Patent application number | Description | Published |
20080241759 | METHOD OF MANUFACTURING WIRING CIRCUIT BOARD - A conductor circuit ( | 10-02-2008 |
20090101394 | PHOTOSENSITIVE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING CIRCUT BOARD HAVING INSULATIVE COVER LAYER FORMED OF PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises: | 04-23-2009 |
20090149003 | DICING DIE-BONDING FILM - The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer ( | 06-11-2009 |
20100093155 | DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICONDUCTOR DEVICE - A dicing/die-bonding film including a pressure-sensitive adhesive layer ( | 04-15-2010 |
20100270060 | PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND CIRCUIT BOARD PRODUCTION METHOD - A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260° C. after being cured. | 10-28-2010 |
20110030998 | PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND CIRCUIT BOARD PRODUCTION METHOD - A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1): | 02-10-2011 |
20110147952 | DICING DIE-BONDING FILM - The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer ( | 06-23-2011 |
20120067625 | SUSPENSION BOARD WITH A CIRCUIT FOR USE IN A HARD DISK DRIVE - A suspension board with a circuit for use in a hard disk drive shows a small change in PSA (attitude angle) relative to a change in humidity and can support a slider including a magnetic head in a stable and highly precise manner. The suspension board with a circuit for use in a hard disk drive includes a substrate made of metal, an undercoat insulating layer provided on the substrate made of metal, a conductive layer provided on the undercoat insulating layer | 03-22-2012 |
20120067626 | PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT BOARD WITH METAL SUPPORT USING THE SAME - A photosensitive resin composition contains a component (A) and at least one of a component (B) and a component (C). In addition, in the circuit board with metal support including: a metal support; a base insulating layer; a conductive layer formed of a wiring circuit pattern; and a cover insulating layer, at least one of the above-mentioned base insulating layer and cover insulating layer is made of the above-mentioned photosensitive resin composition.
| 03-22-2012 |
20120088333 | DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICONDUCTOR DEVICE - A dicing/die-bonding film including a pressure-sensitive adhesive layer ( | 04-12-2012 |
20120175151 | SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF - A suspension board with circuit includes a gimbal portion. The gimbal portion includes a tongue portion formed at the inner side of the opening for being mounted with a slider mounted with a magnetic head for being electrically connected to the conductive layer, an outrigger portion formed at the outer side of the opening to support the tongue portion, and a passing portion passing through the opening of the gimbal portion and/or an outer side region of the outrigger portion. The passing portion includes the conductive layer and the insulating layer covering the conductive layer. The thickness of a lower half portion of the insulating layer in the passing portion is the same as that of an upper half portion thereof. | 07-12-2012 |
20120211263 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A wired circuit board includes an insulating layer formed with an insulating opening extending through the insulating layer in a thickness direction, and a conductive pattern including a wire formed on the insulating layer and a terminal connected to the wire. The terminal includes a filling portion with which the insulating opening of the insulating layer is internally filled, a first projecting portion formed to continue to the filling portion and project from the filling portion on one side in the thickness direction, and a second projecting portion formed to continue to the filling portion and project from the filling portion on the other side in the thickness direction. | 08-23-2012 |