Patent application number | Description | Published |
20080315390 | Chip Scale Package For A Micro Component - A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example, CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor cap structure is attached to the sensor die. The front side of the cap structure is attached to the sensor die by a seal ring to hermetically encapsulate an area of the sensor die where the micro component is located. The bond pads on the sensor die are located outside the area encapsulated by the seal ring. Electrical leads, which extend along outer side edges of the semiconductor cap structure from its front side to its back side, are coupled to the micro component via the bond pads. | 12-25-2008 |
20090321760 | FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES - A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite sides of the wafer. The method includes etching vias in the first surface of the semiconductor wafer. The first surface and surfaces in the vias are metallized, and the metal is structured to define a thermal pad and to define the anode and cathode contact pads. A carrier wafer is attached on the side of the semiconductor wafer having the first surface, and the semiconductor wafer is thinned from its second surface to expose the metallization in the vias. Metal is provided on the second surface, and the metal is structured to define a die attach pad and additional anode and cathode pads for the opto-electronic component. The opto-electronic component is mounted on the die attach pad and a protective cover is formed over the opto-electronic component. | 12-31-2009 |
20100200888 | Silicon-Based Sub-Mount for an Opto-Electronic Device - A package for an optoelectronic device (e.g., a light emitting device such as a LED) includes a sub-mount including a silicon substrate having a thickness in the range of 350 μm-700 μm. The optoelectronic device is mounted on a die attach pad on the front-side surface of the substrate. Feed-through metallization in one or more via structures electrically couples the die attach pad to a contact pad on the back-side surface of the substrate. | 08-12-2010 |
20110045618 | FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES - A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite sides of the wafer. The method includes etching vias in the first surface of the semiconductor wafer. The first surface and surfaces in the vias are metallized, and the metal is structured to define a thermal pad and to define the anode and cathode contact pads. A carrier wafer is attached on the side of the semiconductor wafer having the first surface, and the semiconductor wafer is thinned from its second surface to expose the metallization in the vias. Metal is provided on the second surface, and the metal is structured to define a die attach pad and additional anode and cathode pads for the opto-electronic component. The opto-electronic component is mounted on the die attach pad and a protective cover is formed over the opto-electronic component. | 02-24-2011 |
Patent application number | Description | Published |
20080292824 | Plastic Composite Moulded Bodies Obtainable by Welding in an Electromagnetic Alternating Field - The invention relates to plastics composite mouldings obtainable via welding in an alternating electromagnetic field, in which the weld is obtained with the aid of a plastics material which comprises nano-scale, magnetic oxidic particles, which are composed of aggregated primary particles, and where the primary particles are composed of magnetic metal oxide domains whose diameter is from 2 to 100 nm in a non-magnetic metal oxide matrix or non-magnetic metalloid oxide matrix. | 11-27-2008 |
20100062272 | TRANSPARENT PART - A transparent component, which comprises the following subcomponents:
| 03-11-2010 |
20120232531 | PROCESS FOR PRODUCING PLASTIC RODS - A process for producing a plastic rod, in particular round rods, suitable for machining is provided. The process includes extruding a plastic profile of a first plastic molding composition which forms the outermost layer of the plastic rod, and inserting a second plastic molding composition as a rod core into the profile within a calibrator downstream of the extruder. The first plastic molding composition contains at least 50% by weight of a semicrystalline thermoplastic and the first plastics moulding composition has the following properties: a) crystallite melting point T | 09-13-2012 |
