Patent application number | Description | Published |
20080211636 | Radio frequency data communications device - A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range. | 09-04-2008 |
20090046144 | METHOD AND APPARATUS FOR OPTIMIZING LENS ALIGNMENT FOR OPTICALLY SENSITIVE DEVICES AND SYSTEMS WITH OPTIMIZED LENS ALIGNMENT - Non-symmetrically located lenses are employed with semiconductor devices comprising optically active regions which are non-symmetrically located on a surface thereof The optical axes of the lenses are aligned with the centers of the optically active regions. Wafer-level assemblies of semiconductor devices and lenses may be fabricated, mutually secured with the non-symmetrically placed lenses aligned over the non-symmetrically placed optically active regions, and singulated to form packages, such as image sensor packages. Related methods, and systems incorporating devices with non-symmetrically placed optically active regions and aligned lenses are also disclosed. | 02-19-2009 |
20090160030 | METHODS FOR FORMING THROUGH WAFER INTERCONNECTS AND STRUCTURES RESULTING THEREFROM - The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed. | 06-25-2009 |
20110117739 | METHODS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURES - The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed. | 05-19-2011 |
20110151621 | MICROFEATURE WORKPIECES HAVING INTERCONNECTS AND CONDUCTIVE BACKPLANES, AND ASSOCIATED SYSTEMS AND METHODS - Microfeature workpieces having interconnects and conductive backplanes and associated systems and methods are disclosed herein. One such device includes a semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry. The device also includes electrically conductive interconnects extending through at least a portion of the semiconductor substrate and electrically coupled to corresponding terminals. The device further includes a conductive backplane assembly having a conductive layer at a back side of the semiconductor substrate. One or more of the interconnects are electrically coupled to the conductive layer at the back side of the semiconductor substrate. | 06-23-2011 |
20110253792 | FLEXIBLE RFID LABEL - An RFID tag includes a base having at least one fold formed therein. An integrated circuit is formed on the base. At least one antenna segment extends from the integrated circuit and crosses the fold. When the fold is creased, a portion of the antenna segment on one side of the fold is aligned to be orthogonal to a portion of the antenna segment on the other side of the fold. | 10-20-2011 |
20120223816 | RFID INTERROGATOR WITH ADJUSTABLE SIGNAL CHARACTERISTICS - A radio frequency identification (RFID) interrogator housed in a portable platform that includes at least one antenna, a transceiver for transmitting and receiving a radio frequency (RF) signal through the antenna, and a controller in communication with the transceiver for adjusting power and direction of the transmitted RF signal. The controller can be configured to adjust the antenna orientation, and can also selectively activate and deactivate one or more antennas. | 09-06-2012 |
20120313248 | SEMICONDUCTOR DEVICE STRUCTURES - The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed. | 12-13-2012 |
20130030881 | METHODS AND APPARATUS FOR PERFORMING FINANCIAL TRANSACTIONS - A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range. | 01-31-2013 |
20130228922 | SEMICONDUCTOR DEVICE STRUCTURES AND PRINTED CIRCUIT BOARDS COMPRISING SEMICONDUCTOR DEVICES - The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed. | 09-05-2013 |
20130295766 | THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS - A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths. | 11-07-2013 |
20130341416 | FLEXIBLE RFID LABEL - An RFID tag includes a base having at least one fold formed therein. An integrated circuit is formed on the base. At least one antenna segment extends from the integrated circuit and crosses the fold. When the fold is creased, a portion of the antenna segment on one side of the fold is aligned to be orthogonal to a portion of the antenna segment on the other side of the fold. | 12-26-2013 |
20140035730 | METHOD FOR ELECTRONIC TRACKING OF UNITS ASSOCIATED WITH A BATCH - A batch comprises separate units of objects that are physically joined together. RFID tags are attached to each of the units and to the batch. The codes stored in the RFID tags are electrically associated with one another in the database. | 02-06-2014 |