Patent application number | Description | Published |
20080283931 | OTP memory cell, OTP memory, and method of manufacturing OTP memory cell - An OTP memory cell according to the present invention includes: a semiconductor substrate including a lower electrode forming region having a lower electrode formed therein, a diffusion layer forming region having a source and a drain formed therein, a first trench-type insulating region, and a second trench-type insulating region; an upper electrode being in contact with the first trench-type insulating region and formed on the lower electrode with the first insulating film interposed therebetween; and a gate electrode being in contact with the second trench-type insulating region and formed on a channel region with the second insulating film interposed therebetween, in which a shape of at least a part of an end of the lower electrode forming region in contact with the first insulating film is sharper than a shape of an end of the channel region in contact with the second insulating film. | 11-20-2008 |
20110026329 | SEMICONDUCTOR DEVICE USING CHARGE PUMP CIRCUIT - A semiconductor device including a plurality of capacitance units connected in parallel between a first voltage and a second voltage. Each of the plurality of capacitance units includes: a capacitance element connected with the first voltage; and a capacitance disconnecting circuit connected between the second voltage and the capacitance element. The capacitance disconnecting circuit includes a non-volatile memory cell with a threshold voltage changed based on a change of a leakage current which flows from the capacitance element, and blocks off the leakage current based on a rise of the threshold voltage of the non-volatile memory cell when the leakage current exceeds a predetermined value. | 02-03-2011 |
20110073992 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A first interlayer dielectric is formed over a substrate, and an electric conductor pillar is formed in the first interlayer dielectric. A damascene wiring part insulating film is formed over an upper surface of the first interlayer dielectric. The damascene wiring part insulating film above the electric conductor pillar is removed to form an opening part for capacitance, and an insulating film for capacitive element is formed over the upper surface of the first interlayer dielectric. The insulating film for capacitive element and the first interlayer dielectric above the electric conductor pillar are removed to form a trench for wiring. Metal bodies are embedded in the opening part for capacitance and the trench for wiring. The metal body in the opening part for capacitance is to be an upper electrode of the capacitive element, and the metal body in the trench for wiring is to be a logic wiring. | 03-31-2011 |
Patent application number | Description | Published |
20090162635 | COMPOSITE POROUS METAL BODY AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a composite porous metal body including: a sheet-like metal part containing a porous body having a three-dimensional network structure and being made of titanium or titanium alloy; and a resin part extending in an in-plane direction of the metal part and being integrally formed with the metal part. The handling property of the porous metal body is improved without sacrificing the effective area of the porous metal body. | 06-25-2009 |
20100015507 | POROUS TITANIUM HAVING LOW CONTACT RESISTANCE - Porous titanium having a low contact resistance includes porous titanium body, Au, and a Ti oxide layer ( | 01-21-2010 |
20100032616 | MIXED MATERIAL WITH HIGH EXPANSION RATE FOR PRODUCING POROUS METALLIC SINTERED BODY - A mixed material having a high expansion rate for producing a porous metallic sintered body including: a conventional mixed material for producing a porous metallic sintered body which is formed of a mixture including a composition of 0.05 to 10% by mass of a non-water-soluble hydrocarbon-based organic solvent having 5 to 8 carbon atoms, 0.5 to 20% by mass of a water-soluble resin binder, and 5 to 80% by mass of a metal powder having an average particle size within a range of 0.5 to 500 μm, and water as the balance; and a gas, wherein the mixed material contains the gas so that the proportion of the gas is within a range of 2 to 50% by volume while the remainder is the conventional mixed material for producing a porous metallic sintered body. | 02-11-2010 |
20100289167 | APPARATUS FOR PRODUCING POROUS BODY AND METHOD FOR PRODUCING POROUS BODY - An apparatus for producing a porous body that forms an expandable slurry containing at least inorganic powder, a foaming agent, and a binder into a sheet, causes the expandable slurry sheet to be foamed and baked, and thereby produces the porous body, the apparatus includes: a mixer preparing the expandable slurry by containing inorganic powder, a foaming agent, and a binder; a die-coater that has a discharge opening which discharges the expandable slurry provided from the mixer to an external thereof so as to shape the expandable slurry into a sheet; and a carrier sheet arranged so as to face the discharge opening of the die-coater with a gap interposed therebetween, and feeding the expandable slurry discharged from the discharge opening, wherein a flow path of the expandable slurry from inside the mixer to the discharge opening of the die-coater is hermetically sealed from an outside. | 11-18-2010 |
20130015600 | APPARATUS FOR PRODUCING POROUS BODY AND METHOD FOR PRODUCING POROUS BODY - An apparatus for producing a porous body that forms an expandable slurry containing at least inorganic powder, a foaming agent, and a binder into a sheet, causes the expandable slurry sheet to be foamed and baked, and thereby produces the porous body, the apparatus includes: a mixer preparing the expandable slurry by containing inorganic powder, a foaming agent, and a binder; a die-coater that has a discharge opening which discharges the expandable slurry provided from the mixer to an external thereof so as to shape the expandable slurry into a sheet; and a carrier sheet arranged so as to face the discharge opening of the die-coater with a gap interposed therebetween, and feeding the expandable slurry discharged from the discharge opening, wherein a flow path of the expandable slurry from inside the mixer to the discharge opening of the die-coater is hermetically sealed from an outside. | 01-17-2013 |
Patent application number | Description | Published |
