Leal, US
Cecilia Maria Das Neves Barbosa Leal, Champaign, IL US
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20140323968 | MATERIALS, ELECTRONIC SYSTEMS AND MODES FOR ACTIVE AND PASSIVE TRANSIENCE - The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level embodiments of transient electronics are provided. | 10-30-2014 |
David Leal, San Francisco, CA US
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20150195724 | METHOD AND APPARATUS FOR IMPLEMENTING A TASK PLAN INCLUDING TRANSMISSION OF ONE OR MORE TEST MESSAGES - A method, computing device and computer program product are provided in order to implement a test plan in an efficient manner. In the context of a method, a plurality of test messages from each of a plurality of different source systems are stored. The plurality of test messages may include test messages to be captured in an electronic health record. The method constructs a test plan. The test plan identifies an end point. The test plan also includes one or more test messages that have been previously stored and respective anticipated outcomes at the end point following transmission of the test messages. The method also includes transmitting the test messages of the test plan and receiving feedback regarding the outcome following transmission of the test messages of the test plan to the end point. The method also includes determining whether the test plan was successfully executed based upon the feedback. | 07-09-2015 |
David Alberto Leal, Fresno, CA US
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20130329844 | METHOD FOR PRODUCING HELIUM-3 USING A HYDROGENATED LATTICE (RED FUSION) - Helium-3 (also known as He-3 or | 12-12-2013 |
Eric Leal, Winston - Salem, NC US
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20140137436 | Footwear with interchangeable heel components - Footwear having interchangeable heels, includes: (a) a top component having a back section, a middle, a front and an upper section for encompassing a foot, the top component having an underside shape and contour, and having at least two separate connect mechanisms for connection to a bottom component; (b) a bottom component having a having back, a middle, and a front section, the bottom component having a topside shape and contour sufficiently coinciding with the top component underside shape and contour so as to nest with one another, and having at least two separate connect mechanisms corresponding to the at least two separate mechanisms of the top component for connection to it; and (c) at least one locking mechanism. | 05-22-2014 |
Fernando Leal, Reno, NV US
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20150019940 | SYSTEM AND METHOD FOR THE CREATION OF LANGUAGE-LED, COLLABORATIVE MULTIMEDIA DOCUMENTS - A system and related method are disclosed for the creation of language-led collaborative multimedia documents. The method includes receiving a first user's identification of at least one term, receiving an instruction from the first user or a second user linking that at least one term to an exhibit, and displaying the term to other users with a representation of the exhibit that, when selected, causes the exhibit to display. The first user can control who is invited to link an exhibit to a given term, and who can see which portions of a completed document, or exhibits attendant thereto. | 01-15-2015 |
George Henry Leal, Mason, OH US
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20110054435 | Fastening System Having Multiple Engagement Orientations - A fastening system has a first fastening member and a second fastening member. The first member has a retaining element and a substrate element. The retaining element includes a proximal edge and a distal edge and is attached to the substrate element along a line of attachment. The second fastening member has an inboard portion, an outboard portion, and an elongated opening disposed between the inboard and outboard portions. The elongated opening is configured such that at least part of the retaining element is capable of passing through the elongated opening when the retaining element is in a first orientation and when the retaining element is in a second orientation. | 03-03-2011 |
George Henry Leal, Hamilton, OH US
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20100170052 | Personal Hygiene Devices, Systems and Methods - A personal hygiene device includes a personal hygiene implement and a first position member. The personal hygiene device is capable of providing the user with feedback which can assist the user in his/her personal hygiene routines. | 07-08-2010 |
George R. Leal, Cedar Park, TX US
