Patent application number | Description | Published |
20110020982 | METHOD FOR BONDING OF CHIPS ON WAFERS - Method for bonding a plurality of chips onto a base wafer. | 01-27-2011 |
20110045185 | DEVICE FOR EMBOSSING OF SUBSTRATES - The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of:
| 02-24-2011 |
20120241098 | DEVICE AND METHOD FOR SEPARATING A SUBSTRATE FROM A CARRIER SUBSTRATE - Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate. | 09-27-2012 |
20120255365 | APPARATUS, DEVICE AND METHOD FOR DETERMINING ALIGNMENT ERRORS - The invention relates to an apparatus, a device and a method for determining local alignment errors which have occurred due to strain and/or distortion of a first substrate relative to a second substrate when the first substrate is joined to the second substrate and for alignment of two wafers by means of position maps, strain maps and/or stress maps of wafers which are recorded during and/or after alignment of the wafers, especially through at least one transparent region of at least one of the wafers, optionally the relative position of the two wafers to one another being corrected especially in-situ. | 10-11-2012 |
20130011997 | METHOD FOR PRODUCING A WAFER PROVIDED WITH CHIPS - A method for producing a product wafer having chips thereon, comprising the steps of:
| 01-10-2013 |
20130037975 | METHOD AND DEVICE FOR PRODUCING A MICROLENS - This invention relates to a method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method. Furthermore the invention relates to a device for producing a microlens as well as a microlens. | 02-14-2013 |
20130040451 | METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES - A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces. | 02-14-2013 |
20130065360 | METHOD FOR PRODUCING CHIP STACKS, AND A CARRIER FOR CARRYING OUT THE METHOD - The invention relates to a method for producing chip stacks with the following method sequence:
| 03-14-2013 |
20130168027 | DEVICE FOR SEPARATING A SUBSTRATE FROM A CARRIER SUBSTRATE - Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate. A substrate holder is located opposite the carrier substrate holder. The substrate holder has a substrate holding surface which can be located parallel to the holding surface of the carrier substrate holder. A separating means is provided for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate. | 07-04-2013 |
20130193596 | METHOD AND DEVICE FOR PRODUCING A LENS WAFER - A method and a device for producing a lens wafer which has a plurality of microlenses, as well as microlenses produced from the lens wafer. | 08-01-2013 |
20130228015 | MEASURING DEVICE AND METHOD FOR MEASURING LAYER THICKNESSES AND DEFECTS IN A WAFER STACK - The invention relates to a measurement means and a method for measuring and/or acquiring layer thicknesses and/or voids of one or more layers of a wafer stack on a plurality of measuring points distributed on the wafer stack and a corresponding wafer processing device. | 09-05-2013 |
20130270756 | RETAINING SYSTEM FOR RETAINING AND HOLDING A WAFER - This invention relates to a retaining system for retaining and holding a wafer for processing the wafer with a holding surface for placing the wafer on a support surface of the wafer and holding means for holding the wafer, whereby because of the holding means holding extremely thin wafers on the holding surface of the wafer, the smallest possible local distortions of the wafer are achieved. | 10-17-2013 |
20130299080 | METHOD FOR PERMANENT BONDING OF WAFERS - A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate. | 11-14-2013 |
20130330165 | ACCOMMODATING DEVICE FOR RETAINING WAFERS - A receiving means for receiving and mounting of wafers, comprised of:
| 12-12-2013 |
20140017877 | METHOD FOR PERMANENTLY BONDING WAFERS - This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence:
| 01-16-2014 |
20140051231 | METHOD FOR PERMANENTLY BONDING WAFERS - This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence:
| 02-20-2014 |
20140073112 | METHOD FOR PERMANENTLY BONDING WAFERS - A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises:
| 03-13-2014 |
20140102221 | METHOD AND DEVICE FOR DETERMINING THE PRESSURE DISTRIBUTION FOR BONDING - A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution. | 04-17-2014 |
20140154867 | METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEANS OF SOLID STATE DIFFUSION OR PHASE TRANSFORMATION - A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused. | 06-05-2014 |
20140196842 | METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS, AS WELL AS CUTTING TOOL - A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material, said method comprising the steps of:
| 07-17-2014 |
20140232037 | NANOSTRUCTURE DIE, EMBOSSING ROLL, DEVICE AND METHOD FOR CONTINUOUS EMBOSSING OF NANOSTRUCTURES - A nanostructure die with a concavely curved nanostructured die surface for seamless embossing of at least one peripheral ring of a jacket surface of an embossing roll in a step-and-repeat process and an embossing roll for continuous embossing of nanostructures with an embossing layer, which has been applied on a body of revolution, with a jacket surface with at least one peripheral ring which is made seamless at least in the peripheral direction and which is embossed in the step-and-repeat process. Furthermore, the invention relates to a method and a device for producing such an embossing roll for continuous embossing of nanostructures as well as a method for producing such a nanostructure die and a method for producing an embossing substrate. | 08-21-2014 |