Patent application number | Description | Published |
20090255659 | PROTECTIVE CAP FOR THERMAL GREASE OF HEAT SINK - A protective cap for use with a heat sink, includes a cover plate for enclosing thermal grease on the heat sink, and a plurality of strengthening ribs positioned on the cover plate. The strengthening ribs resist the heat sink to prevent the thermal grease from being pressed against the cover plate. | 10-15-2009 |
20090262502 | HEAT SINK - A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange. | 10-22-2009 |
20100319886 | HEAT DISSIPATING ASSEMBLY - A heat dissipating assembly includes a heat exchanger and an air duct. The heat exchanger includes a plurality of fins aligned in a row, and the fins cooperatively define a plurality of heat dissipating channels. A guiding slot is defined in the heat exchanger. The air duct defines a passage. A positioning hook extends from the air duct and engages in the guiding slot to so that the air duct passage and are aligned with the heat dissipating channels so that an air flow is capable of passing through the air duct passage via the heat dissipating channels. | 12-23-2010 |
20110073287 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a heat sink and a heat sink cover. The heat sink includes a base and a plurality of fins extending from the base. Each of the plurality of fins includes a corner projection. The heat sink cover covers the corner projections of the heat sink. | 03-31-2011 |
20110085298 | COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT - A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole. | 04-14-2011 |
20110090636 | HEAT DISSIPATING SYSTEM - A heat dissipating system includes an enclosure, a first fan module, a second fan module of a computer power source. The enclosure has a front panel, a rear panel parallel to the front panel, a side panel, and a top panel. The rear panel defines an output vent therein. A disk drive module is disposed on the front panel and near the top panel. A motherboard with a CPU is disposed on the side panel. The first fan module is configured to dissipate heat generated by the CPU. The second fan module is placed on the rear panel and is aligned with the output vent of the rear panel. The top panel defines a plurality of airflow holes corresponding to the disk drive module. The plurality of the airflow holes is capable of allowing air to flow to the disk drive module for heat dissipating. | 04-21-2011 |
20110090641 | COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT - A computer system includes a chassis, a motherboard, a heat sink and an airflow guiding duct. The chassis includes a chassis bottom wall, a first chassis sidewall, and a second chassis sidewall. The first chassis sidewall defines a first ventilation hole. The second chassis sidewall defines a second ventilation hole. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The airflow guiding duct is configured to guide airflow flowing from the second ventilation to the first ventilation hole. A fan is received inside the airflow guiding duct. | 04-21-2011 |
20110149514 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a heat sink and a fan. The heat sink includes a base configured to contact a heat generating element, and a plurality of fins extending from the base. The base defines an axis. Each fin includes an end portion extending about the axis of the base in one of a clockwise direction and an anti-clockwise direction. The fan is placed on the heat sink. The fan defines a first opening and a second opening adjacent to the base. The fan is operating and pivoted about the axis of the base in the other one of a clockwise direction and an anti-clockwise direction. | 06-23-2011 |
20120080167 | HEAT DISSIPATING APPARATUS - A heat dissipating apparatus includes a base and a heat pipe. A plurality of fins partially overlaps the base; the heat pipe comprising a first body, a second body and a third body, the second body connected between the first body and the third body; the first body is secured between the plurality of fins and the base, the third body is secured to the plurality of fins, and the second body is located in a first corner between the base and the plurality of fins. | 04-05-2012 |
20120087790 | FAN MOUNTING ASSEMBLY - A fan mounting assembly includes a mounting tray and a fan. The mounting tray includes a base plate and at least one mating block protruding from the base plate. The fan includes a housing and a blade accommodated in the housing. The blade is configured to blow air from a first side of the fan to a second side of the fan. The fan having a mating surface located at the second side and mated with the at least one mating block. | 04-12-2012 |
20120099270 | HEAT DISSIPATING APPARATUS AND ELECTRONIC DEVICE WITH HEAT DISSIPATING APPARATUS - A heat dissipating apparatus includes a first fan and a second fan. A clipping portion with a block is located on the first fan. A receiving hole is defined in the second fan, and two first retaining panels and a second retaining panel extend from the second fan. The two first retaining panels are substantially parallel to each other and perpendicular to the second retaining panel. The clipping portion is located between the two retaining panels and abuts the first retaining panel, and the block is engaged in the receiving hole. | 04-26-2012 |
20120104910 | ELECTRONIC DEVICE - An electronic device includes a chassis and a bracket. An opening is defined in the chassis. The opening has a first side edge and a second side edge located at opposite sides thereof. A length of the second side edge is greater than that of the first side edge. The bracket is mounted in the opening. The bracket includes a pair of first hooks and a pair of second hooks at opposite sides thereof. A distance between the pair of first hooks corresponds to the length of the first side edge. A distance between the pair of second hooks corresponds to the length of the second side edge. The pair of first hooks is engaged into the opening along the first side edge. The pair of second hooks is engaged into the opening along the second side edge. | 05-03-2012 |
