Kuen-Yuan Hwang
Kuen-Yuan Hwang, Taipei TW
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20080255353 | METHOD FOR PREPARING MELAMINE SALT OF BIS(PENTAERYTHRITOL PHOSPHATE) PHOSPHORIC ACID - A method for producing a melamine salt of bis(pentaerythritol phosphate) phosphoric acid is proposed. The method includes the steps of reacting and mixing pentaerythritol and diphosphorous pentaoxide in an extruder to carry out esterification to produce bis(pentaerythritol phosphate) phosphoric acid; and mixing bis(pentaerythritol phosphate) phosphoric acid with melamine or a derivative thereof to carry out quaternization in the presence of a solvent, followed by removing water to obtain a melamine salt of bis(pentaerythritol phosphate) phosphoric acid. Diphosphorous pentaoxide is used in the method as a reactant, so that no hydrogen chloride is produced and it is not necessary to recollect trichlorophosphoric acid. Moreover, in the method of the present invention, such that esterification time can be shortened and a high pressure in a closed reaction system that causes explosion can be avoided. | 10-16-2008 |
20080262127 | FLAME RESISTANT RESIN COMPOSITION - A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability. Therefore, the resin composition is particularly useful in composite materials, forming materials or semiconductor packaging materials. | 10-23-2008 |
20100105939 | PHOSPHORUS-CONTAINING COMPOUND AND METHOD FOR PREPARING THE SAME - The present invention provides a phosphorus-containing compound of formula (I): | 04-29-2010 |
20100125154 | PHOSPHORUS COMPOUND AND METHOD FOR PREPARING THE SAME - The present invention provides a phosphorus compound of formula (I). | 05-20-2010 |
20110172324 | NOVEL WATER SOLUBLE POLYIMIDE RESIN, ITS PREPARATION AND USE - The present invention relates to a novel water soluble polyimide resin, which contains a hydrophilic functional group such as —OH, —COOH to increase the solubility of the polyimide resin in alkali aqueous solution, and is suitable for using as an insulation film in electronic and photoelectric products. The present invention also relates to preparation and use of the above polyimide. | 07-14-2011 |
Kuen-Yuan Hwang, Hsinchu County TW
Patent application number | Description | Published |
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20090258997 | Novel phosphorus-containing compounds and their preparing process and use - A series of novel phosphorus-containing compounds having the following formula are disclosed: | 10-15-2009 |
20100004426 | Phosphorus-containing compounds and their prepartion process and use - A series of novel phosphorus-containing compounds having the following formula is provided: | 01-07-2010 |
20100016585 | PHOSPHORUS-CONTAINING BISPHENOLS AND PREPARING METHOD THEREOF - The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the general formula (1) includes reacting compounds respectively defined by a general formula (a), (b), (c) and an acid catalyst to yield compounds of phosphorus-containing bisphenol. | 01-21-2010 |
20110172384 | PHOSPHORUS-CONTAINING EPOXY RESIN AND METHOD FOR SYNTHESIZING THE SAME - A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9. | 07-14-2011 |
20120116078 | PHOSPHORUS-CONTAINING BISPHENOLS AND PREPARING METHOD THEREOF - The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the formula (1) includes reacting compounds respectively defined by a formula (a), (b), (c) and an acid catalyst to yield compounds of phosphorus-containing bisphenol. | 05-10-2012 |
20130005938 | PHOSPHORUS-CONTAINING COMPOUNDS AND THEIR PREPARATION PROCESS AND USE - A series of novel phosphorus-containing compounds having the following formula is provided: | 01-03-2013 |
20140088283 | PHOSPHORUS-CONTAINING COMPOUNDS AND THEIR PREPARATION PROCESS AND USE - A series of novel phosphorus-containing compounds having the following formula is provided: | 03-27-2014 |
20150218316 | PHOSPHOROUS-CONTAINING COMPOUNDS AND THEIR PREPARATION PROCESS AND USE - A series of novel phosphorus-containing compounds having the following formula is provided: | 08-06-2015 |
Kuen-Yuan Hwang, Taipei City TW
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20090171120 | PHOSPHORUS-BASED OXAZINE COMPOUNDS AND PREPARATION METHOD OF THE SAME - The present invention provides phosphorus-based oxazine compounds and the preparation method thereof. The phosphorus-based oxazine compounds of the present invention can provide better fire-resistant characteristics, while the preparation method for the phosphorus-based oxazine compound of the present invention can offer high yields and/or high purity phosphorus-based oxazine compounds. | 07-02-2009 |
Kuen-Yuan Hwang, Hukou Township TW
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20160083360 | PROCESS FOR THE EPOXIDATION OF OLEFINS - The subject invention is related to a process for the epoxidation of olefin with peroxide, comprising reacting peroxide with olefin in the presence a solvent, wherein the solvent has Hansen Solubility Parameters (HSPs) of δ | 03-24-2016 |