Ku, TW
Cheng-Chang Ku, Shindian City TW
Patent application number | Description | Published |
---|---|---|
20100134964 | Electronic Device - An electronic device having a main housing defining a cavity, a display screen supported by the main housing, and a motherboard positioned within the cavity behind the display screen. The electronic device has a keyboard assembly, camera assembly, and/or desktop stand assembly. | 06-03-2010 |
Cheng-Hu Ku, Jhongli TW
Patent application number | Description | Published |
---|---|---|
20100139429 | ACTUATOR FOR LIFTING DEVICE - An actuator includes a base, a motor mounted on the base for driving a worm to rotate a worm gear of a transmission gear set that is set in an accommodation chamber inside the base and has a gear shaft pivotally inserted through the worm gear and fixedly mounted with an output gear, a brake module rotatable with said worm gear, a linking rod assembly having a driven gear meshed with the output gear, a screw rod rotatable with the driven gear, a movable member threaded onto the screw rod and an extension rod connected to the movable block and movable in and out of a sleeved outside the base upon rotation of the screw rod for biasing a crane beam of a lifting device. | 06-10-2010 |
Chen-Hao Ku, Taichung County TW
Patent application number | Description | Published |
---|---|---|
20110244626 | METHOD OF FORMING SOLAR CELL - A method of forming solar cell includes the following steps. A substrate having a first region and a second region is provided. A dopant source layer is then formed on the substrate. A laser beam is used to locally irradiate the dopant source layer corresponding to the first region to locally diffuse the dopants of the dopant source layer on the first region downward into the substrate. The laser beam also changes the surface property of the substrate in the first region to form a visible patterned mark. The dopant source layer is then removed, and a patterned electrode is formed on the first region of the substrate using the visible patterned mark as an alignment mark. | 10-06-2011 |
Chen-Liang Ku, Taipei Hsien TW
Patent application number | Description | Published |
---|---|---|
20100230140 | RIGID-FLEX PRINTED CIRCUIT BOARD MODULE, AND MANUFACTURING METHOD AND PROCESSING METHOD THEREFOR - A rigid-flex printed circuit board module includes a non-working zone and a working zone. The non-working zone defines a receiving space. The working zone is disposed in the receiving space, and is connected to the non-working zone through a plurality of interconnecting zones. The interconnecting zones are flexible regions having greater flexibility than the non-working zone, and are of the same thickness and material. The interconnecting zones are defined by flexible circuit board member such that the interconnecting zones can be quickly cut off using a single machine during processing of the rigid-flex printed circuit board module. Thus, the speed of separating the working zone from the non-working zone can be increased, and costs and time associated with processing and manufacturing can be reduced. Additionally, the processing flow can be simplified, and the product quality of the working zone after cutting can be ensured. | 09-16-2010 |
Chen-Nan Ku, Shin-Dian TW
Patent application number | Description | Published |
---|---|---|
20110094074 | Pick-and-place device for ICs - A pick-and-place device for ICs according to the present invention comprises a base, a plurality of rotational structures, a plurality of pick-and-place structures, a transmission structure, and a driving structure. The pick-and-place structures are mounted on the base, and individually have one nozzle. The nozzles can move up-and-down respectively. The rotational structures are mounted on the base, and drive the nozzles to rotate. The transmission structure is assembled with the rotational structures, and drives the rotational structures to rotate. The driving structure is mounted on the base. The driving structure drives the transmission structure. The transmission structure further drives the rotational structures to rotate so that the nozzles are rotated. The nozzles are rotated driven by the rotational structures, ICs can be rotated following up the rotation of the nozzles during the pick-and-place process. Therefore, an advantage of the present invention is to enhance the convenience during the pick-and-place process. | 04-28-2011 |
Chen-Wei Ku, New Taipei City TW
Patent application number | Description | Published |
---|---|---|
20110139675 | Wafer container with at least one purgeable supporting module having a long slot - A Front Opening Unified Pod (FOUP) having a purgeable supporting module disposed at the junction of each sidewall and the backwall of the container, the characteristic of the FOUP being in that: the purgeable supporting module has a buffer gas chamber and a gas inlet is disposed at one end of the buffer gas chamber and connected to a gas valve on the bottom surface, an outgassing channel is disposed on the purgeable supporting module facing the opening of the FOUP, a long slot is disposed on one side of the outgassing channel and a kind of porous material is disposed in the long slot, an airflow channel being disposed between and thus connecting the outgassing channel and the buffer gas chamber, and a plurality of supporting ribs being vertically disposed on one side of the long slot at intervals. | 06-16-2011 |
