Patent application number | Description | Published |
20090263639 | LIGHT ACTIVATABLE POLYIMIDE COMPOSITIONS FOR RECEIVING SELECTIVE METALIZATION, AND METHODS AND COMPOSITIONS RELATED THERETO - The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns | 10-22-2009 |
20100263919 | Substrates for Electronic Circuitry Type Applications - An electronic type substrate having 40 to 97 weight-percent polymer and 3 to 60 weight-percent auto-catalytic crystalline filler. An interconnect or a conductor trace is created in the substrate by: i. drilling or ablating with a high energy electromagnetic source, such as a laser, thereby selectively activating the multi cation crystal filler along the surface created by the drilling or ablating step; and ii. metalizing by electroless and/or electrolytic plating into the drilled or ablated portion of the substrate, where the metal layer is formed in a contacting relationship with the activated multi cation crystal filler at the interconnect boundary without a need for a separate metallization seed layer or pre-dip. | 10-21-2010 |
20110177321 | MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. | 07-21-2011 |
20110287243 | MULTILAYER FILM FOR ELECTRONIC CIRCUITRY APPLICATIONS AND METHODS RELATING THERETO - The present disclosure relates to a multilayer film for electronic circuitry applications, having advantageous barrier properties against unwanted electron and electromagnetic wave interference, and also protection against dirt or other similar-type unwanted foreign matter interference. The multilayer films of the present disclosure have at least three layers. The first outer layer contains a polyimide base polymer, a carbon black filler and a dielectric filler. The core layer is a polyimide with less than 5 weight percent filler. The second outer is similar to the first outer layer and contains a polyimide base polymer, a low conductivity carbon black filler and a dielectric filler. The two outer layers can be the same or different. Optionally, additional layers can also be used between the two outer layers. | 11-24-2011 |
20120213988 | CORONA RESISTANT COMPOSITIONS AND METHODS RELATING THERETO - The present disclosure is directed to a corona resistant composition having a polyimide layer and a fluoropolymer layer. The polyimide layer is composed of a chemically converted polyimide and a corona resistant composite filler. The chemically converted polyimide is derived from at least 50 mole percent of an aromatic dianhydride and at least 50 mole percent of an aromatic diamine. The corona resistant composite filler has an organic component, A and an inorganic ceramic oxide component, B. The weight ratio of A:B is from 0.01 to 1.0. At least a portion of an interface between the two components comprises an organo-siloxane or organo-metaloxane moiety. | 08-23-2012 |
20120227790 | ASSEMBLIES COMPRISING A POLYIMIDE FILM AND AN ELECTRODE, AND METHODS RELATING THERETO - The assemblies of the present disclosure comprise an electrode, and a polyimide film. The polyimide film comprises a sub-micron filler and a polyimide. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions. | 09-13-2012 |
20120228616 | THIN FILM TRANSISTOR COMPOSITIONS, AND METHODS RELATING THERETO - The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions. | 09-13-2012 |
20120231257 | THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions. | 09-13-2012 |
20120231263 | COVERLAY COMPOSITIONS AND METHODS RELATING THERETO - The present disclosure is directed to a coverlay comprising a polyimide film and an adhesive layer. The polyimide film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions. | 09-13-2012 |
20120231264 | WIRE WRAP COMPOSITIONS AND METHODS RELATING THERETO - The present disclosure is directed to a wire wrap composition having a polyimide layer and a bonding layer. The polyimide layer is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions. | 09-13-2012 |
20120251808 | Matte Finish Polyimide Films and Methods Relating Thereto - The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. | 10-04-2012 |
20130011645 | MULTILAYER FILM FOR ELECTRONIC CIRCUITRY APPLICATIONS AND METHODS RELATING THERETO - The present disclosure relates to a multilayer film for electronic circuitry applications, having advantageous barrier properties against unwanted electron and electromagnetic wave interference, and also protection against dirt or other similar-type unwanted foreign matter interference. The multilayer films of the present disclosure have at least three layers. The first outer layer contains a base polymer, a carbon black filler or pigment and a dielectric filler. The core layer is a polymer with less than 5 weight percent filler. The second outer is similar to the first outer layer and contains a base polymer, a low conductivity carbon black filler or pigment and a dielectric filler. The two outer layers can be the same or different. Optionally, additional layers can also be used between the two outer layers. | 01-10-2013 |
20130029148 | MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent having a density from 1.3 to 1.5 g/cc and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 20 weight percent of the base film. | 01-31-2013 |
20130029166 | MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent having a density from 1.3 to 1.5 g/cc and either a non-carbon black pigment or a dye. The particulate polyimide matting agent is present in an amount from 1.6 to 20 weight percent of the base film. | 01-31-2013 |
20130196134 | MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. | 08-01-2013 |
20130209769 | CORONA RESISTANT STRUCTURES AND METHODS RELATING THERETO - The present disclosure is directed to a corona resistant structure having a polyimide layer. The polyimide layer is composed of a chemically converted polyimide and a corona resistant composite filler. The chemically converted polyimide is derived from at least 50 mole percent of an aromatic dianhydride and at least 50 mole percent of an aromatic diamine. The corona resistant composite filler has an organic component and an inorganic ceramic oxide component. The weight ratio of the organic component to the inorganic ceramic oxide component is from 0.01 to 1.0. At least a portion of the organic component comprises an organo-siloxane moiety or an organo-metaloxane moiety. | 08-15-2013 |
20130209788 | CORONA RESISTANT STRUCTURE AND METHODS RELATING THERETO - The present disclosure is directed to a corona resistant structure having a polyimide layer and an adhesive layer. The polyimide layer is composed of a chemically converted polyimide and a corona resistant composite filler. The chemically converted polyimide is derived from at least 50 mole percent of an aromatic dianhydride and at least 50 mole percent of an aromatic diamine. The corona resistant composite filler has an organic component and an inorganic ceramic oxide component. The weight ratio of the organic component to the inorganic ceramic oxide component is from 0.01 to 1.0. At least a portion of the organic component comprises an organo-siloxane moiety or an organo-metaloxane moiety. | 08-15-2013 |
20130236717 | PIGMENTED POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. | 09-12-2013 |
20130266789 | MATTE FINISH POLYMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. | 10-10-2013 |