Patent application number | Description | Published |
20090039525 | Method of Welding Together at Least Two Stacked Members - In this soldering method, a laser is directed onto an end face of the stack in such a manner that the laser heats the stack. At least one parameter of the laser is adjusted to a value that is the image by means of a mathematical model of at least one thermal characteristic of the stack. The parameter of the laser is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiating power of the laser. | 02-12-2009 |
20090175005 | Support, in Particular for an Electronic Power Component, a Power Module Including the Support, an Assembly Including the Module, and an Electrical Member Controlled by the Module - The support is for fitting on a heat dissipation mass. The support comprises an electrically insulating plate and a heat conductor plate for conducting heat to the heat dissipation mass. In particular, the heat conductor plate is in contact with the electrically insulating plate. The heat conductor plate includes a layer forming a junction with the heat dissipation mass, referred to as its bottom layer, and a layer for stiffening the heat conductor plate, referred to as its intermediate layer. More particularly, the stiffener layer is made of a material of hardness greater than that of the material of the bottom layer. | 07-09-2009 |
20090179336 | Electronic Module and a Method of Assembling Such a Module - The module is of the type comprising an electronic component provided with a conductive face that is electrically connected to a connection member of the component by means of a conductor that is corrugated at least in part so as to define an alternating sequence of oppositely-directed arcs, a first series of arcs being connected to the conductive face of the electronic component. The conductor also includes a second series of arcs opposite to the arcs of the first series and interposed between the arcs of the first series, the second series of arcs being connected to the conductive face of the connection member. | 07-16-2009 |
20100000979 | Method and device for controlling the power transmitted by a laser to a reference point, soldering device and method - In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam. | 01-07-2010 |
20100089879 | Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other - A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value. | 04-15-2010 |
20100139089 | METHOD AND A DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-FORMING MASS - In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured. | 06-10-2010 |
20100157561 | Holder for electrical component and electrical device including the holder and component - This holder includes a conductor metal part designed to be warmed for assembly of the electrical component on the metal part. It also includes a part made of synthetic material, jointed with the metal part, guaranteeing cohesion of the holder. This part made out of synthetic material contains a mass with a low melting point and a mass with a high melting point, inserted between the mass with a low melting point and the metal part. More specifically, the mass with the high melting point is made in a material with a melting point greater than the melting point of the mass with a low melting point. | 06-24-2010 |
20100176098 | Method of Assembling a Member on a Support by Sintering a Mass of Conductive Powder - In this method, the conductive powder mass is placed on the support, and then the member is placed on the mass and a compression force is applied, urging the member against the mass and the support before heating the mass. The magnitude is increased from an initial value to a first predefined value for agglomerating the mass, which value is less than a plastic deformation threshold of the powder mass. Then, the magnitude is maintained at the first predefined value throughout a predetermined duration for agglomerating the powder mass. Finally, the magnitude is increased from the first value to a second predefined value less than a critical threshold for damaging the member but greater than a minimum threshold for sintering the mass at the predetermined temperature, the second predefined value being greater than the first predefined value. | 07-15-2010 |
20120235290 | POWER MODULE FOR AN AUTOMOBILE - The invention relates to a power module ( | 09-20-2012 |
20120268895 | ELECTRONIC POWER MODULE, AND METHOD FOR MANUFACTURING SAID MODULE - Said electronic power module ( | 10-25-2012 |
20130062326 | METHOD OF BONDING A MEMBER TO A SUPPORT BY ADDITION OF MATERIAL, AND DEVICE FOR ARRANGING TWO ELEMENTS, ONE ON THE OTHER - A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value. | 03-14-2013 |
20140304984 | DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-FORMING MASS - A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation. | 10-16-2014 |