20120275774 | TEMPERATURE-CONTROLLABLE PIPE - A flexible pipe of multilayer structure which comprises the following layers, from the inside to the outside: an interior lining; an inner reinforcement layer; a layer of molded electrically conductive plastic; an outer reinforcement layer; and an exterior sheath. The electrically conductive plastic layer is in electrical contact with the two reinforcement layers, and the two reinforcement layers can be connected to a source of electrical current. It is thus possible to achieve efficient heating of the pipe, and it can therefore be used for conveying oil in cold regions. | 11-01-2012 |
20120279577 | TEMPERATURE-CONTROLLABLE PIPE SUITABLE FOR OFFSHORE APPLICATIONS - A flexible pipe which can be heated efficiently, and may therefore be used for conveying oil in cold regions, is provided. The pipe comprises in order from inside to outside: an interior lining; a wound tape; and at least one reinforcement layer. The wound tape contains a first exterior layer of a plastics molding composition that is not electrically conductive; an intermediate layer of an electrically conductive plastics molding composition; and a second exterior layer of a plastics molding composition that is not electrically conductive. A volume resistivity to IEC 60093 of the intermediate layer is in the range from 10 | 11-08-2012 |
20130025734 | FLEXIBLE TUBE HAVING HIGH TEMPERATURE RESISTANCE - A flexible pipe of multilayer structure with unbonded layers, where the pipe has an interior lining which comprises the following layers:
| 01-31-2013 |
20130025735 | FLEXIBLE PIPE AND PROCESS FOR PRODUCTION THEREOF - The invention relates to a flexible tube of multilayer construction having unbonded layers, wherein at least one layer is formed in that a tape made of a plastic molding compound is spirally wound about a further inner layer, wherein the upper and lower layers of the tape are simultaneously or subsequently welded to each other at overlapping regions. The tube is particularly suitable for offshore application in oil and gas extraction | 01-31-2013 |
20130032239 | FLEXIBLE PIPE HAVING A MULTI-LAYERED STRUCTURE - The invention relates to a flexible pipe having a multi-layered structure comprising unbonded layers, comprising an inner lining having the following layer arrangement: a) an innermost layer made of a fluoropolymer molding compound, b) an intermediate layer made of a molding compound on the basis of an olefinic polymer, which is selected from the group consisting of polyethylene, isotactic polypropylene, syndiotactic polypropylene and syndiotactic polystyrene, c) an outer layer made of a polyamide molding compound, wherein the layer made of a polyamide molding compound is particularly efficiently protected against hydrolysis. The pipe is thus particularly suited for offshore applications in oil or gas production. | 02-07-2013 |
20130032240 | FLEXIBLE PIPE HAVING A DIFFUSION BARRIER - In a flexible pipe of multilayer structure with unbonded layers, where the pipe has an interior lining which comprises the following layers:
| 02-07-2013 |
20140338780 | COMPRESSED-AIR BRAKE LINE - A compressed-air brake line which comprises: I) an external layer made of a moulding composition which comprises at least 50% by weight of PA11 and/or PA12, and II) an internal layer made of a moulding composition which comprises at least 50% by weight of polyamide whose monomer units comprise on average at least 8 C atoms is provided. Layer II) does not contain PA11 and/or PA12. The compressed-air brake line has high bursting strength even at elevated temperature, good low-temperature impact resistance, good ageing resistance, and can be produced at low cost. | 11-20-2014 |
20150282566 | SPORTS SHOE COMPRISING STUDS OR STUD RECEIVERS - The invention relates to studded shoes which comprise metal studs and a plastics sole. Studs and sole are connected to one another by a coating of an adhesion promoter composition, wherein the composition comprises at least one copolyamide-based hot-melt adhesive. The studded shoe can be used in the sports sector or hiking sector. | 10-08-2015 |
20150361304 | PROCESS FOR PRODUCING A METAL-PLASTIC HYBRID COMPONENT - The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive. | 12-17-2015 |
20150361316 | ADHESION PROMOTER COMPOSITIONS AND PRIMER COMPOSITIONS FOR METAL-PLASTIC HYBRID COMPONENTS - The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive. | 12-17-2015 |
20150375478 | FIBRE COMPOSITE HYBRID COMPONENTS - The invention relates to hybrid components comprising at least one fibre composite material as material B and at least one material A. Material A is selected from plastics, metals, ceramic compositions, wood, glass, composite materials, textile fibres and from prefabricated products produced from textile fibres. Material A is bonded to material B by at least one coating of an adhesion promoter composition comprising at least one copolyamide-based hotmelt adhesive. | 12-31-2015 |