Kuo-Chin
Kuo-Chin Chang, Chiayi TW
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20120286417 | METHOD AND STRUCTURE FOR CONTROLLING PACKAGE WARPAGE - A method comprises determining a warpage of an integrated circuit (IC) package design. The IC package design includes a substrate having a top solder mask on a first major surface and a bottom solder mask on a second major surface opposite the first major surface. The first major surface has an IC die mounted over the top solder mask. The design is modified, including modifying an average thickness of one of the group consisting of the top solder mask and the bottom solder mask, so as to reduce the warpage. An IC package is fabricated according to the modified design. | 11-15-2012 |
Kuo-Chin Chang, Hsinchu TW
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20080296764 | Enhanced copper posts for wafer level chip scale packaging - An enhanced wafer level chip scale packaging (WLCSP) copper electrode post is described having one or more pins that protrude from the top of the electrode post. When the solder ball is soldered onto the post, the pins are encapsulated within the solder material. The pins not only add shear strength to the soldered joint between the solder ball and the electrode post but also create a more reliable electrical connection due to the increased surface area between the electrode post/pin combination and the solder ball. Moreover, creating an irregularly shaped solder joint retards the propagation of cracks that may form in the intermetal compounds (IMC) layer formed at the solder joint. | 12-04-2008 |
Kuo-Chin Chen, Taipei County TW
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20090100655 | Yarns with Coffee Residue and Preparation Thereof - The present invention provides to a preparation of a yarn with coffee residue. The present invention also provide to a novel yarn with coffee residue. | 04-23-2009 |
20100022150 | Yarns with Coffee Residue and Preparation Thereof - The present invention provides to a preparation of a yarn with coffee residue. The present invention also provide to a novel yarn with coffee residue. | 01-28-2010 |
Kuo-Chin Chen, New Taipei City TW
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20130137323 | METHOD FOR PREPARING A FUNCTIONAL FILM VIA COFFEE OIL AND TEXTILE THEREOF - The present invention relates to a method for preparing a functional film via coffee oil, comprising (a) extracting a coffee oil from coffee; (b) modifying the coffee oil to obtain an epoxidized coffee oil; (c) adding an alcohol into the epoxidized coffee oil to obtain a coffee polyol; (d) synthesizing a polyurethane dispersive solution with the coffee polyol; (e) coating a surface of a substrate with the polyurethane dispersive solution; and (f) drying and fixing the surface of the substrate. The present invention further provides a functional textile comprising a functional film prepared by the method of above. | 05-30-2013 |
20150051306 | METHOD FOR PREPARING A COFFEE POLYOL AND COMPOSITIONS AND MATERIALS CONTAINING THE SAME - A method for preparing a coffee polyol includes: (a) extracting coffee oil from coffee grounds; (b) modifying the coffee oil to obtain an epoxidized coffee oil; and (c) reacting an alcohol with the epoxidized coffee oil to obtain a coffee polyol. A polyurethane dispersive solution is prepared from a prepolymer composition that includes: a coffee polyol prepared from the abovementioned method; an isocyanate; and a solvent. A foam-based material is made from a foaming composition that includes a coffee polyol prepared from the abovementioned method. A polyurethane material is made from a polyurethane composition that includes a coffee polyol prepared from the abovementioned method. | 02-19-2015 |
20150152252 | Heat Shrinkable Material-Enclosed Porous Particle - A heat shrinkable material-enclosed porous particle including a porous body that has a plurality of pores and a heat shrinkable material that encloses the porous body is disclosed. A method for preparing heat shrinkable material-enclosed porous particles is also disclosed. | 06-04-2015 |
Kuo-Chin Chen, Taipei Hsien TW
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20090104427 | Multi-Properties Composite, Polytetrafluoroethylene Membrane and Preparation Thereof - The present invention relates to a kind of composite of porous resin and porous carbon particles, which has excellent adsorption, odor resistance, moisture-management, air permeability, water vapor permeability, water resistance and anti-peeling properties. Moreover, a kind of adsorbent, odor resistant, moisture-managing, air permeable, water vapor permeable, water resistant and anti-peeling polytetrafluoroethylene and its processing method are also disclosed. | 04-23-2009 |
20110034097 | Ventilative and Absorptive Textile with Porous Material and Preparation Thereof - The present invention provides a method of preparing a textile with a porous material, comprising: (a) mixing a solution containing the porous material, a resin and a foam stabilizer to form a mixture; (b) foaming the mixture of (a) to form a foam; (c) coating the foam of (b) to the surface of the textile; and (d) drying the textile of (c). | 02-10-2011 |
20140349537 | YARNS WITH COFFEE RESIDUES AND FABRIC AND GARMET INCLUDING THE SAME - The present invention provides preparation of a yarn with coffee residue. The present invention also provides a novel yarn with coffee residue and applications of the same. | 11-27-2014 |
Kuo-Chin Chiu, Xinfeng Township TW
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20100165685 | POWER TRANSISTOR CHIP WITH BUILT-IN JUNCTION FIELD EFFECT TRANSISTOR AND APPLICATION CIRCUIT THEREOF - A power transistor chip and an application circuit thereof has a junction field effect transistor to act as a start-up circuit of an AC/DC voltage converter. The start-up circuit can be turned off after the PWM circuit of the AC/DC voltage converter operates normally to conserve the consumption of the power. Besides, the junction field effect transistor is built in the power transistor chip. Because the junction field effect transistor is fabricated with the same manufacturing process as the power transistor, it is capable of simplifying the entire process and lowering the production cost due to no additional mask and manufacturing process. | 07-01-2010 |
