Patent application number | Description | Published |
20080311738 | METHOD OF FORMING AN INTERCONNECT JOINT - A method of forming an interconnect joint includes providing a first metal layer ( | 12-18-2008 |
20090004841 | Forming vias using sacrificial material - In one embodiment, the present invention includes a method for forming a sacrificial material layer, patterning it to obtain a first patterned sacrificial material layer, embedding the first patterned sacrificial material layer into a dielectric material, treating the first patterned sacrificial material layer to remove it to thus provide a patterned dielectric layer having a plurality of openings in which vias may be formed. Other embodiments are described and claimed. | 01-01-2009 |
20090087644 | METHODS TO FABRICATE FUNCTIONALLY GRADIENT MATERIALS AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of functionalized nanoparticles on a substrate by immersing the substrate in at least one of a solvent and a polymer matrix, wherein at least one of the solvent and the polymer matrix comprises a plurality of functionalized nanoparticles; and forming a second layer of functionalized nanoparticles on the first layer of functionalized particles, wherein there is a gradient in a property between the first layer and the second layer. | 04-02-2009 |
20090166396 | MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING - Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed. | 07-02-2009 |
20090169427 | CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE - A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths. | 07-02-2009 |
20090273914 | Apparatus and methods of forming an interconnect between a workpiece and substrate - Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed. | 11-05-2009 |
20110074023 | Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate - Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed. | 03-31-2011 |
20130140014 | METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL - Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s). | 06-06-2013 |