20110266193 | Wafer Container With Purgeable Supporting Module - A wafer container includes a container body, composed of a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each sidewall to of the container body and the back wall, a long slit is further disposed on the side of purgeable supporting module facing the opening and a porous material is disposed within the long slit, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to a gas valve, wherein the purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals. | 11-03-2011 |
20120175279 | EUV POD WITH FASTENING STRUCTURE - An EUV pod with fastening structure comprises an outer pod and an inner pod, wherein the upper cover of the inner pod is disposed with a plurality of retainers, and a plurality of supporters disposed on the outer pod of the EUV pod are used to press the plurality of retainers for the plurality of retainers to fasten and stabilize the reticle in the inner pod and thus ensure safety and stability of the reticle in the pod; by utilizing such design, risks of collisions of reticle in the pod due to vacillation of EUV pod during transportation can be reduced, and cost incurred by cracks and damages of reticles can also be greatly decreased. | 07-12-2012 |
20120267380 | Transmission box for Reticle POD - A transmission box using AMHS for transferring reticle pod is provided, wherein an OHT (Overhead Hoist Transfer) system is disposed on the transmission box to perform mechanical transferring of the reticle pod for greatly reducing risks of damaging reticles caused by operators when transferring, streamlining the allocation of operators, and thus decreasing the time needed for process to complete. | 10-25-2012 |
20130126378 | RETICLE POD WITH DRAIN STRUCTURE - A reticle pod with drain structure comprises an outer container and an inner container, wherein an upper cover of inner container is disposed with a plurality of retainers, and a plurality of supporters disposed on the outer container are used to press the retainers for fastening and stabilizing the reticle in the inner container and thus ensuring safety and stability of the reticle in the reticle pod. Collision risks of the reticle in the reticle pod due to vacillation of reticle pod during transportation can be reduced. Cost of reticles also can be greatly decreased. Further, a plurality of drain holes is disposed on a lower cover of the outer container for draining the remained water in the outer container. It will be done without disassembling the lower cover of outer container for reducing the contamination opportunity in the pod and preventing from wasting of labor and time for disassembling. | 05-23-2013 |
20130248400 | CONTAINER FOR STORING SEMICONDUCTOR DEVICE - A container for storing semiconductor devices is revealed. The container includes a receiving body and a cover. The receiving body is disposed with at least one fastener and at least one driver therein. The fastener includes a rolling element that is in contact with the driver. When the driver is rotated, it drives the fastener to move in the receiving body. At least one fixing part of the fastener is moved toward at least one fastening part of the cover. The cover is fixed on the receiving body by the fixing part locked in the fastening part. Moreover, friction between the fastener and the driver is minimized by the rolling element which reduces contact area between the fastener and the driver so as to prevent production of contaminants in the container and protect semiconductor devices stored in the container from being polluted. Thus the container is of high cleanness. | 09-26-2013 |
20130248413 | CONTAINER FOR STORING SEMICONDUCTOR DEVICE - A container for storing semiconductor devices is revealed. The container includes a receiving body, a seal plate, and a cover. At least one fastener and at least one driver are mounted in the receiving body. The seal plate is fastened under the receiving body and against the driver so as to fix the driver on the receiving body. When the driver is rotated, the fastener is driven to move in the receiving body by the driver. At least one fixing part of the fastener is moved toward at least one fastening part of the cover. By the fixing part locked in the fastening part, the cover is fixed on the receiving body. Thus a force opposite to the rotating shaft will not be generated around a periphery of the driver. Therefore stability of the rotating driver is improved and the container is opened and closed smoothly. | 09-26-2013 |
Chen-Wei Ku, Tucheng City TW
Patent application number | Description | Published |
---|---|---|
20110062052 | Front Opening Unified Pod disposed with purgeable supporting module - A Front Opening Unified Pod (FOUP) having a purgeable supporting module disposed at the junction of each sidewall and the backwall of the container, the characteristic of the FOUP being in that: the purgeable supporting module has a buffer gas chamber and a gas inlet is disposed at one end of the buffer gas chamber and connected to a gas valve on the bottom surface, an outgassing channel is disposed on the purgeable supporting module facing the opening of the FOUP, and a long slot is disposed on one side of the outgassing channel, an airflow channel being disposed between and thus connecting the outgassing channel and the buffer gas chamber, and a plurality of supporting ribs being vertically disposed on one side of the long slot at intervals. | 03-17-2011 |
