Patent application number | Description | Published |
20120304765 | MODULE AND ELECTRONIC APPARATUS - A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side. | 12-06-2012 |
20120304768 | MODULE AND ELECTRONIC APPARATUS - A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility. | 12-06-2012 |
20120307459 | MAINTAINING MEMBER, MODULE, AND ELECTRONIC APPARATUS - A maintaining member includes alignment portions that determine a maintaining position of a module, in which each of the alignment portions has a mounting face to fix the module. When the maintaining member is partitioned into a first region to a fourth region by a first axis and a second axis that are orthogonal to each other in plan view with respect to the center of the maintaining member, the alignment portions are provided at the regions one by one. | 12-06-2012 |
20130014578 | SENSOR DEVICE, AND ELECTRONIC APPARATUSAANM SAKUMA; MasayasuAACI KamiinaAACO JPAAGP SAKUMA; Masayasu Kamiina JPAANM KOBAYASHI; YoshihiroAACI KomaganeAACO JPAAGP KOBAYASHI; Yoshihiro Komagane JPAANM KITAMURA; ShojiroAACI SuwaAACO JPAAGP KITAMURA; Shojiro Suwa JPAANM CHINO; TaketoAACI HokutoAACO JPAAGP CHINO; Taketo Hokuto JP - A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other. | 01-17-2013 |
20130014581 | SENSOR DEVICE, AND ELECTRONIC APPARATUSAANM SAKUMA; MasayasuAACI KamiinaAACO JPAAGP SAKUMA; Masayasu Kamiina JPAANM KOBAYASHI; YoshihiroAACI KomaganeAACO JPAAGP KOBAYASHI; Yoshihiro Komagane JPAANM KITAMURA; ShojiroAACI SuwaAACO JPAAGP KITAMURA; Shojiro Suwa JPAANM CHINO; TaketoAACI HokutuAACO JPAAGP CHINO; Taketo Hokutu JPAANM IMAI; NobuyukiAACI ShiojiriAACO JPAAGP IMAI; Nobuyuki Shiojiri JP - A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other. | 01-17-2013 |
20150122020 | SENSOR DEVICE AND ELECTRONIC APPARATUS - A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other. | 05-07-2015 |
20160097660 | MODULE AND ELECTRONIC APPARATUS - A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side. | 04-07-2016 |
20160109238 | SENSOR DEVICE, AND ELECTRONIC APPARATUS - A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other. | 04-21-2016 |