Manikam
Govindasamy Manikam, Karnataka IN
Patent application number | Description | Published |
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20110020871 | Process for the Preparation of Insulin Conjugates - The invention claims a process for making an insulin-oligomer conjugate IN-105. IN-105 precursor having formula G-A-V-R-[B-Chain]-R-D-A-D-D-R-[A-Chain] is cloned and expressed in | 01-27-2011 |
Vemal Raja Manikam, Shah Alam MY
Patent application number | Description | Published |
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20100279471 | UNDERFILL DISPENSING SYSTEM FOR INTEGRATED CIRCUITS - A system for dispensing an underfill material between an integrated circuit (IC) chip and a substrate includes a platform at which the underfill material is supplied. The IC chip and the substrate are mounted at the periphery of the platform. The platform rotates and facilitates the movement of the underfill material toward the IC chip and the substrate. The system further includes a Bernoulli tube that is located proximate to the IC chip and the substrate. The Bernoulli tube generates a low pressure in the proximity of the IC packages. The low pressure facilitates the dispensing of the underfill material between the IC chip and the substrate. | 11-04-2010 |
20110121468 | SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME - An improved semiconductor package includes thermal tape placed over a top side of a die that is attached to a substrate with an underfill material. The tape extends to the substrate. The tape deforms with heat and entraps the die and underfill material. Air bubbles are trapped between the tape and the die and underfill material. The tape can be weighted and lined with an adhesive material. The tape aids in preventing the die from cracking due to mishandling. | 05-26-2011 |
20120032167 | SEMICONDUCTOR PACKAGE AND METHOD OF TESTING SAME - A packaged integrated circuit includes a substrate having a wire layout pattern and a solder mask layer. An integrated circuit attached to a surface of the substrate is electrically connected to the wire layout pattern. An encapsulation material covers at least the integrated circuit and the solder mask layer. One or more crack seal rings are disposed on the solder mask surface. The crack seal rings are copper traces with terminals that allow current to be applied to the traces. A broken trace (open circuit condition) is indicative of a crack in the package. Thus, electrical testing is performed to detect physical defects. | 02-09-2012 |
Vermal Raja Manikam, Shah Alam MY
Patent application number | Description | Published |
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20110115125 | METHOD AND APPARATUS FOR MOLDING SUBSTRATE - A method for encapsulating a substrate includes placing a hardened encapsulant material in a container. The encapsulant material is then heated and stirred until it is in a liquid or gel state. The liquid encapsulant material is held in the container in a vacuum state and dispensed over semiconductor dies along a guide, which allows the liquid encapsulant material to cool slightly before it covers a die. | 05-19-2011 |
Vittal Raja Manikam, Shah Alam MY
Patent application number | Description | Published |
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20100279471 | UNDERFILL DISPENSING SYSTEM FOR INTEGRATED CIRCUITS - A system for dispensing an underfill material between an integrated circuit (IC) chip and a substrate includes a platform at which the underfill material is supplied. The IC chip and the substrate are mounted at the periphery of the platform. The platform rotates and facilitates the movement of the underfill material toward the IC chip and the substrate. The system further includes a Bernoulli tube that is located proximate to the IC chip and the substrate. The Bernoulli tube generates a low pressure in the proximity of the IC packages. The low pressure facilitates the dispensing of the underfill material between the IC chip and the substrate. | 11-04-2010 |
20110115125 | METHOD AND APPARATUS FOR MOLDING SUBSTRATE - A method for encapsulating a substrate includes placing a hardened encapsulant material in a container. The encapsulant material is then heated and stirred until it is in a liquid or gel state. The liquid encapsulant material is held in the container in a vacuum state and dispensed over semiconductor dies along a guide, which allows the liquid encapsulant material to cool slightly before it covers a die. | 05-19-2011 |
20110121468 | SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME - An improved semiconductor package includes thermal tape placed over a top side of a die that is attached to a substrate with an underfill material. The tape extends to the substrate. The tape deforms with heat and entraps the die and underfill material. Air bubbles are trapped between the tape and the die and underfill material. The tape can be weighted and lined with an adhesive material. The tape aids in preventing the die from cracking due to mishandling. | 05-26-2011 |
Vittal Raja Manikam, Selangor MY
Patent application number | Description | Published |
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20160005687 | RADIO FREQUENCY POWER DEVICE - An electronic RF power device includes a transistor chip, a device input terminal and a device output terminal. Further, the electronic RF power device includes an output impedance transformation circuit, an output contact clip bonded to the transistor chip and to the output device terminal and at least one bond wire bonded to the output impedance transformation circuit and to the transistor chip. | 01-07-2016 |