20120018347 | Reticle POD with Sensor - An EUV pod with pressure sensors disposed between its inner container and outer container, wherein pressure sensors disposed on the inner side of the outer container are used to detect the pressure between the outer container and the inner container, and the pressure data are used to determine whether the inner container is firmly fastened by the outer container. | 01-26-2012 |
20120037522 | Reticle Storing Container - A reticle storing container is disclosed to include an outer container, an inner container, and a purging valve. The outer container comprises a container body and a container base on which at least a first through-hole is disposed, and a first inner space is formed between the container body and the container base for storing the inner container. The inner container comprises a top cover and a bottom base on which at least a second through-hole connected to the first through-hole is disposed, and a second inner space is formed between the top cover and the bottom base for storing a reticle. The purging valve is disposed in the first through-hole on the outer container base and connected to the second through-hole of said inner container, wherein the purging valve comprises a spring and a valve part. Thus, when the valve part is propped up by a purging head, the valve part compresses the spring for the purging valve to be connected to the purging head. And a filter material is disposed on the joint portion between the container body and the container base to prevent the interior of the reticle from being contaminated. | 02-16-2012 |
Chen-Wei Ku, Taoyuan Hsien TW
Patent application number | Description | Published |
---|---|---|
20110157928 | DC-TO-AC CONVERTING CIRCUIT WITH WIDE INPUT VOLTAGE - A DC-to-AC converting circuit includes a transformer, a first modulation switching circuit, a second modulation switching circuit and a third modulation switching circuit, an inverter switching circuit and a controlling unit. Under control of the controlling unit, two of the first, second and third modulation switching circuits are selectively enabled according to the magnitude of the input voltage, so that electric energy of the input voltage is magnetically transmitted to the first primary winding, a second primary winding or a serially-connected winding assembly of the first primary winding and the second primary winding, and a turn ratio of the transformer is adjustable. | 06-30-2011 |
20130010512 | DC-AC CONVERTER - Disclosed is a DC-AC converter including a switch circuit for converting the DC power to output an AC voltage between a first output terminal and a second output terminal. The switch circuit includes a first switch branch having a first switch element and a second switch element; a second switch branch having a third switch element, a fourth switch element, and a fifth switch element; and a sixth switch element having one end connected between the third switch element and the fourth switch element and the other end connected between the first switch element and the second switch element. The first switch element, the second switch element, the third switch element, the fourth switch element, the fifth switch element, and the sixth switch element are configured to turn on/off to enhance the conversion efficiency of the DC-AC converter and subdue the occurrence of leak current in the DC-AC converter. | 01-10-2013 |
20130016543 | DC TO AC CONVERTERAANM KU; Chen-WeiAACI TAOYUAN HSIENAACO TWAAGP KU; Chen-Wei TAOYUAN HSIEN TWAANM LEE; Lei-MingAACI TAOYUAN HSIENAACO TWAAGP LEE; Lei-Ming TAOYUAN HSIEN TW - A DC to AC converter includes a first switch, a second switch, a first half bridge inverter, and a second half bridge inverter. The first switch includes a first terminal and a second terminal. The second switch includes a first terminal and a second terminal. A portion between the first terminal of the first switch and the first terminal of the second switch is operable to receive a direct current power source. The first half bridge inverter includes a first terminal, a second terminal, and an output terminal. The second half bridge inverter includes a first terminal, a second terminal, and an output terminal. A portion between the output terminal of the first half bridge inverter and the output terminal of the second half bridge inverter is operable to output an alternative current. | 01-17-2013 |