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20090271980 | METHOD FOR CONTROLLING WARPAGE IN REDISTRIBUTED CHIP PACKAGING PANELS - A method is disclosed for controlling warpage in an integrated electronic panel assembly including a plurality of die embedded within an encapsulant. The method comprises determining a number of build-up layers required for the integrated panel assembly. Each build-up layer contributes an amount of concavity to the integrated electronic panel assembly. A level of global convex warpage on the integrated panel assembly is then predicted, wherein the global convex warpage is provided by the presence of an embedded ground plane (EGP) alone within the integrated panel assembly and in the absence of any build-up layers. The embedded ground plane includes openings therein for accepting at least one die within a corresponding opening and it contributes a fixed amount of global convex warpage. An amount of local convex warpage to be introduced into the integrated electronic panel assembly is then determined, which together with the fixed amount of global convex warpage provides a combined convex warpage to the integrated electronic panel assembly. Accordingly, the global and local convex warpage counteract the concavity to be introduced subsequently by a build-up layer processing and is sufficient to enable subsequent planar processing of a completed integrated electronic panel assembly. | 11-05-2009 |
20100148357 | METHOD OF PACKAGING INTEGRATED CIRCUIT DIES WITH THERMAL DISSIPATION CAPABILITY | 06-17-2010 |
20110217814 | METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE - Methods for forming electronic assemblies are provided. A device substrate having a plurality of electronic components embedded therein is provided. The device substrate is attached to a carrier substrate using an adhesive material. A plurality of cuts are formed through the device substrate to divide the device substrate into a plurality of portions. Each of the plurality of portions includes at least one of the electronic components. A force is applied to each of the plurality of portions in a direction away from the carrier substrate to remove the plurality of portions from the carrier substrate. | 09-08-2011 |
20120021565 | METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE - A method is used to form a packaged semiconductor device. A semiconductor device, which has an active surface, is placed in an opening of a circuit board. The circuit board has a first major surface and a second major surface having the opening, first vias that extend between the first major surface and the second major surface, first contact pads terminating the vias at the first major surface, and second contact pads terminating the vias at the second major surface. A dielectric layer is applied over the semiconductor device and the second major surface of the circuit board. An interconnect layer is formed over the dielectric layer. The interconnect layer has second vias electrically connected to the second contact pads, third vias that are electrically connected to the active surface of the semiconductor device, an exposed surface, and third contact pads at the exposed surface. | 01-26-2012 |
20120329212 | RECOVERY METHOD FOR POOR YIELD AT INTEGRATED CIRCUIT DIE PANELIZATION - A method for making a packaged integrated circuit is provided. The method includes making a first panel of encapsulated die. In some embodiments, if a threshold number of die are not positioned in proper positions in the first panel, the die are separated from the first panel. The separated die are subsequently encapsulated in other panels of encapsulated die. Conductive interconnects can be formed over the other panels. The other panels are then separated into integrated circuit packages. | 12-27-2012 |
20130020674 | FUSED BUSS FOR PLATING FEATURES ON A SEMICONDUCTOR DIE - A semiconductor structure includes a semiconductor substrate; a semiconductor device formed in and over the substrate; a plurality of interconnect layers over the semiconductor device; an interconnect pad over a top surface of the plurality of interconnect layers, wherein the interconnect pad is coupled to the semiconductor device through the plurality of interconnect layers; a contiguous seal ring surrounding the semiconductor device and extending vertically from the substrate to the top surface of the plurality of interconnect layers; and a fuse coupled between the interconnect pad and the seal ring, wherein the fuse is in a non-conductive state. | 01-24-2013 |
20130023091 | FUSED BUSS FOR PLATING FEATURES ON A SEMICONDUCTOR DIE - A method for forming a semiconductor structure includes forming a plurality of fuses over a semiconductor substrate; forming a plurality of interconnect layers over the semiconductor substrate and a plurality of interconnect pads at a top surface of the plurality of interconnect layers; and forming a seal ring, wherein the seal ring surrounds active circuitry formed in and on the semiconductor substrate, the plurality of interconnect pads, and the plurality of fuses, wherein each fuse of the plurality of fuses is electrically connected to a corresponding interconnect pad of the plurality of interconnect pads and the seal ring, and wherein when each fuse of the plurality of fuses is in a conductive state, the fuse electrically connects the corresponding interconnect pad to the seal ring. | 01-24-2013 |
20140077352 | Matrix Lid Heatspreader for Flip Chip Package - A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array ( | 03-20-2014 |
20140369015 | WARP COMPENSATED ELECTRONIC ASSEMBLIES - An electronic panel assembly (EPA) includes one or more electronic devices with primary faces having electrical contacts, opposed rear faces and edges therebetween. The devices are mounted primary faces down in openings in a warp control sheet (WCS). Cured plastic encapsulation is formed at least between lateral edges of the devices and WCS openings. Undesirable panel warping during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. Thin film insulators and conductors couple electrical contacts on various devices to each other and to external terminals, thereby forming an integrated multi-device EPA. | 12-18-2014 |
