Patent application number | Description | Published |
20080303107 | OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME, CAMERA MODULE USING OPTICAL DEVICE, AND ELECTRONIC EQUIPMENT MOUNTING CAMERA MODULE - An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film. | 12-11-2008 |
20080304790 | OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME - An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire. | 12-11-2008 |
20090032684 | OPTICAL DEVICE AND PRODUCTION METHOD THEREOF - An optical device includes a base and an optical element chip and translucent member attached to the base. A wiring is buried in the base. One end of the wiring is an internal terminal portion. The other end of the wiring is an external terminal portion. A semiconductor chip incorporating peripheral circuits, etc., and a metal wire for connecting a pad electrode of the semiconductor chip and the wiring are buried in the base. The semiconductor chip incorporating peripheral circuits, etc., and the metal wire are buried together with the wiring in the base by molding, whereby the optical device and the semiconductor chip incorporating peripheral circuits, etc., are integrated into a single package. | 02-05-2009 |
20090034760 | ELECTRONIC COMPONENT, FABRICATION METHOD FOR THE SAME AND ELECTRONIC DEVICE HAVING THE SAME - The electronic component includes: a fixed film; a vibration film facing the fixed film; a first electrode formed on the fixed film and having at least one first through hole in the center portion; and a second electrode formed on a portion of the vibration film corresponding to the first electrode and having at least one second through hole in the peripheral portion. An air gap communicating with the first and second through holes is formed between the fixed film and the vibration film and surrounded with a rib. At least one side hole is provided to extend in the rib surrounding the air gap from the air gap toward outside. | 02-05-2009 |
20090086449 | OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF - An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. The recess has a two-level structure of a bottom recess and a portion located over the bottom recess. A stepped portion extends from an upper end of a first side surface of the bottom recess to a lower end of a second side surface of the bottom recess. | 04-02-2009 |
20090086769 | SEMICONDUCTOR DEVICE - A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C. | 04-02-2009 |
20090097139 | OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF - An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. A boundary portion between the side surface of the recess and a top surface portion and a boundary portion between the side surface and bottom surface of the recess have a rounded shape. | 04-16-2009 |
20090140405 | SEMICONDUCTOR DEVICE AND RESIN ADHESIVE USED TO MANUFACTURE THE SAME - A semiconductor device includes: a semiconductor element; a package body having the semiconductor element bonded inside thereof and electrically connected to the semiconductor element; a lid-like member covering the semiconductor element, and bonded to the package body to form a hollow structure; and a bonding member for bonding the package body and the lid-like member to each other. The bonding member is a resin adhesive containing an epoxy resin, a polymerization initiator, and a filling material, and a content of the filling material in the bonding member is 30 wt % to 60 wt %. | 06-04-2009 |
20090184335 | OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion. | 07-23-2009 |
20090211793 | SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE - In a substrate module of the present invention, a connection electrode is provided on a first surface of a substrate, and a first penetrating hole portion is running through the substrate in a thickness direction thereof so as to reach a reverse surface of the connection electrode, with a penetrating electrode being provided inside the first penetrating hole portion. The penetrating electrode defines a depression in a position opposing the reverse surface of the connection electrode, and an upper portion of the penetrating electrode is thicker than a side portion of the penetrating electrode. The penetrating electrode is present also on a second surface of the substrate, and is connected to a wiring electrode on the second surface. | 08-27-2009 |
20090236613 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - According to the present invention, a protective seal S | 09-24-2009 |
20090238394 | MICROPHONE AND METHOD FOR FABRICATING THE SAME - A microphone includes: a substrate including a tone hole and having a top surface on which a substrate electrode is provided; a converter provided on the top surface of the substrate and including a main body having a back space, a diaphragm provided at the bottom of the back space of the main body, and a converter electrode provided on a region of a bottom surface of the main body facing the substrate electrode; and a bump connecting the substrate electrode and the converter electrode to each other. The diaphragm vibrates in response to sound entering from the tone hole. The converter converts sound into a signal. | 09-24-2009 |
20090242940 | SENSOR DEVICE AND FABRICATION METHOD FOR THE SAME - The sensor device includes: a converter body made of silicon in the shape of a rhombus in plan, the converter body having an opening in the shape of a hexagon in plan; a substrate for holding the converter body; a movable film formed on the opening; a converter electrode formed on the converter body; and a substrate electrode formed on the substrate, the substrate electrode being electrically connected with the converter electrode. The opening is placed so that four of the six sides of the hexagon extend along the four sides of the rhombus of the converter body. | 10-01-2009 |