20130016550 | INVERTERAANM Ku; Chen-WeiAACI Taoyuan HsienAACO TWAAGP Ku; Chen-Wei Taoyuan Hsien TWAANM Lee; Lei-MingAACI Taoyuan HsienAACO TWAAGP Lee; Lei-Ming Taoyuan Hsien TWAANM Huang; HoAACI Taoyuan HsienAACO TWAAGP Huang; Ho Taoyuan Hsien TW - An inverter including a switch circuit for converting a DC power to output an AC voltage between a first output terminal and a second output terminal is provided. The switch circuit includes a first switch branch having a first switch element, a second switch element, and a third switch element; a second switch branch having a fourth switch element, a fifth switch element, and a sixth switch element; a first freewheeling unit connected to the first switch element, the second switch element, and the second output terminal for providing a freewheeling path between the second output terminal and the first switch element and the second switch element; and a second freewheeling unit connected to the fourth switch element and the fifth switch element and the first output terminal for providing a freewheeling path between the first output terminal and the fourth switch element and the fifth switch element. | 01-17-2013 |
Chia-Yu Ku, Miaoli County TW
Patent application number | Description | Published |
---|---|---|
20090290551 | CHANNEL UTILIZING METHOD AND SYSTEM FOR WIRELESS NETWORKS - A channel utilizing method for a wireless network is adapted for channel utilization by a switch node having a number (N) of transceivers in an environment with a number (M) of channels, wherein (N)<(M). The channel utilizing method includes the steps of: calculating a channel weight set, and selecting one of the (M) channels according to the channel weight set; determining a notify mechanism according to a relation between the switch node and a neighbor node; using the notify mechanism to notify the neighbor node of a current state of the switch node; and calculating a channel stay-in period, and causing the switch node to stay in the selected one of the channels for a duration of the channel stay-in period. A channel utilizing system is also disclosed. | 11-26-2009 |
20100142555 | FRAME-MERGING APPARATUS AND METHOD - A frame-merging method is adapted for a network that includes mesh and terminal units, in which any two units capable of communication form a communication pair, and one of the units operates as a key unit to transmit pending frames according to the frame-merging method. The frame-merging method includes: determining whether the key unit is a mesh or a terminal unit; for the communication pair recorded in each pending frame, selecting a suitable scheme from a plurality of frame-merging schemes, and extracting at least one of the pending frames from among the pending frames for use as part or all of a priority frame set; and comparing a total size of all frames included in the priority frame set with a suitable frame size, so as to determine whether the key unit is to send an aggregated frame. A frame-merging apparatus is also disclosed. | 06-10-2010 |
Chieh-Huan Ku, Sijhih City TW
Patent application number | Description | Published |
---|---|---|
20080310939 | SYSTEM AND METHOD FOR USE IN A LITHOGRAPHY TOOL - A system for use in semiconductor manufacture including a process tool for processing wafers; a buffer coupled to the process tool for holding wafer waiting to be processed by the process tool; an input load port coupled to the buffer for feeding in wafers ready for processing from a load-in container; an output load port coupled to the process tool for feeding out wafers that have been processed by the process tool to a load-out container; and a track module for transporting the wafers between the buffer, the process tool, and the input and output load ports. | 12-18-2008 |
Chien-Ping Ku, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20100231496 | DISPLAY METHOD ON ACTIVE MATRIX DISPLAY - The present invention provides a display method of an active matrix display. First, image data is provided, and the image data is divided into a first image section and a second image section. Next, a first black frame section and a second black frame section are respectively inserted into the first image section and the second image section to form a first frame and a second frame. Then, the first frame and the second frame are displayed in turn so as to display the image data. | 09-16-2010 |
Chien-Te Ku, Pingjhen City TW
Patent application number | Description | Published |
---|---|---|
20090167146 | WHITE-LIGHT FLUORESCENT LAMP HAVING LUMINESCENCE LAYER WITH SILICON QUANTUM DOTS - A structure is formed by putting glass plates between a luminescence generating device and an electron emitting device so that a vacuum is formed in between. After in putting a high-voltage, an electron beam is emitted from the electron emitting device using low power. In the end, silicon quantum dots in the luminescence generating device are excited to generate a white light. The present invention has a good optoelectronic transformation efficiency. | 07-02-2009 |
Chih-Cheng Ku, Hsinchu Hsien TW
Patent application number | Description | Published |
---|---|---|
20120023353 | AUTOMATIC MODE SWITCH PORTABLE ELECTRONIC DEVICE - A portable electronic device having automatic power supply mode switching is provided. The portable electronic device includes a micro-sensor and a control circuit. The control circuit controls operations of the electronic device, the micro-sensor senses whether the electronic device is carried or worn by a user. When the electronic device operates in a normal mode, and if the electronic device is not carried or worn for a time longer than a buffer period of a predetermined interval, the control circuit switches to a sleep mode, which results in lower power consumption. | 01-26-2012 |
Chin-Ching Ku, Chu Pei City TW
Patent application number | Description | Published |
