Mcnamara, Jr.
James J. Mcnamara, Jr., Vestal, NY US
Patent application number | Description | Published |
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20110173809 | METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIELECTRIC LAYERS IN A CONTINUOUS MANNER - Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer. | 07-21-2011 |
20120068326 | ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS - A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling. | 03-22-2012 |
James J. Mcnamara, Jr., Endwell, NY US
Patent application number | Description | Published |
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20120152605 | CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD - A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed. | 06-21-2012 |
20120201006 | ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME - An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package. | 08-09-2012 |
Leo V. Mcnamara, Jr., Framingham, MA US
Patent application number | Description | Published |
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20120184028 | Micro IVF chamber - A micro IVF chamber that enables rapid filling, hermetic sealing, and custom gas environment control for secure cell extraction, fertilization, culturing, insemination, macro and microscopic content examination, post examination rapid refilling, return to optimal gas levels and pH values, with direct view of cell in conventional microscopes while maintaining culture environment, designed for use in any incubator and multiple devices per shelf for optimum efficiency while maintaining integrity of individual devices and patient-culture identity in a simple one-sample clamp-and-go device is disclosed. | 07-19-2012 |