20150332980 | PROGRAMMABLE STITCH CHAINING OF DIE-LEVEL INTERCONNECTS FOR RELIABILITY TESTING - A method includes fabricating a set of die in a production run, each die comprising a set of pads at a periphery of a top metal layer, a first set of fuse elements, and a second set of fuse elements. Each fuse element of the first set of fuse elements couples a corresponding pad of the set to a corresponding bus when in a conductive state, and each fuse element of the second set couples a corresponding subset of pads of the set together when in a conductive state. The method further includes selecting a subset of the die of the production run for testing, and configuring each die of the subset for testing by placing each fuse element of the first set in a non-conductive state and placing each fuse element of the second set in a conductive state. | 11-19-2015 |
Goerge R. Leal, Cedar Park, TX US
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20100252919 | ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE - An electronic device can include a package device structure including a die encapsulated within a packaging material. The package device structure can have a first side and a second side opposite the first side. The electronic device can include a first layer along the first side of the package device structure. The first layer can be capable of causing a first deformation of the package device structure. The electronic device can also include a second layer along the second side of the package device structure. The second layer can be capable of causing a second deformation of the package device structure, the second deformation opposite the first deformation. | 10-07-2010 |
Guilherme N. Leal, Alameda, CA US
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20120239535 | Method and System for Demand and Supply Map/Shopping Path Model Graphical Platform and Supplying Offers Based on Purchase Intentions - Methods and systems allowing a consumer to use a graphical tool that summarizes, compares and browses multiple offers for products or services over a network or communications medium such as via the Internet. In specific embodiments, potential purchasers can make declarations to buy, which sellers can use to generate improved and customized offers. | 09-20-2012 |
Hans Leal, Stow, MA US
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20090309307 | Toy dart assembly and method - Embodiments of the invention include a method for engaging a dart with a net. A dart is thrown toward a net. When the dart hits the net, the nose of the dart passes through an opening in the net for subsequently, lodging strands of the net in a recess situated behind the nose of the dart. Embodiments further include a recreational toy assembly having in combination a net and a dart. One or more strands of the net lodge in a recess behind the nose of the dart for coupling the dart to the net. The dart remains engaged to the net until the dart is removed from engagement with the net. For disengaging the dart from the net, the strand(s) is/are removed from the recess such that the nose of the dart may be passed out of opening in the net. The strands of the net provide the boundary or perimeter of the opening. | 12-17-2009 |
Javier Canavati Leal, Etna, WY US
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20100189913 | ROLLING CONTACT LAYER-BY-LAYER ASSEMBLY - A rolling contact layer-by-layer assembly device comprises at least one roller, a cylinder substrate and a motor to rotate the cylinder substrate. The assembly device optionally includes at least one rinsing nozzle and air applicator. The rollers each provide a polyelectrolyte solution to the surface of the cylinder substrate, the polyelectrolyte solutions having an affinity for each other. Excess polyelectrolyte solution can be washed using the rinsing nozzle followed by a drying step prior to the application of the second polyelectrolyte solution. A plurality of bilayers is produced by the continuous application of polyelectrolyte solutions to form an LBL article such as a nano-composite article or film. The film is then removed from the surface of the cylinder substrate. | 07-29-2010 |
Jeffrey Leal, Baltimore, MD US
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20130208963 | COMPUTER-AIDED DETECTION (CAD) SYSTEM FOR PERSONALIZED DISEASE DETECTION, ASSESSMENT, AND TRACKING, IN MEDICAL IMAGING BASED ON USER SELECTABLE CRITERIA - An embodiment of the current invention includes computer-implemented method for image processing. The method includes receiving a first medical image from a data storage device, the first medical image comprising a plurality of image voxels and representing a plurality of tissue regions of a subject; automatically determining a reference value based on the first medical image, the reference value capable of providing a range of background level of voxel intensity values within at least one non-disease tissue region of the subject; generating a disease threshold based on the reference value; identifying portions of the medical image corresponding to disease-tissue regions according to the disease threshold, each of the portions comprising a plurality of connected image voxels in the medical image; and entering data encoding the disease-tissue regions into a database for subsequent comparisons. | 08-15-2013 |