---|---|---|
20080240913 | FAN FRAME WITH DIVERSION STRUCTURE - The present invention provides an improved fan frame with a diversion structure. A cooling fan includes a rotor, and fan blades spaced around the rotor at intervals. The fan frame positions the rotor and defines a diversion loop, which corresponds to the air outlet direction when fan blades are turning and has an expanding diversion surface. The fan frame has a diversion surface with diversion ribs spaced at intervals, the placement of the diversion ribs being in a vortex pattern without passing through the hypothetical point of the rotor center. The airflow generated by turning fan blades is guided by the diversion ribs and converted to outlet airflow in axial direction corresponding to the rotor, effectively reducing impact and friction of the gyrate airflow generated by fan blades against the frame diversion surface, lowering the noise level, making air exhaustion smoother, and improving the cooling efficiency of fan. | 10-02-2008 |
Ching-Shun Ku, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20110177677 | METHOD OF THIN FILM EPITAXIAL GROWTH USING ATOMIC LAYER DEPOSITION - A method of thin film epitaxial growth using atomic layer deposition is provided by introducing a first deposition precursor and a second deposition precursor into a chamber after a vent valve connected between the chamber and a vacuum pump is closed. The chamber is maintained in a thermal equilibrium state and a constant pressure as a result of keeping the first deposition precursor and the second deposition precursor inside the chamber thereby reducing deposition precursors consumption and achieving thin film epitaxial growth on the substrate. | 07-21-2011 |
20130209685 | DOPING METHOD OF ATOMIC LAYER DEPOSITION - A doping method of atomic layer deposition includes providing a substrate in a reaction chamber; and performing at least one atomic layer deposition cycle to form a film on a surface of the substrate. The atomic layer deposition cycle includes passing first precursors into the reaction chamber to let first atoms included in the first precursors combine with reaction sites of the substrate; and passing second precursors into the reaction chamber to let second atoms included in the second precursors combine with the reaction sites uncombined with the first atoms or substitute at least part of the first atoms to combine with the reaction sites of the substrate. The above-mentioned doping method of atomic layer deposition is capable of preparing large area and uniformity of doping film without annealing process or with low temperature annealing process. | 08-15-2013 |
Chin Jen Ku, Miaoli TW
Patent application number | Description | Published |
---|---|---|
20100300311 | Squeegee operating device for screen printing machine - A screen printing machine includes a platen for supporting a substrate to be printed, a printing screen disposed above the platen, a squeegee to be moved across the printing screen in order to force an ink through the printing screen and onto the substrate, a conveyer device disposed below the platen, and a squeegee actuating device supported on the conveyer device, the squeegee actuating device includes a housing having a chamber for receiving one or more electromagnetic devices each of which include a coil having a compartment for receiving a core, and a magnet disposed above the core and secured to the core and the housing for being actuated by the core to selectively attract the squeegee to press onto the printing screen and to selectively release the squeegee. | 12-02-2010 |
Chin-Yu Ku, Hsin-Chu TW
Patent application number | Description | Published |
---|---|---|
20100314756 | Interconnect Structures Having Lead-Free Solder Bumps - An integrated circuit structure includes a semiconductor substrate, and a polyimide layer over the semiconductor substrate. An under-bump-metallurgy (UBM) has a first portion over the polyimide layer, and a second portion level with the polyimide layer. A first solder bump and a second solder bump are formed over the polyimide layer, with a pitch between the first solder bump and the second solder bump being no more than 150 μm. A width of the UBM equals one-half of the pitch plus a value greater than 5 μm. | 12-16-2010 |
Chiung-Ching Ku, Zhubei City TW
Patent application number | Description | Published |
---|---|---|
20080211793 | Driving apparatus for an OLED panel - A driving apparatus for an OLED panel comprises a common timing controller with a multi-line addressing algorithm and a segment controller with the multi-line addressing algorithm, to control a common driver and a segment driver, respectively, to drive the OLED panel. The common driver and the segment driver are connected to common lines and segment lines of the OLED panel, respectively. According to the multi-line addressing algorithm, the common driver can select at least two of the common lines at a same time. | 09-04-2008 |
Chiung-Ching Ku, Hsinchu County TW
Patent application number | Description | Published |
---|---|---|