20120106080 | MOUNTING ASSEMBLY FOR HEAT DISSIPATING DEVICE - A mounting assembly includes a circuit board, a securing member and a heat dissipating device. A retainer is located on the circuit board. The securing member includes a positioning portion and a claw connected to the positioning portion. The heat dissipating device includes a base attached to the circuit board and a number of fins perpendicularly located on the base. The number of fins defines a number of first air paths and a number of second air paths substantially perpendicular to the number of first air paths. The positioning portion is received in at least one of the number of first air paths and at least one of the number of second air paths, and the claw is engaged with the retainer. | 05-03-2012 |
20120112678 | FAN SPEED CONTROL CIRCUIT - A fan speed control circuit includes a first fan, a second fan, a first temperature sensor, a second temperature sensor, a PWM regulator, and a driving module. The first temperature sensor senses a temperature of the first component to generate a first temperature signal. The second temperature sensor senses a temperature of a second component to generate a second temperature signal. The PWM regulator is connected to the first temperature sensor and the second temperature sensor. The PWM regulator generates a first PWM signal according to the first temperature signal and generates a second PWM signal according to the second temperature signal. The driving module is connected to the PWM regulator. The driving module generates a first driving voltage provided to the first fan according to the first PWM signal. The driving module also generates a second driving voltage provided to the second fan according to the second PWM signal. | 05-10-2012 |
20120140405 | HEAT DISSIPATION SYSTEM - A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes. | 06-07-2012 |
20120155012 | MOUNTING APPARATUS FOR DATA STORAGE DEVICE - A mounting apparatus for mounting a data storage device, includes a drive bracket and a slider mounted on the data storage device. The drive bracket includes a side piece in which a sliding groove is located. The sliding groove includes a first end and a second end. The second end is adjacent to an edge of the side piece. The first end is located on the side piece. A guiding surface is located at the first end. The guiding surface inclines from an inner surface of the side piece to an outer surface of the side piece. The slider slides in the sliding groove from the second end to the first end. The slider abuts the guiding surface. The guiding surface retains the slider at the first end. | 06-21-2012 |
20120161595 | ELECTRONIC DEVICE ENCLOSURE - An electronic device enclosure includes a plate, a securing member, a fan module, and a security apparatus. The plate defines an air vent area and a first through hole. The first through hole is located above the air vent area. The securing member is mounted on an inner side of the plate. The securing member is located above the air vent area. The securing member defines an engaging hole and a second through hole, which is in alignment with the first through hole. The fan module includes a clasp. The fan module is aligned to the air vent area. The clasp engages in the engaging hole to mount the fan module on the securing hole. The security apparatus includes a locking piece and a cord. The locking piece is mounted in the first through hole and the second through hole, and the cord is configured to fasten to an unmovable object. | 06-28-2012 |
20120171012 | FAN MODULE - A fan module includes a fan, a temperature sensor, and a shield. The temperature sensor includes a cable. The shield is mounted on the fan. The shield includes a clip. The clip includes two elastic pieces. A restricting slot and a receiving space are located between the two elastic pieces. The cable has an outer diameter which is wider than the restricting slot but narrower than the receiving space. The two elastic pieces can be elastically deformed to expand the restricting slot so that the cable can be placed in the receiving channel via the restricting slot. | 07-05-2012 |
20120181000 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly includes a heat sink and a fan. The heat sink includes a plurality of fins. The plurality of fins is parallel with each other. Each of the plurality of fins includes two side faces. Each side face is waved. An air channel is located between two adjacent side faces of two adjacent fins. The air channel includes a plurality of wide portions and a plurality of narrow portions interlaced with the plurality of wide portions. The fan is located on a side of the air channel. The fan is adapted to drive air flowing fast in the plurality of narrow portions of the air channel and flowing slow in the plurality of wide portions of the air channel. | 07-19-2012 |
20120188716 | HEAT DISSIPATION SYSTEM - A heat dissipation system includes a base plate, a side plate perpendicularly to the base plate, a motherboard attached on the base plate, a first fan, and a second fan fixed on the side plate facing to the heat sink. The motherboard has a first heat source and a second heat source mounted thereon, a heat sink positioned on the first heat source, and a fan bracket mounted on the heat sink. The first fan is positioned on the fan bracket. A rotating axis of the first fan is perpendicular to that of the second fan. | 07-26-2012 |
20120188722 | HEAT SINK ASSEMBLY - A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance. | 07-26-2012 |
20120215956 | COMPUTING DEVICE WITH INDEPENDENT DUAL CPUS - A computing device includes a first motherboard and a second motherboard perpendicularly attached to the first motherboard. The first motherboard includes a first CPU module and a plurality of first peripheral component interconnect (PCI) sockets. The second motherboard includes a second CPU module and a plurality of second PCI sockets. The plurality of first PCI sockets is located perpendicularly to both motherboards. The plurality of second PCI sockets includes at least one PCI socket that is obliquely oriented relative to the first motherboard. | 08-23-2012 |
20120222841 | HEAT DISSIPATION SYSTEM - A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area. | 09-06-2012 |