Patent application number | Description | Published |
20090110939 | LEAD FREE LTCC TAPE COMPOSITION - A glass composition consisting essentially of, based on mole percent, 46-56% B | 04-30-2009 |
20110155431 | MIXED-METAL SYSTEM CONDUCTORS FOR LTCC (LOW-TEMPERATURE CO-FIRED CERAMIC) - A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors. | 06-30-2011 |
20110187602 | METHOD OF MANUFACTURING HIGH FREQUENCY RECEIVING AND/OR TRANSMITTING DEVICES FROM LOW TEMPERATURE CO FIRED CERAMIC MATERIALS AND DEVICES MADE THEREFROM - The invention relates to methods of forming high frequency receivers, transmitters and transceivers from Low Temperature Co-fired Ceramic (LTCC) materials. Two or more layers of a low k thick film dielectric tape and in contact with each other and two or more layers of a low k thick film dielectric tape and in contact with each other form a low k high k LTCC structure with improved properties and the ability to support economical mass production techniques for high frequency transceivers. The invention also relates to the LTCC receiving, transmitting and transceiving structures and the devices made from such structures. | 08-04-2011 |
20120201009 | LEAD FREE LTCC TAPE COMPOSITION - The invention relates to the use of and method of forming Low Temperature Cofired Ceramic (LTCC) circuits for high frequency applications. Furthermore, the invention relates to the novel LTCC thick film compositions and the structure itself. | 08-09-2012 |
20120305296 | LOW TEMPERATURE CO-FIRED CERAMIC STRUCTURE FOR HIGH FREQUENCY APPLICATIONS AND PROCESS FOR MAKING SAME - Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 μm. Also disclosed is a process for making the LTCC structure. | 12-06-2012 |
20120308717 | NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM - Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal. | 12-06-2012 |
20130052433 | COMPOSITIONS FOR LOW K, LOW TEMPERATURE CO-FIRED COMPOSITE (LTCC) TAPES AND LOW SHRINKAGE, MULTI-LAYER LTCC STRUCTURES FORMED THEREFROM - Novel compositions for LTCC green tapes having low K values and low shrinkage and composite laminates of ten to twenty layers or more of green tapes together with conventional LTCC green tapes. | 02-28-2013 |
20140186521 | NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM - Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal. | 07-03-2014 |