Jeffrey S. Leal, Santa Cruz, CA US
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20090068790 | Electrical Interconnect Formed by Pulsed Dispense - Methods for depositing interconnect material at a target for electrical interconnection include pulsed dispense of the material. In some embodiments droplets of interconnect material are deposited in a projectile fashion. In some embodiments the droplets are shaped by movement of the deposition tool following a deposition pulse and prior to separation of the droplet mass from the tool. | 03-12-2009 |
20090206458 | FLAT LEADLESS PACKAGES AND STACKED LEADLESS PACKAGE ASSEMBLIES - A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink. | 08-20-2009 |
Jeffrey S. Leal, Scotts Valley, CA US
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20100140811 | SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELECTRICALLY CONDUCTIVE MATERIAL - An interconnect terminal is formed on a semiconductor die by applying an electrically conductive material in an aerosol form, for example by aerosol jet printing. Also, an electrical interconnect between stacked die, or between a die and circuitry in an underlying support such as a package substrate, is formed by applying an electrically conductive material in an aerosol form, in contact with pads on the die or on the die and the substrate, and passing between the respective pads. In some embodiments a fillet is formed at the inside corner formed by an interconnect sidewall of the die and a surface inboard from pads on an underlying feature (underlying die or support); and the electrically conductive material passes over a surface of the fillet. | 06-10-2010 |
20100327461 | Electrical interconnect for die stacked in zig-zag configuration - A die (or of a stack of die) is mounted over and elevated above a support, and is electrically connected to circuitry in the support. Pillars of electrically conductive material are formed on a set of bond pads at a mount side of the support, and the elevated die (or at least one die in the elevated stack of die) is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the support. Also, tiered offset stacked die assemblies in a zig-zag configuration, in which the interconnect edges of a first (lower) tier face in a first direction, and the interconnect edges of a second (upper) tier, stacked over the first tier, face in a second direction, different from the first direction, are electrically connected to a support. Die in the first tier are electrically interconnected die-to-die, and the tier is electrically connected to a support, by traces of an electrically conductive material contacting interconnect pads on the die and a first set of bond pads on the support. Pillars of a electrically conductive material are formed on a second set of bond pads, and die in the second tier are electrically interconnected die-to-die, and the tier is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the substrate. | 12-30-2010 |
20110012246 | Flat Leadless Packages and Stacked Leadless Package Assemblies - A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink. | 01-20-2011 |
20110266684 | Selective Die Electrical Insulation By Additive Process - Additive processes are employed for electrically insulating selected surface regions on a stack of die; and methods for electrically interconnecting die in a stack of die, include additive processes for electrically insulating selected surface regions of the die. Regions that are not insulated according to the invention are available for electrical connection using electrically conductive material applied in flowable form to make electrically conductive traces. | 11-03-2011 |
20110272825 | STACKED DIE ASSEMBLY HAVING REDUCED STRESS ELECTRICAL INTERCONNECTS - Methods are disclosed for improving electrical interconnection in stacked die assemblies, and stacked die assemblies are disclosed having structural features formed by the methods. The resulting stacked die assemblies are characterized by having reduced electrical interconnect failure. | 11-10-2011 |
20120119385 | Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies - Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly. | 05-17-2012 |
20120248607 | Semiconductor die having fine pitch electrical interconnects - A die has interconnect pads on an interconnect side near an interconnect edge and has at least a portion of the interconnect side covered by a conformal dielectric coating, in which an interconnect trace over the dielectric coating forms a high interface angle with the surface of the dielectric coating. Because the traces have a high interface angle, a tendency for the interconnect materials to “bleed” laterally is mitigated and contact or overlap of adjacent traces is avoided. The interconnect trace includes a curable electrically conductive interconnect material; that is, it includes a material that can be applied in a flowable form, and thereafter cured or allowed to cure to form the conductive traces. Also, a method includes, prior to forming the traces, subjecting the surface of the conformal dielectric coating with a CF | 10-04-2012 |
