Michiro
Michiro Aoki, Obu-Shi JP
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20120328272 | COATED FILM DRYING FURNACE - A coated film drying furnace for drying a coated film inside a furnace body by conveying the coated film therein, the coated film having an absorption spectrum for electromagnetic waves of 3.5 μm or less and having hydrogen bonds, such as an electrode coated film for lithium ion battery. Infrared heaters provided inside a furnace body have outer circumferences of filaments concentrically covered by tubes that function as a low pass filter, and have a structure in which a fluid flow passage is formed at 16 between the plurality of tubes. Due to this, a temperature rise in the furnace is controlled so as to prevent explosion of an organic solvent vapor, and the coated film is efficiently heated and dried by intensively radiating near infrared rays of 3.5 μm or less that have superior ability to cut off the intermolecular hydrogen bonds onto a work. | 12-27-2012 |
Michiro Goto, Ibaraki-Shi JP
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20140235786 | POLYURETHANE AQUEOUS DISPERSION, FORMED FILM OBTAINED FROM SAME, AND GLOVE - Provided is a polyurethane aqueous dispersion characterized in having practical utility in terms of processing suitability when a formed film is produced by salt coagulation method, and characterized in that a formed film obtained from the same has practical utility in terms of resistance against ethanol water. A polyurethane aqueous dispersion for a formed film, the formed film being obtained by using the polyurethane aqueous dispersion and a coagulant liquid in combination, is obtained by: neutralizing an isocyanate group-terminated prepolymer obtained by reaction of a polyisocyanate (A) composed of diphenylmethane diisocyanate and alicyclic diisocyanate, a random copolymer (B) of ethylene oxide and tetrahydrofuran, a polyol (C) having a number average molecular weight of 1000 to 5000, a polyhydric alcohol-based chain extender (D) having a number average molecular weight of 400 or less, and a diol compound (E) having a carboxyl group; and dispersing the obtained neutralized substance in water, and thereafter causing a chain extension reaction using an amine-based chain extender (F). | 08-21-2014 |
Michiro Kaai, Aichi JP
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20100069592 | PROCESS FOR PRODUCING POLYMER MICROPARTICLES - A process for producing polymer microparticles by suspension polymerization of a vinyl-based monomer in which, when polymer microparticles are produced by suspension polymerization of a vinyl-based monomer, a macromonomer having a radically polymerizable unsaturated group at a terminus of a vinyl-based monomer-derived polymer is used as a dispersion stabilizer. | 03-18-2010 |
Michiro Matsuda, Yamagata JP
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20100086168 | SPEAKER DEVICE - In a speaker device, cutting wiring electrically connected to a conductive wire of an electronic component and a voice coil, and the conductive wire and the wiring are electrically connected without a speaker terminal lug. The speaker device includes wiring electrically connected to the voice coil, an electronic component having a component wire, and a frame. The frame has a conductive wire fixing part for fixing the conductive wire, and the conductive wire is fixed to the conductive wire fixing part to be directly connected to the wiring. Thereby, even if a vibration is transmitted to the frame at the time of driving the speaker device, the conductive wire never vibrates, and the conductive wire does not pull the wiring. Therefore, the conductive wire and wiring are not cut. Also, since the conductive wire is the speaker terminal lug, cost of the speaker device can be reduced. | 04-08-2010 |
Michiro Ogawa, Nagano-Shi JP
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20130153271 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 06-20-2013 |
20130185936 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 07-25-2013 |
20140145317 | ELECTRONIC COMPONENT DEVICE - A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective. | 05-29-2014 |
Michiro Yamamoto, Nagoya-Shi JP
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20110301121 | HYDROGEL OF POLYSACCHARIDE DERIVATIVE - A nerve dysfunction repairing material including a hydrogel of a polysaccharide derivative that has, in a 0.5 wt % aqueous solution, a complex modulus of 1 to 1000 N/m | 12-08-2011 |