Patent application number | Description | Published |
20080218974 | Method and Structure for Connecting, Stacking, and Cooling Chips on a Flexible Carrier - A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary fold having a counterclockwise fold and a clockwise fold as seen from the side. A first chip back surface of a first chip and a second chip back surface of a second chip are in thermal contact with a particular heat sink fin, that is, sharing the same heat sink fin. Thermal contact between the chips and heat sink fins is effected by force, by thermally conducting adhesive, by thermal grease, or by a combination of force and/or thermally conducting adhesive and/or thermal grease. | 09-11-2008 |
20080270100 | Method, Apparatus, and Computer Program Product for Implementing Optimized Channel Routing With Generation of FIR Coefficients - A method, apparatus and computer program product implement optimized channel routing in an electronic package design. Electronic package physical design data are received. A physical design including a netlist including a plurality of nets is generated. Finite impulse response (FIR) driver coefficients are determined for each net in the netlist from simulation with generation of impulse responses of the netlist. | 10-30-2008 |
20080270968 | APPARATUS, AND COMPUTER PROGRAM PRODUCT FOR IMPLEMENTING VERTICALLY COUPLED NOISE CONTROL THROUGH A MESH PLANE IN AN ELECTRONIC PACKAGE DESIGN - A method, apparatus and computer program product are provided for implementing vertically coupled noise control through a mesh plane in an electronic package design. Electronic package physical design data are received. Instances of vertically coupled noise in the electronic package physical design data are identified. The identified instances of vertically coupled noise are quantified. Then the electronic package physical design data are modified to limit the vertically coupled noise. | 10-30-2008 |
20090138832 | IMPLEMENTING ENHANCED WIRING CAPABILITY FOR ELECTRONIC LAMINATE PACKAGES - Structures and a computer program product are provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations. | 05-28-2009 |
20090273098 | Enhanced Architectural Interconnect Options Enabled With Flipped Die on a Multi-Chip Package - A particular chip is designed having a first variant (front side connected chip) of the chip and a second variant (back side connected chip). The first variant of the chip is attached to a carrier. The second variant of the chip is attached to the carrier inverted relative to the first variant of the chip. The first and second variants of the chip are attached to the carrier such that a vertical surface (side) of the first variant of the chip faces a corresponding vertical surface of the second variant of the chip. A circuit on the first variant of the chip is electrically connected to a corresponding circuit on the second variant of the chip. | 11-05-2009 |
20090300291 | Implementing Cache Coherency and Reduced Latency Using Multiple Controllers for Memory System - A method and apparatus implement cache coherency and reduced latency using multiple controllers for a memory system, and a design structure is provided on which the subject circuit resides. A first memory controller uses a first memory as its primary address space, for storage and fetches. A second memory controller is also connected to the first memory. A second memory controller uses a second memory as its primary address space, for storage and fetches. The first memory controller is also connected to the second memory. The first memory controller and the second memory controller, for example, are connected together by a processor communications bus. A request and send sequence of the invention sends data directly to a requesting memory controller eliminating the need to re-route data back through a responding controller, and improving the latency of the data transfer. | 12-03-2009 |
20090300411 | Implementing Redundant Memory Access Using Multiple Controllers for Memory System - A method and apparatus implement redundant memory access using multiple controllers for a memory system, and a design structure on which the subject circuit resides are provided. A first memory controller uses a first memory and a second memory controller uses the second memory as its respective primary address space, for storage and fetches. The second memory controller is also connected to the first memory. The first memory controller is also connected to the second memory. The first memory controller and the second memory controller, for example, are connected together by a processor communications bus. When one of the first memory controller or the second memory controller fails, then the other memory controller is notified. The other memory controller takes control of the memory for the failed controller, using the direct connection to that memory, and maintains coherence of both the first memory and second memory. | 12-03-2009 |
20100024202 | Enhanced On-Chip Inductance Structure Utilizing Silicon Through Via Technology - This invention utilizes silicon through via technology, to build a Toroid into the chip with the addition of a layer of magnetic material such as Nickel above and below the T-coil stacked multi-ring structure. This allows the connection between the inner via and an array of outer vias. This material is added on a BEOL metal layer or as an external coating on the finished silicon. Depending on the configuration and material used for the via, the inductance will increase approximately two orders of magnitude (e.g., by utilizing a nickel via core). Moreover, a ferrite material with proper thermal conduction properties is used in one embodiment. | 02-04-2010 |
20100191894 | Digital Data Architecture Employing Redundant Links in a Daisy Chain of Component Modules - A communications architecture utilizes modules arranged in a daisy-chain, each module supporting multiple input and output ports. Point-to-point links are arranged so that a first output link of each of multiple modules connects to the next module in the chain, and a second output link connects to a module after it, and inputs arranged similarly, so that any single module can be by-passed in the event of malfunction. Multiple chains may be cross-linked and/or serviced by hubs or chains of hubs. Preferably, the redundant links are used in a non-degraded operating mode to provide higher bandwidth and/or reduced latency of communication. The exemplary embodiment is a memory subsystem in which the modules are buffered memory chips. | 07-29-2010 |
20100271046 | IMPLEMENTING AT-SPEED WAFER FINAL TEST (WFT) WITH COMPLETE CHIP COVERAGE - A method, an apparatus and a computer program product are provided for implementing At-Speed Wafer Final Test (WFT) with total integrated circuit chip coverage including high speed off-chip receiver and driver input/output (I/O) circuits. An integrated circuit (IC) chip includes off-chip Controlled Collapse Chip Connection (C4) nodes and a driver and a receiver of the off-chip receiver and driver input/output (I/O) circuits connected to respective off-chip C4 nodes. Through Silicon Vias (TSVs) are added to the connections of the driver and the receiver and the respective off-chip C4 nodes to a backside of the IC chip. A metal wire is added to the IC chip backside connecting the TSVs and creating a connection path between the driver and the receiver that is used for the at-speed WFT testing of the I/O circuits. | 10-28-2010 |