Kuah
Aikmeng Kuah, Pflugerville, TX US
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20100292850 | Oil pressure controlling apparatus and system comprising same - An oil flow control system has a flow control device and an oil accumulator controller. The flow control device includes a body, a passage extending through the body, and a flow control portion configured for selectively controlling flow through the passage. The oil accumulator controller is coupled to an actuation portion of the flow control device and is configured for receiving an engine oil pressure indicating signal from an engine oil pressure sensor, for receiving Minimum Engine Lubrication Oil Pressure (MELOP) threshold computing information for an engine comprising the engine oil pressure sensor, and for causing the actuation portion to manipulate the flow control portion in a manner resulting in the flow control portion affecting flow through the passage. Causing the actuation portion to manipulate the flow control portion is performed dependent upon the engine oil pressure indicating signal and a MELOP threshold computed using said MELOP threshold computing information. | 11-18-2010 |
Bengkit Kuah, Singapore SG
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20120105096 | Assessing Connection Joint Coverage Between a Device and a Printed Circuit Board - The present disclosure relates to assessing coverage of a connection joint, such as a solder joint, between a device and a printed circuit board (PCB). In accordance with various embodiments, a PCB includes a conductive thermal pad adapted to be electrically and mechanically connected to an exposed pad of a component by an intervening connection joint to establish a thermal path to dissipate thermal energy from the component. An isolated test via that extends through the conductive thermal pad in non-contacting relation thereto, the test via adapted to mechanically and electrically contact said intervening connection joint. A coverage characteristic of the intervening connection joint can be determined in relation to application of an electrical signal to the test via. | 05-03-2012 |
Kim Hann Kuah, Singapore SG
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20090259478 | Audio Decoding Apparatus and Decoding Method and Program - An energy corrector ( | 10-15-2009 |
Leng Cher Kuah, Singapore SG
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20100027233 | MICROELECTRONIC PACKAGES WITH SMALL FOOTPRINTS AND ASSOCIATED METHODS OF MANUFACTURING - Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate, a first die carried by the substrate, and a second die between the first die and the substrate. The first die has a first footprint, and the second die has a second footprint that is smaller than the first footprint of the first die. The package further includes an adhesive having a first portion adjacent to a second portion. The first portion is between the first die and the second die, and the second portion being between the first die and the substrate. | 02-04-2010 |
Teng Hock Kuah, Singapore SG
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20080277829 | COMPRESSION MOLDING OF AN ELECTRONIC DEVICE - A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities. | 11-13-2008 |
20120013040 | SUBSTRATE CARRIER FOR MOLDING ELECTRONIC DEVICES - A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant. | 01-19-2012 |
20120312231 | APPARATUS FOR THIN-FILM DEPOSITION - An apparatus | 12-13-2012 |
20130333620 | FEED-THROUGH APPARATUS FOR A CHEMICAL VAPOUR DEPOSITION DEVICE - A feed-through apparatus for a chemical vapor deposition device including: a feed-through main body; a plurality of runner units; and a feed-through device rotatable with respect to the plurality of runner units within the feed-through main body. Each runner unit has a fluid inlet and an elongated runner for receiving the fluid from the fluid inlet wherein the elongated runner extends spirally on a surface of the runner unit. The feed-through device has a plurality of feed-through device orifices for receiving fluids from corresponding elongated runners during rotation of the feed-through device and has outlet-orifices for releasing the fluids into a reactor chamber. | 12-19-2013 |
20140284404 | CHEMICAL VAPOUR DEPOSITION INJECTOR - Disclosed is a chemical vapour deposition injector 100, comprising a gas injector body 104 having a plurality of holes for directing a first gas from a first gas plenum into respective first gas channels of the gas injector body, each first gas channel extending in a first direction and arranged to branch into separate flow paths; a plurality of discrete first conduits, each first conduit being arranged to connect to a respective one of the discrete flow paths for carrying the first gas to a reaction chamber; a second gas channel for directing a second gas from a second gas plenum into the gas injector body, the second gas channel having a longitudinal axis which extends in a second direction transverse to the first direction; and a plurality of discrete second conduits coupled to the second gas channel and arranged to carry the second gas from the second gas channel to the reactor chamber; wherein at least some of the discrete second conduits are arranged between the discrete first conduits. | 09-25-2014 |
Teng Hock Eric Kuah, Singapore SG
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20100090357 | OPTICAL DEVICE MOLDING SYSTEM - A substrate having a plurality of protrusion members on its surface is molded by a molding system comprising first and second molds cooperating to apply a clamping force onto the substrate for molding, and a middle plate located between the first and second molds such that the substrate is clamped between the middle plate and the first mold during molding. A plurality of molding cavities is located on the second mold and through-holes formed in the middle plate correspond to positions of the molding cavities, such that each through-hole is sized and configured for inserting a protrusion member of the substrate to enable each protrusion member to be in communication with a molding cavity of the second mold. Molding compound is molded onto the protrusion members by the molding cavities during molding. | 04-15-2010 |
Woon Hua Edwin Kuah, Singapore SG
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20110154781 | METHOD AND SYSTEM FOR LOADING DIGITAL CONTENT INTO A DIGITAL STORAGE DEVICE AND SUBSEQUENT PACKAGING - There is provided a method for loading varied pre-determined digital content into a plurality of digital storage devices, and subsequently providing each digital storage device with varied pre-determined accessories. It is preferable that the digital content loaded into the digital storage device is not identifiable at the digital content loading post, and the consolidated digital storage device and the pre-determined accessories are shipped to particulars of the shipping label. A corresponding system is also provided. | 06-30-2011 |
Yong Cheun Kuah, Belfast GB
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20130058852 | REMOVAL OF CARBON DIOXIDE FROM A GAS STREAM BY USING AQUEOUS IONIC LIQUID - The present invention relates to the separation of gases, and more specifically to an inventive process for the removal of carbon dioxide gas using carefully selected ionic liquid absorbents together with water in a carefully selected ratio. | 03-07-2013 |