20100295515 | Integrated PMOS Transistor and Schottky Diode and Charging Switch Circuit Employing The Integrated Device - The present invention discloses an integrated PMOS transistor and Schottky diode, comprising a PMOS transistor which includes a gate, a source, a drain and a channel region between the source and drain, wherein the source, drain and channel region are formed in a substrate, and a parasitic diode is formed between the drain and the channel region; and a Schottky diode formed in the substrate and connected in reverse series with the parasitic diode, the Schottky diode having one end connected with the parasitic diode and the other end connected with the source. | 11-25-2010 |
Kuo-Chin Huang, Taipei TW
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20150062803 | SERVER - A server includes a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a liquid cooling heat exchanger, a circulation line and several fans. The cooling plate is thermally contacted with the heat source. The liquid cooling heat exchanger is located on one side of the motherboard. The liquid cooling heat exchanger is connected with the cooling plate via the circulation line for forming a circulation circuit. The plurality of fans are located next to the liquid cooling heat exchanger. | 03-05-2015 |
20150062817 | SERVER - A server includes a housing, a motherboard and a heat dissipating module. The motherboard is disposed inside the housing and includes multiple heat sources. The heat dissipating module includes a cooling plate disposed inside the housing and in thermal contact with multiple heat sources. The cooling plate includes a substrate, a casing and multiple fins. The substrate is in thermal contact with multiple heat sources. The casing is disposed on the substrate, while the casing and the substrate form a chamber. Multiple fins are disposed on the substrate and are inside the chamber. | 03-05-2015 |
20150096720 | HEAT DISSIPATION MODULE - A heat dissipation module includes a heat conducting plate having an upper surface, a stacked fins heat sink in thermal contact with and disposed on the upper surface of the heat conducting plate, at least one heat pipe and multiple fins. The evaporation end is in thermal contact with and disposed on the upper surface. The plurality of fins are located on the upper surface and positioned at intervals. Each of the fins has at least one through hole and the condensation end runs through the at least one through hole. | 04-09-2015 |
Kuo-Chin Huang, Yilan City TW
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20140264698 | Image Sensor Device and Method - A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration. | 09-18-2014 |
Kuo-Chin Lee, San Diego, CA US
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20120122514 | SELECTING NETWORK SERVICE PROVIDERS FOR MULTI-MODE MOBILE DEVICES - A method for facilitating dynamic service-based network selection and determination may be implemented by a communications device. A device may choose a network and/or network access provider (NAP) based on a type of service desired by a user. For the service, the system may determine which NAP provides the most desired service level for a particular network service provider (NSP). The desired service level may include such factors as power consumption, communication performance, past performance, cost, reward availability, etc. Thus, a user chooses a particular service and the system chooses the network that will provide the service at a desired level to the user. | 05-17-2012 |
Kuo-Chin Lin, Taipei Hsien TW
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20080299835 | AUDIO JACK CONNECTOR - An audio jack connector includes a housing and a terminal group. The housing has an insertion hole extending inward from the front of the housing. The bottom of the base defines at least one signal terminal recess and an auxiliary terminal recess, a first aperture is defined in the bottom of the auxiliary terminal recess and communicates with the signal terminal recess. The terminal group has at least one signal terminal and an auxiliary terminal received in the signal terminal recess and the auxiliary terminal recess respectively. The signal terminal has a contact portion projecting into the insertion hole and an elastic portion extending from the end of the contact portion. The auxiliary terminal has a transverse fixed portion and a first connecting portion extending upward and then longitudinally from one end of the fixed portion. One part of the first connecting portion is jammed in the first aperture, and the other part of the first connecting portion projects into the signal terminal recess. | 12-04-2008 |
Kuo-Chin Lin, Sacramento, CA US
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20100100223 | PROCESS CONTROL USING PROCESS DATA AND YIELD DATA - A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first process step for manufacturing semiconductor wafers (“Step b”). A first mathematical model of the first process step is created based on the metrology data and the acquired data for the plurality of process variables for the first process step (“Step c”). Steps b and c are repeated for at least a second process step for manufacturing the semiconductor wafers (“Step d”). An nth mathematical model is created based on the metrology data and the data for the plurality of process variables for each of the n process steps ('Step e“). A top level mathematical model is created based on the metrology data and the models created by steps c, d and e (”Step f'). The top level mathematical model of Step f is based on those process variables that have a substantial effect on the metrology data. | 04-22-2010 |
Kuo-Chin Lin, New Taipei City TW
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20150162681 | CARD CONNECTOR - A card connector includes an insulating housing, a plurality of conductive terminals, at least one ejection mechanism, at least one reset mechanism, a shielding shell and a card tray. The reset mechanism is disposed to a front of the insulating housing with a base portion located at a front thereof elastically projecting beyond a front surface of the insulating housing. The card tray slidably disposed to the insulating housing includes a base board, and a cover portion protruded forward and then spread outward from a front end of the base board and projecting beyond the front end of the base board. The front surface of the base portion of the reset mechanism abuts against a rear surface of an enclosure of the electronic device so as to make a front surface of the cover portion be flush with an outer surface of the electronic device. | 06-11-2015 |