Patent application number | Description | Published |
20080299434 | SOLID OXIDE TYPE FUEL CELL AND MANUFACTURING METHOD THEREOF - A solid oxide type fuel cell has a solid electrolyte substrate with a flat plate shape, and a cathode electrode layer is formed in a flat plate shape on one surface of the substrate and an anode electrode layer is formed in a flat plate shape on the other surface. The cathode electrode layer and the anode electrode layer are formed by the same electrode formation material. One or both of the cathode electrode layer and the anode electrode layer contain the electrode formation material and a solid electrolyte, and a concentration of the solid electrolyte included in the cathode electrode layer or the anode electrode layer increases with approach to the solid electrolyte substrate. Also, the solid oxide type fuel cell is formed by simultaneously calcining the solid electrolyte substrate, the cathode electrode layer and the anode electrode layer. | 12-04-2008 |
20090068532 | SOLID OXIDE TYPE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - The fuel cell uses a solid oxide as an electrolyte and includes a cell main body. The cell main body, which includes an anode layer, an electrolyte layer and a cathode layer, is formed on a mesh conductor according to a plasma spraying method. Atmospheres respectively in contact with the anode and cathode layers are operated according a method in which they are isolated from each other. The method for manufacturing the solid type fuel cell is characterized in that an anode composition, an electrolyte composition and a cathode composition are plasma sprayed onto the mesh conductor sequentially in this order. | 03-12-2009 |
20090072370 | MULTILAYER WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE - There is provided a multilayer wiring substrate on which at least one semiconductor element is mounted. The multilayer wiring substrate includes: a baseboard; a first wiring layer formed on the baseboard and having a plurality of first wiring portions; an insulating layer formed on the baseboard; a second wiring layer formed on the insulating layer and having a plurality of second wiring portions, the second wiring portions being electrically connected to each other via a conductor wire, the conductor wire being arranged within the insulating layer three-dimensionally in a curved manner; and conductor portions configured to pass through the insulating layer and connecting the first wiring portions and the second wiring portions. | 03-19-2009 |
20090075145 | SOLID OXIDE TYPE FUEL CELL - The solid oxide type fuel cell includes a cylindrical-shaped member S which includes an anode A on the inner surface of a cylindrical-shaped electrolyte E made of a solid oxide and a cathode on the outer surface thereof. The anode A contains an oxidation catalyst at least on the surface thereof. A fuel gas F is supplied from one end of the cylindrical-shaped member S, and a discharge gas, which is discharged from the other end of the cylindrical-shaped member S and includes uncombusted and/or incompletely combusted components, is combusted using flame combustion outside the cylindrical-shaped member S. Owing to the increased temperature of the cylindrical-shaped member S caused by the flame combustion B, the fuel gas F is combusted using catalyst combustion F within the cylindrical-shaped member S, thereby generating power. | 03-19-2009 |
20090133917 | Multilayered Circuit Board for Connection to Bumps - A circuit board on which an electronic device having bumps arranged in an array form is to be mounted includes a substrate having a multilayer structure that includes interconnect lines and insulating layers, and vias penetrating through one or more of the insulating layers and coupled to one or more of the interconnect lines, wherein the vias are arranged at positions that are the same as positions of the bumps to be connected on the substrate, and the vias project from a surface of the substrate so that upper-end portions of the vias are exposed from the surface of the substrate. | 05-28-2009 |
20090145649 | MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE - A multi-layered wiring substrate, in which a wiring layer and an insulative layer are alternately arranged, having pads to connect to electronic components at one side thereof and wires to connect the corresponding pads to the wiring layer, is composed so that the multi-layered wiring substrate is provided with through holes in which a resin material is filled, at least a part of the pads is formed on the resin material, and at least a part of the wire is contained in the resin material. | 06-11-2009 |
20090146318 | MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE - A multilayer wiring board includes: a substrate; connection pads arranged in a square grid fashion; and wiring patterns. Relationship between the connection pads and the wiring patterns satisfies: {(Ndl+1)P−d−s}/(w+s)>2Ndr+Ndl(a+1)+2a, wherein P is a pitch of the connection pads, d is a diameter of the connection pads, s is a minimum interval between the wiring patterns and is a minimum interval between the wiring pattern and the connection pad that are adjacent to each other, w is a minimum width of the wiring patterns, Ndl is the number of non-pad rows in each of the non-pad regions, Ndr is the number of non-pad columns in each of non-pad region, and a is an integer of (P−d−s)/(w+s). | 06-11-2009 |
20090266598 | WIRING BOARD - A wiring board includes a plate-shaped resin member; chip connection pads provided in the resin member, the chip connection pads having connection surfaces electrically connected to electrode pads provided on a semiconductor chip, the connection surfaces being situated in substantially the same plane as a first surface of the resin member, the first surface being a side where the semiconductor chip is mounted; pads provided in a portion of the resin member, the portion being situated outside an area where the chip connection pads are formed; lead wirings connected to the pads; and conductive wires sealed by the resin member, the conductive wires electrically connecting the chip connection pads and the pads to each other. | 10-29-2009 |
20110012266 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole. | 01-20-2011 |
20110018144 | WIRING BOARD AND SEMICONDUCTOR DEVICE - A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors. | 01-27-2011 |
