Lin, Chiayi
Che-Ching Lin, Chiayi TW
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20120024451 | Kit and Method for Customization of Golf Balls - The present disclosure provides to a kit for customizing and recycling golf balls, and related methods. The kit includes one or more sets of golf ball covers, may include one or more sets of golf ball cores, and may further include a golf ball cover removal device and a golf ball cover application device. A golfer may select a golf ball cover from a set based on a desired play characteristic. For example, the golfer may select a relatively hard cover from a set of golf ball covers having different hardness values. The golfer may then apply the selected golf ball cover to a golf ball core using the golf ball cover application device. The core may be selected from a set of cores in the kit, or the core may be obtained from a recycled golf ball using a golf ball cover removal device. | 02-02-2012 |
20130072323 | Method Of Golf Ball Compression Molding - A method of making a golf ball may include forming a spherical inner core layer, forming two hemispherical shells in a compression mold, and assembling the two hemispherical shells as an outer core layer around the inner core layer. In addition, the method may include curing the two hemispherical shells to form a unitary outer core layer by compression molding the shells around the inner core layer at a temperature that causes the inner core layer to melt. | 03-21-2013 |
20130085015 | Golf Ball Having Relationships Among The Densities Of Various Layers - A four piece golf ball includes several relationships among the values of the densities of its layers. Namely, the sum of the density of the inner core and the outer core is at least 2 g/cm | 04-04-2013 |
20130244811 | Golf Ball Having Relationships Among The Densities Of Various Layers - A four piece golf ball includes several relationships among the values of the densities of its layers. Namely, the sum of the density of the inner core and the outer core is at least 2 g/cm | 09-19-2013 |
20140054819 | METHOD OF GOLF BALL COMPRESSION MOLDING - A method of making a golf ball may include forming a spherical inner core layer, forming two hemispherical shells in a compression mold, and assembling the two hemispherical shells as an outer core layer around the inner core layer. In addition, the method may include curing the two hemispherical shells to form a unitary outer core layer by compression molding the shells around the inner core layer at a temperature that causes the inner core layer to melt. | 02-27-2014 |
Chen-Wei Lin, Chiayi TW
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20150291569 | PROCESS FOR THE PREPARATION OF beta-C-ARYLGLUCOSIDES - The present application discloses a stereoselective process for the preparation of β-C-arylglucosides that does not require the use of conventional carbohydrate protecting groups. | 10-15-2015 |
Chien-Ho Lin, Chiayi TW
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20150258327 | CRANIAL ELECTROTHERAPY STIMULATION DEVICE - A cranial electrotherapy stimulation (CES) device includes a head support, a control unit configured to provide a stimulating current, and a primary arm module. The primary arm module includes a primary arm and an electrode unit. The primary arm is pivotally connected to the head support and is longitudinally extendible. The electrode unit is disposed at the primary arm and includes an electrode that is electrically coupled to the control unit and that forms a path for transmission of the stimulating current to a stimulating point of a subject when the electrode is placed in direct contact with the stimulating point. | 09-17-2015 |
20150258329 | ELECTRODE - An electrode configured for use in a direct current electrical stimulation system, which includes a control circuit configured to provide a stimulating current, includes a main body and a plurality of pin members. The main body is electrically coupled to the control circuit to receive the stimulating current therefrom and includes a base wall and a surrounding wall cooperating with the base wall to define a receiving space for receiving an electrically conductive liquid. The pin members extend from the main body, are in fluid communication with the receiving space, and permit delivery of the electrically conductive liquid to a subject when the pin members are placed in direct contact with the subject. | 09-17-2015 |
Ta-Hsuan Lin, Chiayi TW
Patent application number | Description | Published |
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20110156191 | PACKAGE STRUCTURE FOR A CHIP AND METHOD FOR FABRICATING THE SAME - The embodiment provides a package structure for a chip and a method for fabricating the same. The package structure for the chip includes a chip having a substrate and a bonding pad structure. The chip has an upper surface and a lower surface. An upper packaging layer covers the upper surface of the chip. A spacer layer is between the upper packaging layer and the chip. A conductive path is electrically connected to the bonding pad structure. An anti-reflective layer is disposed between the spacer layer and the upper packaging layer. An overlapping region is between the anti-reflective layer and the spacer layer. | 06-30-2011 |