20130114235 | EMI SHIELD - An EMI shield can be formed directly on a component, e.g., an unpackaged or packaged semiconductor die, by depositing and curing a curable composition which includes electrically conductive particles and a carrier. In examples, the shield can be configured as a grid or net of electrically conductive traces or lines. The curable electrically conductive material may be applied to the component surface in a flowable form and cured or allowed to cure to form the electrically conductive shield. The shield can be electrically coupled to contacts on an underlying circuit panel or support. The coupling material may be a conductive adhesive, and may be or may include a material the same as, or similar to, the shield material. | 05-09-2013 |
20150056753 | Semiconductor Die Having Fine Pitch Electrical Interconnects - A die has interconnect pads on an interconnect side near an interconnect edge and has at least a portion of the interconnect side covered by a conformal dielectric coating, in which an interconnect trace over the dielectric coating forms a high interface angle with the surface of the dielectric coating. Because the traces have a high interface angle, a tendency for the interconnect materials to “bleed” laterally is mitigated and contact or overlap of adjacent traces is avoided. The interconnect trace includes a curable electrically conductive interconnect material; that is, it includes a material that can be applied in a flowable form, and thereafter cured or allowed to cure to form the conductive traces. Also, a method includes, prior to forming the traces, subjecting the surface of the conformal dielectric coating with a CF | 02-26-2015 |
Jerlib J. Leal, Houston, TX US
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20150240582 | CONTINUOUS FLOW SYSTEM FOR DRILLING OIL AND GAS WELLS - A flow sub for use with a drill string includes a tubular housing having a longitudinal bore therethrough and a flow port through a wall thereof and a ball. The ball is disposed in the housing above the flow port, has a bore therethrough, and is rotatable relative to the housing between an open position where the ball bore is aligned with the housing bore and a closed position where a wall of the ball blocks the housing bore. The flow sub further includes a seat disposed in the housing above the ball for sealing against the ball wall in the closed position and a sleeve disposed in the housing and movable between an open position where the flow port is exposed to the housing bore and a closed position where a wall of the sleeve is disposed between the flow port and the housing bore. | 08-27-2015 |
Joel Leal, Fort Myers, FL US
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20090009770 | Turbidimeter with ultrasonically cleaned components - An ultrasonic optical cleaning system is provided for cleaning and deterring the buildup of organic and inorganic particulates from the surface of glassware used in water testing instrumentation. The ultrasonic optical cleaning system includes a transducer that is attached to the surface of the glassware. A connector cap carrying a plurality of spring contacts interconnecting the transducer with an ultrasonic transducer control circuit. The control circuit operates continuously to provide an electrical signal to the transducer that vibrates the transducer and the glassware so that the glassware is cleaned of contaminates. | 01-08-2009 |
20100290953 | FLUID CONTENT MONITOR - A fluid content monitor including a cuvette, a colorimeter adapted to generate a signal indicative of contents of a fluid sample contained in the cuvette, a container for holding a reagent, and a pump assembly for delivering reagent from the container to the cuvette. The pump assembly includes a tube extending from the container to the cuvette, check valves preventing reverse flow in the tube, and a hammer driven by a solenoid for repetitively compressing the tube to pump reagent to the cuvette. The cuvette can be removed for cleaning and replacement. | 11-18-2010 |
Jose Leal, Stow, MA US
Patent application number | Description | Published |
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20090309307 | Toy dart assembly and method - Embodiments of the invention include a method for engaging a dart with a net. A dart is thrown toward a net. When the dart hits the net, the nose of the dart passes through an opening in the net for subsequently, lodging strands of the net in a recess situated behind the nose of the dart. Embodiments further include a recreational toy assembly having in combination a net and a dart. One or more strands of the net lodge in a recess behind the nose of the dart for coupling the dart to the net. The dart remains engaged to the net until the dart is removed from engagement with the net. For disengaging the dart from the net, the strand(s) is/are removed from the recess such that the nose of the dart may be passed out of opening in the net. The strands of the net provide the boundary or perimeter of the opening. | 12-17-2009 |
Jose E. Leal, Stow, MA US