20090290062 | OPTICAL DEVICE AND PRODUCTION METHOD THEREOF - A lead frame is buried in mold resin to form a mold structure. A wide blade is used to make an indentation having an alignment step in the mold structure. Then, a narrow blade is used to split the mold structure. At the outer perimeter portion of a base which is a separate part separated from the mold structure, an alignment step is formed. Due to the alignment step, an optical element, such as a mirror tube of an imaging optical system, or the like, is readily and quickly attached. | 11-26-2009 |
20100001174 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND OPTICAL PICKUP MODULE - In a semiconductor device, a semiconductor element is mounted on a substantially rectangular package. First ribs are respectively provided on a pair of opposite external edges of a mounting surface and project upward from the pair of opposite external edges. External edges of a lid are placed on the upper surfaces of the first ribs, and fixed thereto with an adhesive. Dams are provided on external edges of the first rib upper surfaces. The adhesive is continuously present from side surfaces of the lid to the dams. | 01-07-2010 |
20100008203 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND OPTICAL PICKUP MODULE - A semiconductor element is mounted on a rectangular base of a package including the base and ribs provided on a pair of opposite external edges of the base. Electrode pads of the semiconductor element and connection electrodes provided on rib upper surfaces are connected to each other by metal wires. On the rib upper surfaces, spacers are provided at locations closer to the outside than the connection electrodes. A transparent lid adheres to the upper surfaces of the spacers to cover the entire surface of the package. The height of the spacers is greater than the diameter of the metal wires. | 01-14-2010 |
20100014262 | MODULE WITH EMBEDDED ELECTRONIC COMPONENTS - In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions. | 01-21-2010 |
20100044816 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS USING THE SAME - A semiconductor device includes: a semiconductor substrate having an imaging region in which a plurality of photoreceptors are arranged, and a peripheral circuit region arranged around the imaging region; a plurality of microlenses formed on the imaging region; a low-refractive-index film formed on the semiconductor substrate to cover the plurality of microlenses and part of the peripheral circuit region; and a transparent substrate formed on part of the low-refractive-index film above the imaging region. A through hole is formed in part of the low-refractive-index film above an amplifier circuit arranged in the peripheral circuit region. | 02-25-2010 |
20100046564 | SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT USING SAME - A semiconductor device includes: a first lead having an element mounting portion; a second lead located in a same plane as the first lead, with a predetermined space left between the first lead and the second lead; a molding encapsulant made of a resin for fixing the leads; and a semiconductor element affixed to a top surface of the element mounting portion of the first lead. The molding encapsulant covers at least part of each of upper and lower surfaces of the leads. A resin injection hole mark, which is a mark of a hole through which the encapsulant has been injected, is left on the encapsulant, and part of the resin injection hole mark is located above the first lead or the second lead, and the remaining part of the resin injection hole mark is located above a space between the first lead and the second lead. | 02-25-2010 |
20100048017 | BONDED STRUCTURE AND BONDING METHOD - An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon. | 02-25-2010 |
20100091630 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, OPTICAL PICKUP MODULE AND SEMICONDUCTOR DEVICE - A plurality of parallel rib prototypes are provided on a flat base plate. A plurality of semiconductor elements are placed in each trench between adjacent ones of the rib prototypes, and a transparent member is bonded to each of the semiconductor elements. Electrode pads of the semiconductor elements are wire bonded to connection electrodes. The trenches are then filled with an encapsulating resin. Thereafter, middle portions, in the longitudinal direction, of the rib prototypes are cut with a dicing saw, and adjacent ones of the semiconductor elements are separated from each other, thereby obtaining semiconductor devices. | 04-15-2010 |
20100091633 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND OPTICAL PICKUP MODULE - A flat pre-board plate including connection electrodes, internal interconnections, and external-connection portions is prepared. This pre-board plate is cut at portions each located between adjacent ones of the connection electrodes, thereby forming trenches. A plurality of semiconductor elements are placed in each of the trenches. Electrode pads and the connection electrodes are connected to each other by metal wires. Transparent lids are placed on, and bonded to, spacers to cover the semiconductor elements. Thereafter, two lines of the connection electrodes arranged between adjacent ones of the trenches are separated from each other. Subsequently, adjacent ones of the semiconductor elements are also separated from each other. | 04-15-2010 |