20110095419 | CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a conductive film. The conductive film includes: an anodized layer having a plurality of through holes extending therethrough in its thickness direction; a plurality of linear conductors each formed in a corresponding one of the through holes and each having first and second protrusions protruding from the anodized layer, wherein at least one of the first and second protrusions is covered by a coating material; and an uncured thermosetting resin layer formed on the anodized layer to cover at least one of the first and second protrusions. | 04-28-2011 |
20110095433 | CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a conductive film. The method includes: (a) providing an anodized layer having a plurality of through holes extending therethrough in its thickness direction; (b) forming a plurality of linear conductors by filling each of the through holes with a conductive material; (c) forming protection layers on both surfaces of the anodized layer; (d) removing the anodized layer to form a plurality of gaps between the linear conductors; (e) forming an organic insulation layer between the protection layers to fill the gaps with the organic insulation layer; and (f) removing the protection layers. | 04-28-2011 |
20120313245 | SEMICONDUCTOR DEVICE - One embodiment provides a semiconductor device having: a core substrate having first and second surfaces and an accommodation hole penetrating therethrough; a semiconductor element accommodated in the accommodation hole so that a front surface thereof is on the first surface side; a first metal film formed on a back surface of the semiconductor element; a second metal film formed on the second surface of the core substrate; an insulating layer covering the first and second metal films; and a third metal film formed on the insulating layer, via parts thereof penetrating through the insulating layer to respectively reach the first and second metal films. | 12-13-2012 |
20120327626 | WIRING SUBSTRATE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE - One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump. | 12-27-2012 |
20130048350 | BASE MEMBER - A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer. | 02-28-2013 |
20130081796 | THERMAL INTERFACE MATERIAL, METHOD FOR MANUFACTURING THERMAL INTERFACE MATERIAL, AND JOINING STRUCTURE USING THERMAL INTERFACE MATERIAL - A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors. | 04-04-2013 |
20140125372 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - A probe card includes a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on the periphery of the opening portion, a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity, a contact terminal arranged to protrude from the lower face of the resin portion, and wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire. | 05-08-2014 |
20140262465 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes, an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate, a first connection pad arranged on one face of the insulating substrate, a second connection pad arranged to correspond to the first connection pad on other face of the insulating substrate, a first metal layer arranged to surround the first connection pad, a second metal layer arranged to correspond to the first metal layer, the second metal layer surrounding the second connection pad, the plurality of penetration conductors connecting the first connection pad and the second connection pad, and connecting the first metal layer and the second metal layer, and an elastic body formed in a part of the insulating substrate between the first and second connection pads, and the first and second metal layers. | 09-18-2014 |
20140347833 | ELECTRONIC COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic component device, includes, a plurality of wiring layers including a component connection pad in a center part and an external connection pad in a periphery, an insulating layer formed on the wiring layers, and the insulating layer in which the component connection pad and the external connection pad are exposed, a frame member arranged on the insulating layer, and the frame member in which an opening portion is provided in an area of the center part in which the component connection pad is arranged, and a connection hole is provided on the external connection pad, an electronic component arranged in the opening portion of the frame member and connected to the component connection pad, a sealing resin formed in the opening portion of the frame member and sealing the electronic component, and a metal bonding material formed on the external connection pad in the connection hole. | 11-27-2014 |
20150022229 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - A probe card, includes, a wiring substrate having an opening portion and including a first connection pad and a second connection pad, the first connection pad being arranged at a periphery of the opening portion, the second connection pad being arranged to be adjacent to the first connection pad, a resin portion formed inside the opening portion of the wiring substrate, a first wire buried in the resin portion and having one end connected to the first connection pad and the other end constituting a first contact terminal protruding from a lower face of the resin portion, and a second wire buried in the resin portion and having one end connected to the second connection pad and the other end constituting a second contact terminal protruding from the lower face of the resin portion, wherein diameters of the first contact terminal and the second contact terminal are equal to diameters of the first wire and the second wire in the resin portion, and the first contact terminal and the second contact terminal are gathered but divided from each other such that the pair of first and second contact terminals touch one electrode pad of a test object. | 01-22-2015 |
20150022230 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - A probe card includes a wiring substrate including an opening portion, a first connection pad, and a second connection pad arranged in an opposite area to the first connection pad, a resin portion formed in the opening portion, a first wire buried in the resin portion, in which one end is connected to the first connection pad and other end constitutes a first contact terminal, and a second wire buried in the resin portion, in which one end is connected to the second connection pad and other end constitutes a second contact terminal, wherein the first and second wires extend on one line, and the first and second contact terminals are arranged on the one line, and the first and second contact terminals are gathered to be separated such that the first and second contact terminals touch one electrode pad of a text object with a pair. | 01-22-2015 |