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20120325193 | BALL THROWING MACHINE - A ball throwing apparatus includes a ball magazine attached to a first end of a ball tube. A ball propelling or throwing assembly is attached to a second end of the ball tube. A retaining element, such as a spring finger, extends into the ball tube from a first side of the ball tube. A holder which may be pivotally mounted on the ball tube extends into the ball tube from a second side of the ball tube. An arm moves through an arm slot in the second side of the ball tube in a reciprocating motion, feeding balls one at a time from the ball magazine into the throwing assembly, in a uniform time sequence. | 12-27-2012 |
Josephina Leal, Mira Loma, CA US
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20150121607 | SLEEVE CUFF MODIFICATION - A sleeve cuff modification includes an elastic connector, which extends from an opening within the sleeve cuff. The elastic connector is stitched on an inner portion of the sleeve and has a button opening that extends through a sleeve opening for attachment to a button on the sleeve. The elastic nature of the connector allows the user to expand the circumference of the sleeve so that the sleeve may be easily rolled up the individual's arm without unbuttoning the sleeve. | 05-07-2015 |
Juan Francisco Leal, Irving, TX US
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20150372963 | SYSTEMS AND METHODS FOR CATEGORIZING MESSAGES - Systems and methods of the present disclosure are directed to categorizing messages. A first server can receive, from a second server maintaining a plurality of social media messages, a message. The first server can categorize the message under a first category or a second category. The first server can process the message and determine a frequency of each of the words included in the processed message. The first server determines, using a probabilistic engine executing on the first server, a relevancy score of the modified message indicating a level of relevance between the message and the first category based on the determined frequency of each of the words. The first server, responsive to determining that the relevancy score satisfies a threshold, can categorize the message under the first category. | 12-24-2015 |
Marcus A. Leal, Kirkland, WA US
Michael A. Leal, Tucson, AZ US
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20110029160 | METHODS AND APPARATUS FOR A TANDEM DIVERT AND ATTITUDE CONTROL SYSTEM - An aeronautical vehicle includes at least one set of tandem divert thrusters incorporated into the body. Each set of tandem divert thrusters includes a first divert thruster and a second divert thruster, each configured to provide substantially equal thrust forces at substantially the same time and in substantially opposite directions such that the moment reference point lies between the first and second divert thrusters. | 02-03-2011 |
20120211596 | PROPULSION AND MANEUVERING SYSTEM WITH AXIAL THRUSTERS AND METHOD FOR AXIAL DIVERT ATTITUDE AND CONTROL - Embodiments of a propulsion and maneuvering system that may be suitable for use during a terminal phase in an interceptor are generally described herein. The propulsion and maneuvering system may include one or more axial thrusters to provide thrust along axial thrust lines that run through a center-of-gravity of the interceptor and a plurality of divert thrusters to provide thrust in radial directions. The combination of divert and axial thrusters may allow the interceptor to respond to a maneuvering target and may allow the interceptor to increase its velocity along a line-of-sight (LOS) to a target to change target impact/engagement time. | 08-23-2012 |
20150184988 | INTEGRAL INJECTION THRUST VECTOR CONTROL WITH BOOSTER ATTITUDE CONTROL SYSTEM - A projectile includes a propulsion booster for producing pressurized gases, a nozzle for expelling the pressurized gases produced by the booster, and a supplementary integrated actuation system. The integrated actuation system selectively directs propellant from a storage reservoir of the integrated actuation system through an interiorly-located outlet of the integrated actuation system located at the nozzle and into the nozzle, thus changing a direction of the pressurized gases expelled by the booster. The integrated actuation system also selectively directs propellant from the storage reservoir through a peripherally-located outlet of the integrated actuation system, to produce thrust at an external periphery of the projectile, thus diverting the projectile. The integrated actuation system may also selectively direct propellant to a nozzle actuation system for positioning the nozzle, to a stage separation system for separating portions of the projectile, or to a power generator for generating electric power for the projectile. | 07-02-2015 |
Nicole Leal, Gainesville, FL US
