard information breakdown property information” that is used to manage work-type breakdown and location breakdown, “project numbering system (PNS) property information” that is used to manage a work breakdown system (WBS), a cost breakdown structure (CBS), and a standard-method-of-measurement (SMM) breakdown structure (MBS), and “GBS property information” that is used to define geometric information. The GBS geometric object coding module matches geometric objects to the “standard information breakdown property information” and the “PNS property information”, and assigns numbers corresponding to the “GBS property information” to the matched geometric objects. | 07-17-2014 |
Patent application number | Description | Published |
20130161891 | DIE ATTACH APPARATUS - A die attach apparatus includes a stage, a collet member that is movable to apply load to the stage, a load measuring member that is arranged between the collet member and the stage and that measures load between the collet member and the stage, the load measuring member is divided into a plurality of loading measuring regions and the plurality of load measuring regions measure loads within the plurality of load measuring regions, respectively, and a controller member that determines whether the collet member is in a tilted state or a non-tilted state based on the loads measured within the plurality of load measuring regions by the load measuring member. | 06-27-2013 |
20140151437 | APPARATUS FOR MOUNTING SEMICONDUCTOR CHIPS ON A CIRCUIT BOARD - A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process. | 06-05-2014 |
20140359372 | METHOD OF DETECTING FAULTS OF OPERATION ALGORITHMS IN A WIRE BONDING MACHINE AND APPARATUS FOR PERFORMING THE SAME - In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand. | 12-04-2014 |