Patent application number | Description | Published |
20080201009 | DETERMINING TOOL SET MATCHING USING PRODUCTION DATA - A method, system and computer program product for determining matching of a tool set in a production process are disclosed. According to an embodiment, a method for determining matching of a tool set in a production process comprises: selecting a measurement step within the production process, a subset of tools of the tool set being used in the measurement step; collecting production data for each tool of the subset, the production data being related to a process feeder tool; generating a weighted average of the production data for each tool of the subset; and analyzing weighted averages of all tools of the subset using a matching standard to determine matching of the subset. | 08-21-2008 |
20080223118 | SCANNING PROBE APPARATUS WITH IN-SITU MEASUREMENT PROBE TIP CLEANING CAPABILITY - A scanning probe apparatus includes a measurement probe tip and an auxiliary probe tip that is movably positionable with respect to the measurement probe tip. The measurement probe tip and the auxiliary probe tip may be positioned juxtaposed, so that an electrical discharge may be effected between the measurement probe tip and auxiliary probe tip to remove a contaminant from the measurement probe tip. The auxiliary probe tip may be integral with a sample support plate within the scanning probe apparatus. | 09-18-2008 |
20080258055 | CHARGED BEAM APPARATUS AND METHOD THAT PROVIDE CHARGED BEAM AERIAL DIMENSIONAL MAP - A charged beam apparatus, such as an electron microscopy apparatus, and a method for determining an aerial dimensional map of a charged beam within the charged beam apparatus, each use a test structure that includes a feature located upon a substrate. One of the feature and the substrate is conductive and the other of the feature and the structure is non conductive. The charged beam within the charged beam apparatus is scanned in a plurality of non-parallel linear directions with respect to the substrate and the feature to provide a corresponding plurality of current versus position response curves from which may be determined the aerial dimensional map of the charged beam within the charged beam apparatus. | 10-23-2008 |
20080316471 | DETERMINING AZIMUTH ANGLE OF INCIDENT BEAM TO WAFER - A method, system and computer program product for determining an Azimuth angle of an incident beam to a wafer are disclosed. A method comprises: using the incident beam to make a first set of measurements of calibration targets of a first set of grating angles that are different than one another; analyzing the first set of measurements to determine an reference grating angle which corresponds to a grating line to which the incident beam has a practically zero Azimuth angle; and determining the Azimuth angle of the incident beam to the wafer using the determined reference grating angle. | 12-25-2008 |
20090002721 | WAFER AND STAGE ALIGNMENT USING PHOTONIC DEVICES - A position sensing system for an optical metrology system, includes a plurality of photonic devices distributed on a carrier for providing a photonic response when interrogated with a measuring light, wherein a collective photonic response from the plurality indicates the position of the carrier. A method and an optical metrology system are also provided. | 01-01-2009 |
20090009763 | FLIPPING STAGE ARRANGEMENT FOR REDUCED WAFER CONTAMINATION CROSS SECTION AND IMPROVED MEASUREMENT ACCURACY AND THROUGHPUT - A sample stage for performing measurements using an optical metrology system includes at least one sample section for retention of a sample, and components for controlling orientation of the sample section with relation to the optical metrology system. A method and a computer program product are provided. | 01-08-2009 |
20090021236 | Alignment Correction System and Method of Use - A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit. | 01-22-2009 |
20090027660 | OPTICAL SPOT GEOMETRIC PARAMETER DETERMINATION USING CALIBRATION TARGETS - A method, system and computer program product for determining a geometric parameter of an optical spot of a light beam are disclosed. A method comprises: providing a calibration target, the calibration target including a systematic variation in a parameter; measuring the calibration target with respect to the systematic variation using the light beam to obtain a plurality of measurements; and analyzing the measurements and the systematic variation to determine the geometric parameter of the optical spot. | 01-29-2009 |
20090182529 | DETERMINING SIGNAL QUALITY OF OPTICAL METROLOGY TOOL - A method, system and computer program product for determining a signal quality of an optical metrology tool are disclosed. A method comprises: collecting a data pool regarding measurements of a target made by the optical metrology tool, the data pool including a wavelength of incident light used in a measurement; and statistically analyzing the data pool to obtain a wavelength specific signal quality of the optical metrology tool. | 07-16-2009 |
20090185183 | MONITORING STAGE ALIGNMENT AND RELATED STAGE AND CALIBRATION TARGET - Methods, apparatuses and systems for monitoring a stage alignment in a processing system are disclosed. A method for monitoring a stage alignment in a processing system may include providing a calibration target on a surface of the stage; measuring an angle of incident of a light beam to the calibration target; and monitoring the stage alignment based on the determined angle of incidence. | 07-23-2009 |
20090186427 | CHARACTERIZING FILMS USING OPTICAL FILTER PSEUDO SUBSTRATE - A system and method of characterizing a parameter of an ultra thin film, such as a gate oxide layer. A system is disclosed that includes a structure having a pseudo substrate positioned below an ultra thin film, wherein the pseudo substrate includes an optical mirror for enhancing an optical response; and a system for characterizing the ultra thin film by applying a light source to the ultra thin film and analyzing the optical response. | 07-23-2009 |
20090312982 | ALIGNMENT CORRECTION SYSTEM AND METHOD OF USE - A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit. | 12-17-2009 |
20130238112 | ALIGNMENT CORRECTION SYSTEM AND METHOD OF USE - A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. | 09-12-2013 |
20130245993 | ALIGNMENT CORRECTION SYSTEM AND METHOD OF USE - A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. | 09-19-2013 |