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20110319298 | Differential detection of single nucleotide polymorphisms - This patent application claims processes and compositions of matter that enable the discovery of single nucleotide polymorphisms (SNPs) that distinguish the genomes of two individual organisms in the same species, as well as that distinguish the paternal and maternal genetic inheritance of a single individual, as well as distinguish the genomes of cells in special tissues (e.g. cancer tissues) within an individual from the genomes of the standard cells in the same individuals, as well as the SNPs that are discovered using these processes and compositions. Two steps are essential to the invention disclosed in this application. The first step provides four sets of primers, which are designated “T-extendable”, “A-extendable”, “C-extendable”, and “G-extendable”. These primers, when targeted against a reference genome as a template, add (respectively) T, A, C, and G to their 3′-ends in a template-directed primer extension reaction. The second step presents these four primer sets, separately, to a sample of the target genome DNA under conditions where they bind to their complementary segments within the target DNA. Once bound, members of each primer set serve as primers for a template-directed primer extension reaction using the target genome as the template. If the template from the target genome presents the same templating nucleotide for the first nucleotide added in the extension reaction as the reference genome, then the T-extendable, A-extendable, C-extendable, and G-extendable primers will be extended (respectively) by T, A, C, and G. If, however, the template from the target genome presents a nucleotide different from the reference genome, then the T-extendable, A-extendable, C-extendable, and G-extendable primers will be extended (respectively) by not T, not A, not C, and not G (referred to here as “3N” or “3”, to indicate the other three nucleotides, where which of the other three is understood by context). In these cases, the primers have discovered a SNP, a difference between the target and reference genomes. Then, the T-extendable, A-extendable, C-extendable, and G-extendable primers that add (respectively) not-T, not-A, not-C, and not-G are separated or made otherwise physically distinct (through, for example, the use of irreversible terminators, such as 2′,3′-dideoxynucleosides) from those that added T, A, C, and G (respectively). Those that added T, A, C, and G (respectively) did not discover a SNP, and are discarded. The primers that added “not-T”, “not-A”, “not-C”, and “not-G” discovered a SNP, and presented in a mixture enriched (relative to those primers that did not discover a SNP) in a useful deliverable. Following these steps, the SNPs discoveries are realized by sequencing the extracted species. The information obtained from this sequencing allows the identification of the locus of the SNP in the in silico genome. | 12-29-2011 |
Nicole A. Leal, Gainesville, FL US
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20110117554 | Formamide-containing mixtures for detecting nucleic acids - Specific sequences of DNA are often detected by a process that comprises a step where the sequence to be detected (the “analyte”) binds to give a duplex with a DNA molecule or analog that is complementary in the Watson-Crick sense to some portion of the analyte in an aqueous “assay environment” that may contain buffer, salt, and/or detergent. Such purely aqueous systems cannot be exposed indefinitely to the environment, however, as the water in the system will evaporate. Further, such systems often support the growth of bacteria and other organisms, destroying their effectiveness. This invention provides for compositions of matter and processes that use them that comprise assay mixtures containing more than 40% formamide. This mixture remains a liquid at equilibrium with water in environments normally inhabited by humans. This invention also provides for mixtures containing formamides that include detergents. Formamide is usually regarded as a denaturant for duplex formation, destabilizing the binding that is key to detection. This invention therefore also provides for materials that form duplexes in formamide-water mixtures. | 05-19-2011 |
Nicole Aurora Leal, Gainesville, FL US
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20090270601 | Differential detection of single nucleotide polymorphisms - This application claims processes and compositions that enable discovery of single nucleotide polymorphisms (SNPs) and other sequence variation that follows two essentially identical sequences, one a reference, the other a target, as well as SNPs discovered using these processes and compositions. The inventive process comprises preparation of four sets of primers, “T-extendable”, “A-extendable”, “C-extendable”, and “G-extendable”. These primers, when templated on a reference genome, add (respectively) T, A, C, and G to their 3′-ends. The invention also comprises a step where these primer sets are separately bound to complementary sequences on target DNA and, once bound, prime extension reactions using target DNA as the template. If the target DNA directs incorporation of the same nucleotide as the reference DNA, then the T-, A-, C-, and G-extendable primers are extended (respectively) by T, A, C, and G. The architecture of the process distinguishes products from these extensions from products derived if not T, not A, not C and not G (“3N” or “3”, to indicate the other three nucleotides) are not added. Thus, this process discovers differences between the target and reference DNA in the site queried by the primer extension reaction. The distinction makes the two kinds of products either separable or differentially extendable. This distinction is used to disregard products that added T, A, C, and G and to identify the sequence(s) of primers that added not-T, not-A, not-C, and not-G. Further and optionally, information from these sequences identifies loci of the SNPs in an in silico genome. | 10-29-2009 |