20100103802 | OPTICAL UNIT AND ELECTRONIC EQUIPMENT USING THE SAME - An optical unit includes: a first light emitting device configured to emit a first beam; and a second light emitting device configured to emit a second beam in a direction the same as a direction of the first beam where the second beam is different in wavelength from the first beam. An emission surface of the second light emitting device is arranged at a distance from an emission surface of the first light emitting device in an opposite direction to the direction of the first beam. | 04-29-2010 |
20100148292 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a semiconductor substrate | 06-17-2010 |
20100190287 | SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME - A semiconductor image sensor includes: a semiconductor imaging element including an imaging area, a peripheral circuit area, and an electrode area; cylindrical electrodes provided on electrode terminals so as to be electrically connected with an external device; and a transparent resin layer provided on the upper surface of the semiconductor imaging element. The upper surface of each cylindrical electrode and the upper surface of the transparent resin layer are substantially of the same height. | 07-29-2010 |
20100265665 | ELECTRONIC DEVICE HAVING A HEAT SINK - The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface. | 10-21-2010 |
20110083322 | OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant. | 04-14-2011 |
20110163328 | OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion. | 07-07-2011 |
20120038033 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor chip | 02-16-2012 |
20120112332 | RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A resin-sealed semiconductor device includes a power element ( | 05-10-2012 |
20120161302 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device according to the present disclosure includes: a plate ( | 06-28-2012 |
20120218717 | POWER MODULE - A reliable power module is realized, in which a good performance of radiating heat of the power semiconductor element is secured and it is hard for the heat of a power semiconductor element to be conducted to a driving element. A power module includes a power semiconductor element mounted on a lead frame, and a driving element mounted on the lead frame, and a heat radiating plate radiating heat which is generated by the power semiconductor element, and a resin holding the power semiconductor element, the driving element, and the heat radiating plate, wherein the heat radiating plate has a portion disposed at a side opposite to a surface of the lead frame where the power semiconductor element is mounted, a portion disposed between the power semiconductor element and the driving element, and a portion disposed below the power semiconductor element, as the portions being in a body. | 08-30-2012 |
20120299166 | CONDUCTION PATH, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD OF MANUFACTURING CONDUCTION PATH, AND SEMICONDUCTOR DEVICE - A conduction path includes a first conduction path forming plate ( | 11-29-2012 |
20120326289 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes: leads ( | 12-27-2012 |
20130015567 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAMEAANM Minamio; MasanoriAACI OsakaAACO JPAAGP Minamio; Masanori Osaka JPAANM Tanaka; ZyunyaAACI OsakaAACO JPAAGP Tanaka; Zyunya Osaka JPAANM Ijima; Shin-ichiAACI OsakaAACO JPAAGP Ijima; Shin-ichi Osaka JP - A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first external connection lead which has an end protruding from the outer package; and a second lead frame including a second relay lead, a second die pad with a control element mounted thereon, and a second external connection lead which has an end protruding from the outer package, wherein the first die pad and the second die pad or the first external connection lead and the second relay lead are joined to each other at a joint portion, and an end of the second relay lead extending from a joint portion with the first relay lead is located inside the outer package. | 01-17-2013 |
20130056885 | ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - An encapsulated semiconductor device includes: a first conduction path formative plate ( | 03-07-2013 |
20130221502 | JOINED BODY, POWER SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS OF JOINED BODY AND POWER SEMICONDUCTOR DEVICE - First, an aqueous solution ( | 08-29-2013 |
20140054077 | ELECTRICAL COMPONENT RESIN, SEMICONDUCTOR DEVICE, AND SUBSTRATE - A semiconductor device is a resin package structure including a semiconductor element T | 02-27-2014 |
20140264801 | SEMICONDUCTOR DEVICE - A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first external connection lead which has an end protruding from the outer package; and a second lead frame including a second relay lead, a second die pad with a control element mounted thereon, and a second external connection lead which has an end protruding from the outer package, wherein the first die pad and the second die pad or the first external connection lead and the second relay lead are joined to each other at a joint portion, and an end of the second relay lead extending from a joint portion with the first relay lead is located inside the outer package. | 09-18-2014 |
20140299982 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a package | 10-09-2014 |
20150035132 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - In a method for manufacturing a semiconductor device according to the present invention, as shown in FIG. | 02-05-2015 |
20150059819 | SOLAR POWER GENERATION DEVICE - In a solar power generation device concentrating solar light to solar cells by a reflecting mirror and converting solar energy into electric energy, a cooling pipe is arranged above the reflecting mirror, a thermoelectric conversion element is mounted on at least one side surface of the cooling pipe and a solar cell is mounted on an upper surface of the thermoelectric conversion element. | 03-05-2015 |