Patent application number | Description | Published |
20090257134 | Image capture lens and image capture apparatus - An image capture lens includes, in following order from an object side, a first lens made of glass which has a meniscus shape with a convex surface facing the object side and has positive refractive power, an aperture stop, a second lens made of glass which has a meniscus shape with a convex surface facing an image side and has negative refractive power, and a third lens made of resin which has a convex surface facing the object side and has positive refractive power. The image capture lens satisfies following conditional formulae (1) and (2): | 10-15-2009 |
20100014169 | ZOOM LENS AND IMAGING APPARATUS - This is addressed to provide a zoom lens which has a good optical performance for imaging device having a large number of pixels even with its simple construction, and which can also be small and thin in structure, and an imaging apparatus using the zoom lens. A zoom lens | 01-21-2010 |
20100308421 | SEMICONDUCTOR DEVICE - The size of a semiconductor device is reduced. A semiconductor chip in which a power MOSFET is placed above a semiconductor chip in which another power MOSFET is formed and they are sealed with an encapsulation resin portion. The semiconductor chips are so arranged that the upper semiconductor chip does not overlap with the area positioned directly above a gate pad electrode of the lower semiconductor chip. The semiconductor chips are identical in size and the respective source pad electrodes and gate pad electrodes of the lower semiconductor chip and the upper semiconductor chip are identical in shape and arrangement. The lower semiconductor chip and the upper semiconductor chip are arranged with their respective centers displaced from each other. | 12-09-2010 |
20100315545 | Zoom lens and image pickup apparatus - Provided is a zoom lens including a first lens group, a second lens group having a negative refractive power, a third lens group having a positive refractive power, and a fourth lens group having a positive refractive power, wherein conditional expressions f | 12-16-2010 |
20130162883 | IMAGING LENS AND IMAGING APPARATUS - An imaging lens including: in order from an object side thereof, a first lens having a positive refractive power; a second lens formed in a meniscus shape having a negative refractive power with a concave surface faced to an image side; a third lens formed in a biconvex shape having a positive refractive power near an optical axis; a fourth lens formed in a meniscus shape having a positive refractive power with a concave surface faced to the object side near the optical axis; and a fifth lens having a negative refractive power near the optical axis and a positive refractive power in a peripheral portion, the imaging lens satisfying the following conditional expression (a), 3.0≦f3/f4≦30.0 (a) where f3 is a focal length of the third lens, and f4 is a focal length of the fourth lens. | 06-27-2013 |
20130188088 | ZOOM LENS AND IMAGE PICKUP APPARATUS - A zoom lens includes a first lens group having a positive refracting power and normally fixed in position, a second lens group having a negative refracting power and movable along an optical axis, and a third lens group having a positive refracting power and normally fixed in position, disposed in order from the object side to the image side. Two thirds or more of lenses of the first to third lens groups are formed from a resin material. The zoom lens satisfies the following conditional expressions (1) and (2): | 07-25-2013 |
20130208174 | IMAGING LENS AND IMAGING DEVICE - The present invention ensures excellent optical characteristics corresponding with a high pixel imaging element while an imaging lens is miniaturized and has a larger aperture. | 08-15-2013 |
20130228907 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Conventional surface roughening plating technology cannot always improve the adhesion between a leadframe and a plating film and it depends on the material used for surface roughening plating. Conventional surface roughening technology by etching can only be used for leadframes made of limited materials. Improved adhesion cannot therefore be achieved between a metal member such as leadframe and a sealing resin. | 09-05-2013 |