20110275124 | Reagents for reversibly terminating primer extension - This invention relates to the field of nucleic acid chemistry, more specifically to the field of compositions of matter that comprise triphosphates of modified 2′-deoxynucleosides and oligonucleotides that are formed when these are appended to the 3′-end of a primer, wherein said modifications comprise NH | 11-10-2011 |
Rosa Maria Leal, Irving, TX US
Patent application number | Description | Published |
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20150267952 | SYSTEM FOR CONTROLLING OPERATION OF AN HVAC SYSTEM HAVING TANDEM COMPRESSORS - The present invention provides for a control system for operating a heating, ventilation, and air conditioning (HVAC) system. A controller operates compressors in tandem. In response to detection of a high pressure condition in refrigerant flowing through a high pressure side of the HVAC system, the controller operates the HVAC system with a first compressor on and a second compressor off. | 09-24-2015 |
20150267953 | SYSTEM FOR OPERATING AN HVAC SYSTEM HAVING TANDEM COMPRESSORS - The present invention provides for a system for operating a heating, ventilation, and air conditioning (HVAC) system. A controller operates compressors in tandem connected to an evaporator. In response to detection of a pre-freezing condition of in the coils of the evaporator, the controller adjusts an operating condition of the HVAC system. | 09-24-2015 |
20150330686 | SOLENOID CONTROL METHODS FOR DUAL FLOW HVAC SYSTEMS - Provided are a method and apparatus for reducing a refrigerant pressure difference within an HVAC system having a controller, one or more compressors, and at least two paths of refrigerant piping comprising alternative paths for refrigerant flow through the HVAC system. A valve is coupled to each refrigerant piping path for permitting, or preventing, refrigerant flow through each of the alternate paths of refrigerant piping. The controller may open at least one valve for a defined period of time in response to a triggering input to allow a refrigerant pressure difference within the HVAC system to dissipate across the opened valve. | 11-19-2015 |
20150338133 | TANDEM COMPRESSOR DISCHARGE PRESSURE AND TEMPERATURE CONTROL LOGIC - An HVAC system, comprising a plurality of sensors, a tandem compressor comprising a first compressor and a second compressor, and a controller communicatively coupled to the plurality of sensors and the tandem compressor. The controller may determine a first interruption of power to the tandem compressor and identify a sensor corresponding to the first interruption of power. The controller is further operable to determine that the first interruption of power was caused at least in part by the refrigerant associated with the first compressor exceeding a tolerance condition. The controller may also reconfigure the tandem compressor, wherein on or off settings of the first compressor and the second compressor are determined based on a required load operation of the tandem compressor and the determination that the first interruption of power was caused at least in part by the refrigerant associated with the first compressor exceeding the tolerance condition. | 11-26-2015 |
20150362205 | AIRFLOW-CONFIRMING HVAC SYSTEMS AND METHODS WITH VARIABLE SPEED BLOWER - Systems and methods are disclosed that involve controlling a variable-speed blower in a heating, ventilating, and air conditioning (HVAC) system to ensure the setting of a blower-proving switch to confirm airflow in a building. In one instance, a method involves ramping up the variable-speed blower so that the associated static pressure reaches a making point pressure of the blower-proving switch and then reducing the power to a desired power level. The method may also include maintaining the power level above a breaking point pressure. Other systems and methods are presented. | 12-17-2015 |
Thomas Leal, San Bernardino, CA US
Patent application number | Description | Published |
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20100072773 | LAP SHADE - The present invention is a lap shade that comprises a plurality of section pads attached to form a dashboard piece, a plurality of frames attached to form a door piece, and a plurality of attachment means on both the dashboard piece and the door piece for attachment purposes on the dash board and a side window of a vehicle respectively. A velcro is attached at a bottom side of the dashboard piece to be engaged with a velcro on the door piece. The lap shade includes a plurality of joints, which allow folding of the lap shade. The plurality of attachment means on the dashboard piece is provided with a sliding mechanism, which includes a slider assembly to allow the attachment means to be extended as desired. The door piece is foldable against the dashboard piece followed by folding the section pads. | 03-25-2010 |