Patent application number | Description | Published |
20130238865 | DECOMPRESSION APPARATUS AND DECOMPRESSION METHOD - A decompression apparatus includes a memory configured to store a dictionary data including, in association with a compression code, a decompression symbol and address information indicating a position of flag information, which indicates whether the decompressed symbol is included in a block of decompressed data obtained by decompressing a block of compressed data or not, and a processor configured to execute a procedure, the procedure including accessing the dictionary data stored in the memory, obtaining, from the dictionary data, the decompressed symbol and the address information associated with the compressed symbol included in the block of compressed data, generating the decompressed data by using the obtained decompressed symbol, and updating the flag information stored at the position indicated by the obtained address information. | 09-12-2013 |
20150033185 | NON-TRANSITORY COMPUTER-READABLE MEDIUM STORING SELECTED CHARACTER SPECIFICATION PROGRAM, SELECTED CHARACTER SPECIFICATION METHOD, AND SELECTED CHARACTER SPECIFICATION DEVICE - A non-transitory computer-readable medium storing a selected character specification program that causes a computer to execute a process including detecting a character region indicating a region, in which each character of the displayed character string is displayed on a screen, based on character string display information, specifying a stroke of a closed curved line designated on the screen based on input operation information, and specifying one or a plurality of successive characters, in which a ratio of an area of a selected region based on uppermost, lowermost, leftmost, and rightmost points of the stroke of the closed curved line in the character region to an area of the character region exceeds a threshold, as selected character among a respective character of the displayed character string overlapped with the stroke of the closed curved line. | 01-29-2015 |
Patent application number | Description | Published |
20080257581 | TERMINAL FOR ENGAGING TYPE CONNECTOR - A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability. | 10-23-2008 |
20090053553 | CONDUCTIVE MATERIAL FOR A CONNECTING PART - Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D | 02-26-2009 |
20100163277 | TERMINAL FOR ENGAGING TYPE CONNECTOR - A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability. | 07-01-2010 |
20100247959 | SN-PLATED COPPER OR SN-PLATED COPPER ALLOY HAVING EXCELLENT HEAT RESISTANCE AND MANUFACTURING METHOD THEREOF - In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a copper alloy. An average thickness of the Ni layer is 0.1 to 1.0 μm, an average thickness of the Cu—Sn alloy layer is 0.55 to 1.0 μm, and an average thickness of the Sn layer is 0.2 to 1.0 μm. The Cu—Sn alloy layer includes Cu—Sn alloy layers having two compositions, a portion thereof in contact with the Ni layer is formed of an ε-phase having an average thickness of 0.5 to 0.95 μm, and a portion thereof in contact with the Sn layer is formed of a η-phase having an average thickness of 0.05 to 0.2 μm. | 09-30-2010 |
20110236712 | COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PARTS, AND MATING-TYPE CONNECTING PART AND METHOD FOR PRODUCING THE SAME - The surface roughness of a copper sheet is adjusted to have an arithmetic mean roughness Ra of 0.5 μm or more and 4.0 μm or less in a direction parallel to a sliding direction upon connection, a mean projection-depression interval RSm of 0.01 mm or more and 0.3 mm or less in the direction, a skewness Rsk of less than 0, and a protrusion peak portion height Rpk of 1 μm or less. Further, as a surface coating layer, a Sn coating layer group X observed as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is present adjacent to each side of each of Sn coating layers constituting the Sn coating layer group X. The maximum height roughness Rz is 10 μm or less in a direction of part insertion. At the time of stamping the copper sheet, the copper sheet is surface-roughened by pressing, thereby forming depressions observed as a plurality of parallel lines in the surface of the copper sheet. The copper sheet is then plated with Cu and Sn, followed by reflowing to complete the production. | 09-29-2011 |
20120138330 | PCB TERMINAL AND METHOD FOR MANUFACTURING THE SAME - The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer | 06-07-2012 |
20140041219 | COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PARTS, AND MATING-TYPE CONNECTING PART AND METHOD FOR PRODUCING THE SAME - A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 μm to 4.0 μm in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 μm or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 μm or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing. | 02-13-2014 |
20140045392 | COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PARTS, AND MATING-TYPE CONNECTING PART AND METHOD FOR PRODUCING THE SAME - A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 μm to 4.0 μm in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 μm or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 μm or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing. | 02-13-2014 |
20140295212 | COPPER ALLOY STRIP FOR LEAD FRAME OF LED - Provided is a lead frame made of a Cu—Fe-based copper alloy strip to improve the heat dissipation in an LED package. An Ag plating reflective film formed on the lead frame enhances the brightness of the LED package. In the Cu—Fe-based copper alloy strip, arithmetic mean roughness Ra is 0.2 μm or less, ten-point mean roughness Rz | 10-02-2014 |