Patent application number | Description | Published |
20090152545 | Feature Dimension Measurement - A method of measuring dimensional characteristics includes providing a substrate and forming a reflective layer over the substrate. A dielectric layer is then formed over the reflective layer. The dielectric layer includes a grating pattern and a resistivity test line inset in a transparent region. Radiation is then directed onto the dielectric layer so that some of the radiation is transmitted through the transparent region to the reflective layer. A radiation pattern is then detected from the radiation reflected and scattered by the metal grating pattern. The radiation pattern is analyzed to determine a first dimensional information. Then the resistance of the resistivity test line is measured, and that resistance is analyzed to determine a second dimensional information. The first and second dimensional informations are then compared. | 06-18-2009 |
20120264303 | CHEMICAL MECHANICAL POLISHING SLURRY, SYSTEM AND METHOD - A metal polishing slurry includes a chemical solution and abrasives characterized by a bimodal or other multimodal distribution of particle sizes or a prevalence of two or more particle sizes or ranges of particle sizes. A method and system for using the slurry in a CMP polishing operation, are also provided. | 10-18-2012 |
20130023188 | Apparatus for Wafer Grinding - A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another. | 01-24-2013 |
20130210172 | WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL AND METHOD OF USING - A wafer thinning apparatus includes a first metrology tool configured to measure an initial thickness of the wafer. The wafer thinning apparatus further includes a controller connected to the first metrology tool, and configured to determine a polishing time based on the initial thickness, a predetermined thickness and a material removal rate. The wafer thinning apparatus further includes a polishing tool connected to the controller configured to polish the wafer for a period of time equal to the polishing time. The wafer thinning apparatus includes a second metrology tool connected to the controller and the polishing tool, and configured to measure a polished thickness. The controller is configured to update the material removal rate based on the polished thickness, the predetermined thickness and the polishing time. | 08-15-2013 |
20130210321 | MODULAR GRINDING APPARATUSES AND METHODS FOR WAFER THINNING - Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer. | 08-15-2013 |
20130220090 | WAFER EDGE TRIM BLADE WITH SLOTS - A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade. | 08-29-2013 |
20130273686 | Image Sensor Manufacturing Methods - Semiconductor devices and back side illumination (BSI) sensor manufacturing methods are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece and forming an integrated circuit on a front side of the workpiece. A grid of a conductive material is formed on a back side of the workpiece using a damascene process. | 10-17-2013 |
20140024170 | Methods for Minimizing Edge Peeling in the Manufacturing of BSI Chips - A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter. | 01-23-2014 |
20140209984 | Semiconductor Device With Multi Level Interconnects And Method Of Forming The Same - A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a substrate including a gate structure separating source and drain (S/D) features. The semiconductor device further includes a first dielectric layer formed over the substrate, the first dielectric layer including a first interconnect structure in electrical contact with the S/D features. The semiconductor device further includes an intermediate layer formed over the first dielectric layer, the intermediate layer having a top surface that is substantially coplanar with a top surface of the first interconnect structure. The semiconductor device further includes a second dielectric layer formed over the intermediate layer, the second dielectric layer including a second interconnect structure in electrical contact with the first interconnect structure and a third interconnect structure in electrical contact with the gate structure. | 07-31-2014 |
20140213152 | Wafer Edge Trimming Tool Using Abrasive Tape - A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process. | 07-31-2014 |
20140213153 | Wafer Polishing Tool Using Abrasive Tape - An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process. | 07-31-2014 |