20090267212 | Semiconductor Device - The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of thermal expansion is used in the multilayer substrate, and the coefficient of thermal expansion and glass transition point of the underfill are appropriately designed in accordance with the thickness and coefficient of thermal expansion of the core. By doing so, it is possible to relieve stresses inside the semiconductor package caused by deformation of the multilayer substrate due to temperature changes, and thereby to suppress damage to the semiconductor package due to temperature changes. | 10-29-2009 |
20090321919 | SEMICONDUCTOR DEVICE - The semiconductor device | 12-31-2009 |
20100032826 | SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL, AND SEALING RESIN COMPOSITION - A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75° C. of the cured member is 15 to 35 ppm/° C., the glass transition temperature of at least one buildup layer is 170° C. or more, and the coefficient of linear expansion of at 25 to 75° C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination. | 02-11-2010 |
20100190017 | GYPSUM BOARD HAVING MOLD RESISTANCE - A gypsum board having mold resistance includes a gypsum core containing a first anti-mold agent poorly soluble in water and a waterproofing agent; and gypsum board paper containing a second anti-mold agent poorly soluble in water. | 07-29-2010 |
20110124775 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME - Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The semiconductor encapsulating resin composition includes a phenol resin (A) containing a polymer (A0) having structural units represented by the following general formulae (1) and (2), and composed of one or more components having an aromatic group having at least one alkyl group with 1 to 3 carbon atoms at least at one end; an epoxy resin (B); and an inorganic filler (C), | 05-26-2011 |
20120001350 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C≧4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. | 01-05-2012 |
20120061861 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. | 03-15-2012 |
20120080809 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is a resin composition for encapsulating a semiconductor containing a curing agent, an epoxy resin (B) and an inorganic filler (C), wherein the curing agent is a phenol resin (A) having a predetermined structure. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. | 04-05-2012 |
20130075154 | SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION - A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R | 03-28-2013 |
20130289187 | RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE - A resin composition for encapsulation according to the present invention includes: a phenol resin-based curing agent (A) essentially containing a polymer component (A-1) in which a biphenylene group-containing structural unit bonds a monovalent hydroxyphenylene structural unit and a polyvalent hydroxyphenylene structural unit together and a polymer component (A-2) in which the biphenylene group-containing structural unit bonds the polyvalent hydroxyphenylene structural units together; an epoxy resin (B); and an inorganic filler (C). This makes it possible to economically obtain a resin composition for encapsulation having soldering resistance, flame resistance, continuous moldability, flowability and high temperature storage stability in an excellent balanced manner, and an electronic component device produced by encapsulating an element with a cured product thereof and having high reliability. | 10-31-2013 |
20140335365 | GYPSUM BOARD HAVING MOLD RESISTANCE - A gypsum board having mold resistance includes a gypsum core and gypsum board paper covering two surfaces of the gypsum core. The gypsum core contains first and second anti-mold agents, each having a water solubility of 200 ppm or less, and a waterproofing agent. A mixture consisting of the first and second anti-mold agents and starch is applied on a surface of the gypsum board paper, which surface is out of contact with the gypsum core. The first anti-mold agent is 2-(4-thiazolyl)-benzimidazole (TBZ) or 2-benzimidazol carbamic acid methyl ester (BCM), and the second anti-mold agent is 3-iodo-2-propyl butyl carbamate (IPBC). The total amount of the first and second anti-mold agents contained in the gypsum core is 0.03% to 0.2% of gypsum forming the gypsum core on an active ingredient basis, and the additive amount of the waterproofing agent is 0.3% to 1.5% of the gypsum forming the gypsum core. | 11-13-2014 |
Patent application number | Description | Published |
20090052679 | Apparatus for fault detection for parallelly transmitted audio signals and apparatus for delay difference detection and adjustment for parallelly transmitted audio signals - Characteristic amounts in each small region of audio signals transmitted in the working system and the standby system are extracted by characteristic amount calculators | 02-26-2009 |
20110166365 | Collagen peptide, dipeptide and malady inhibitor - A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component. | 07-07-2011 |
20120258919 | Collagen peptide, dipeptide and malady inhibitor - A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component. | 10-11-2012 |
Patent application number | Description | Published |
20080259399 | Print control apparatus, print control system and print apparatus - A print control apparatus in which a plurality of print apparatuses having a hold print function are caused to hold print data, and the print data of other print apparatuses other than a print apparatus print-instructed by a user is deleted, is provided. A print server is connected to the plurality of printers having a hold print function through a network. The print server includes a print data transmission portion that transmits print data received from a PC to printers to cause the printers to hold the print data, and a print data deletion instruction portion that, when a print notification of the print data is received from any one of the plurality of the printers, instructs other printers other than the printer to delete the print data. | 10-23-2008 |
20120188605 | PRINT CONTROL APPARATUS, PRINT CONTROL SYSTEM AND PRINT APPARATUS - A print control apparatus in which a plurality of print apparatuses having a hold print function are caused to hold print data, and the print data of other print apparatuses other than a print apparatus print-instructed by a user is deleted, is provided. A print server is connected to the plurality of printers having a hold print function through a network. The print server includes a print data transmission portion that transmits print data received from a PC to printers to cause the printers to hold the print data, and a print data deletion instruction portion that, when a print notification of the print data is received from any one of the plurality of the printers, instructs other printers other than the printer to delete the print data. | 07-26-2012 |