Patent application number | Description | Published |
20080308301 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD - The present invention provides a photocurable and thermosetting resin composition having excellent surface curability and deep curability, allowing pattern formation with a laser beam having a wavelength of 350 to 410 nm, and being useful as a solder resist for laser direct imaging, the composition including a carboxylic resin (A), an oxime ester-based photopolymerization initiator (B) such as 2-(acetyloxyiminomethyl)thioxanthene-9-one, and another photopolymerization initiator than (B) such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and a sulfur compound (E) such as 2-mercaptobenzothiazole. | 12-18-2008 |
20090029181 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD OBTAINED BY USING THE SAME - A photocurable and thermosetting resin composition developable with a dilute alkaline solution containing: (A) an ethylenic unsaturated group-containing and carboxylic acid-containing resin, (B) a coumarin skeleton-containing sensitizer having a maximum absorption wavelength of 360 to 410 nm, as represented by the following Formula (I): | 01-29-2009 |
20090035591 | FLEXIBLE LAMINATE HAVING THERMOPLASTIC POLYIMIDE LAYER AND METHOD FOR MANUFACTURING THE SAME - In a flexible laminate containing a metal foil layer/a thermoplastic polyimide layer or/and a conductor circuit layer/a thermoplastic polyimide layer, the metal foil layer or the conductor circuit layer is bonded to at least one side of the thermoplastic polyimide layer. The thermoplastic polyimide layer is formed from a thermoplastic polyimide resin film or sheet produced by melt extrusion of a thermoplastic polyimide resin. Alternatively, the thermoplastic polyimide layer is formed from a biaxially oriented thermoplastic polyimide resin film or sheet. Such a flexible laminate can be easily manufactured by a lamination method which comprises bonding a thermoplastic polyimide resin film ( | 02-05-2009 |
20090038834 | ALKALI DEVELOPMENT-TYPE SOLDER RESIST, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD PREPARED BY USING THE SAME - An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 μm of the film thickness at a wavelength of 350 to 375 nm. | 02-12-2009 |
20090194319 | PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD - Provided is a photocurable resin composition developable with a rare alkali solution, including a carboxylic acid-containing resin (A), a coloring agent (B) composed of a compound having an aminoantraquinone skeleton, a photopolymerization initiator (C), and a compound (D) having two or more ethylenically unsaturated groups within one molecule thereof, the composition being sufficiently colored while controlling absorption in the ultraviolet region using the coloring agent composed of a compound having an aminoantraquinone skeleton, having high sensitivity to ultraviolet and laser exposure, and providing good dry tack in a state of a dry coating film. | 08-06-2009 |
20120061128 | PHOTOSENSITIVE RESIN, CURABLE RESIN COMPOSITION CONTAINING THE SAME, DRY FILM THEREOF, AND PRINTED CIRCUIT BOARD USING THEM - A carboxyl group-containing photosensitive resin is obtained by reacting an α,β-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; | 03-15-2012 |
20120250268 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM THEREOF, AND PRINTED WIRING BOARD USING THEM - An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating. | 10-04-2012 |
20120301824 | LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR - In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board. | 11-29-2012 |
20120301825 | LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR - In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is lower in a surface layer region away from the substrate than in other region, so that a linear thermal expansion coefficient of the layer as a whole is maintained as low as possible. Preferably, the photosensitive resin layer or cured film layer comprises at least two layers having different inorganic filler contents, wherein the inorganic filler content in the layer on the surface side away from the substrate is lower than the inorganic filler content in the other layer. A photosensitive dry film containing the photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board. | 11-29-2012 |
20120308838 | PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED ARTICLE AND PRINTED WIRING BOARD - Disclosed are: a photocurable resin composition which may be developed with an alkali, has excellent resolution properties, and enables a cured article having excellent (humidity) heat resistance and thermal impact resistance to be formed; a dry film; a cured article thereof; and a printed wiring board using the cured article. The photocurable resin composition of the present invention is characterized by containing a carboxyl group-containing resin, a photopolymerization initiator, and surface-treated Neuburg siliceous earth particles. | 12-06-2012 |
20130081858 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention relates to a photosensitive resin composition in which a cured film obtained therefrom has good resistance to electroless gold plating and occurrence of whitening phenomenon in a solder leveling process (pre-soldering process) and an electroless gold plating process is inhibited; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film. | 04-04-2013 |
20130081864 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention provides a photosensitive resin composition having good resistance to electroless gold plating and excellent filling property into a through hole, from which a cured product where a defect in the outer appearance of a cured film caused by bumping in a through hole is inhibited can be obtained; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film. | 04-04-2013 |
20130085208 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. | 04-04-2013 |
20150016072 | DRY FILM, PRINTED WIRING BOARD USING SAME, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND FLIP CHIP MOUNTING SUBSTRATE - The present invention provides a dry film capable of forming a cured coating film having an excellent laser processability and a desmear resistance, and a printed writing board using the same. Further, the present invention provides a method of producing a printed writing board for a flip-chip mounting substrate capable of simply and inexpensively forming a dam preventing from spreading an underfill, a printed writing board obtained by the method of producing, and a flip-chip mounting substrate in which a chip is subjected to flip chip mounting on the printed writing board. | 01-15-2015 |