Masahiro Noda
Masahiro Noda, Yokkaichi-City JP
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20080254673 | TERMINAL FITTING - A terminal fitting has a base ( | 10-16-2008 |
20080280507 | FEMALE TERMINAL FITTING - A female terminal fitting ( | 11-13-2008 |
20100062658 | TERMINAL FITTING AND A CONNECTOR - An insulation barrel ( | 03-11-2010 |
20120225587 | CONNECTOR - Areas at outer edge sides of a draw-out area for wires ( | 09-06-2012 |
Masahiro Noda, Shizuoka JP
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20090194354 | Motorcycle - A motorcycle including a body frame | 08-06-2009 |
Masahiro Noda, Toda-Shi JP
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20110288557 | Intraocular Lens Insertion Device - There is provided an intraocular lens insertion device capable of appropriately regulating the motion of a rear supporting portion during a process of moving an intraocular lens, and reducing the possibility of reoperation being required after the intraocular lens is inserted into an eye. An intraocular lens insertion device | 11-24-2011 |
20130226193 | OCULAR IMPLANT INSERTION APPARATUS AND METHODS - An exemplary ocular implant insertion system includes a case and a preloaded ocular implant insertion apparatus. The apparatus includes first and second movable structures that move the ocular implant in a predetermined sequence. The respective configurations of the case and the ocular implant insertion apparatus are such that the ocular implant insertion apparatus is not removable from the case when the ocular implant insertion apparatus is in the pre-use state and is removable after the first movable structure has moved at least a portion of the optical implant. | 08-29-2013 |
20140114323 | OCULAR IMPLANT INSERTION APPARATUS AND METHODS - An exemplary ocular implant insertion system includes a case and a preloaded ocular implant insertion apparatus. The apparatus includes first and second movable structures that move the ocular implant in a predetermined sequence. The respective configurations of the case and the ocular implant insertion apparatus are such that the ocular implant insertion apparatus is not removable from the case when the ocular implant insertion apparatus is in the pre-use state and is removable after the first movable structure has moved at least a portion of the optical implant. | 04-24-2014 |
20140194890 | INTRAOCULAR LENS INSERTION DEVICE - There is provided an intraocular lens insertion device capable of appropriately regulating the motion of a rear supporting portion during a process of moving an intraocular lens, and reducing the possibility of reoperation being required after the intraocular lens is inserted into an eye. An intraocular lens insertion device | 07-10-2014 |
Masahiro Noda, Yokkaichi JP
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20120083121 | Fabrication of Replacement Metal Gate Devices - Methods for polishing multiple dielectric layers to form replacement metal gate structures include a first chemical mechanical polish step to remove overburden and planarize a top layer to leave a planarized thickness over a gate structure. A second chemical mechanical polish step includes removal of the thickness to expose an underlying covered surface of a dielectric of the gate structure with a slurry configured to polish the top layer and the underlying covered surface substantially equally to accomplish a planar topography. A third chemical mechanical polish step is employed to remove the dielectric of the gate structure and expose a gate conductor. | 04-05-2012 |
20120083123 | Chemical Mechanical Planarization Processes For Fabrication of FINFET Devices - A planarization method includes planarizing a semiconductor wafer in a first chemical mechanical polish step to remove overburden and planarize a top layer leaving a thickness of top layer material over underlying layers. The top layer material is planarized in a second chemical mechanical polish step to further remove the top layer and expose underlying layers of a second material and a third material such that a selectivity of the top layer material to the second material to the third material is between about 1:1:1 to about 2:1:1 to provide a planar topography. | 04-05-2012 |
20120083125 | Chemical Mechanical Planarization With Overburden Mask - Planarization methods include depositing a mask material on top of an overburden layer on a semiconductor wafer. The mask material is planarized to remove the mask material from up areas of the overburden layer to expose the overburden layer without removing the mask material from down areas. The exposed overburden layer is wet etched and leaves a thickness remaining over an underlying layer. Remaining portions of the mask layer and the exposed portions of the overburden layer are planarized to expose the underlying layer. | 04-05-2012 |
20140134861 | LEVER TYPE CONNECTOR - A lever type connector includes: a first housing; a lever that is rotatably fixed to the first housing; a cam groove formed in the lever; and a second housing having a cam follower. The first housing and the second housing are fitted together by rotating the lever | 05-15-2014 |
Masahiro Noda, Yokkaichi, Mie JP
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20120083122 | Shallow Trench Isolation Chemical Mechanical Planarization - A polishing method includes polishing, in a first polish, a wafer to remove overburden and planarize a top layer leaving a portion remaining on an underlying layer. A second polishing step includes two phases. In a first phase, the top layer is removed and the underlying layer is exposed, with a top layer to underlying layer selectivity of between about 1:1 to about 2:1 to provide a planar topography. In a second phase, residual portions of the top layer are removed from a top of the underlying layer to ensure complete exposure of an underlying layer surface. | 04-05-2012 |
Masahiro Noda, Minato-Ku JP
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20150337245 | CLEANING COMPOSITION AND CLEANING METHOD - A cleaning composition includes (A) at least one compound selected from the group consisting of a fatty acid that includes a hydrocarbon group having 8 to 20 carbon atoms, a phosphonic acid that includes a hydrocarbon group having 3 to 20 carbon atoms, a sulfuric acid ester that includes a hydrocarbon group having 3 to 20 carbon atoms, an alkenylsuccinic acid that includes a hydrocarbon group having 3 to 20 carbon atoms, and salts thereof, (B) an organic acid, (C) a water-soluble amine, (D) a water-soluble polymer, and an aqueous medium, the cleaning composition having a pH of 9 or more. | 11-26-2015 |