20120300954 | Noiseless Motor Apparatus and Denoise Driver - A motor apparatus includes a motor, a speaker for generating a denoise sound wave according to a speaker driving signal to offset a noise generated by the motor, and a driving device including a memory for storing a noise characteristic information of the motor, a control circuit for determining a rotation speed and a rotation angle of the motor to generate a rotation information and generating a noise simulation information according to the rotation information and the noise characteristic information, a motor driver for driving the motor according to the rotation information, and an active denoise circuit including a synthesizer for generating an inverted noise simulation signal according to the noise simulation information, and a speaker driver for generating the speaker driving signal according to the inverted noise simulation signal. | 11-29-2012 |
20140159871 | Active Electronic Tag Apparatus for Memory Card - An active electronic tag for a memory card is disclosed herein. The active electronic tag includes an antenna, a first amplifier, an automatic gain control circuit, a phase synchronization locking circuit, a decoding and TX/RX control unit and a second amplifier. The antenna receives a detecting signal transmitted from a card reader, in which the detecting signal is carried on a first carrier. The phase synchronization locking circuit generates a positive carrier and a negative carrier with a phase difference of 180 degree. The decoding and TX/RX control unit generates a response signal, which is carried on the negative carrier. By utilizing the phase difference of the first carrier and the negative carrier, the response signal cancels the first carrier on the card reader, so as to transmit the information saved inside the active electronic tag. | 06-12-2014 |
Chung-Ping Ku, Yangmei Township TW
Patent application number | Description | Published |
---|---|---|
20110043177 | CONTROL DEVICE FOR AN INTERLEAVING POWER FACTOR CORRECTOR - In an interleaving power factor corrector, a control device interleavingly drives first and second converting circuits such that the power factor corrector generates a voltage output (Vo), and includes first and second control modules generating respectively first and second driving signals (Q_master, Q_slave) that correspond respectively to first and second control signals for controlling operations of power switches of the first and second converting circuits. A phase modulating module generates a reset signal (S_PTCL) based on an inverted first driving signal (Qn_master) and a feedback compensation signal (Vcomp) outputted by the first control module, and a reset signal (S_syn) outputted by the second control module. When one of the reset signals (S_syn, S_PTCL) has a predetermined level, the second driving signal (Q_slave) has a level for switching the power switch of the second converting circuit to an OFF-mode. | 02-24-2011 |
Chung-Ping Ku, Taipei Hsien TW
Patent application number | Description | Published |
---|---|---|
20090153217 | Active Clamp Switching Circuit - An active clamp switching circuit includes a transformer having a primary winding and a secondary winding, a first switch, a capacitor, an impedance device, a second switch and a rectifier. The capacitor, the impedance device and the second switch form a reset loop for the primary winding so that the impedance device lowers the electric current going through the second switch, preventing burnout of the second switch. | 06-18-2009 |
Chun-Yuan Ku, Hsin-Chu TW
Patent application number | Description | Published |
---|---|---|
20120097246 | SOLAR CELL AND METHOD OF MAKING THE SAME - A solar cell includes a crystalline semiconductor substrate; a first crystalline semiconductor layer; an amorphous semiconductor layer; a first metal electrode layer and a second metal electrode layer. The crystalline semiconductor substrate has a first surface and a second surface, and the crystalline semiconductor substrate has a first doped type. The first crystalline semiconductor layer is disposed on the first surface of the crystalline semiconductor substrate, where the first crystalline semiconductor layer has a second doped type contrary to the first doped type. The amorphous semiconductor layer is disposed on the first crystalline semiconductor layer, and the amorphous semiconductor layer has the second doped type. The first metal electrode layer is disposed on the amorphous semiconductor layer. The second metal electrode layer is disposed on the second surface of the crystalline semiconductor substrate. | 04-26-2012 |
Feng-Hao Ku, Miao-Li County TW
Patent application number | Description | Published |
---|---|---|
20110124208 | SOCKET ASSEMBLY FOR FIXING AN IC ON A CIRCUIT PLATE - An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion. Wherein when the IC is attached to the socket, the first buckling portion and the second buckling portion are initially disengaged from each other, pins of the IC is electrically connected with the electric portions, the first buckling portion and the second buckling portion are brought together with the elastic connecting portions elastically deforming, and the first buckling portion and the second buckling portion are locked together and hold the IC in the socket. | 05-26-2011 |
Fu-Tien Ku, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20120127117 | CAPACITIVE TOUCHSCREEN STRUCTURE - A capacitive touchscreen structure comprises in sequence a surface substrate including a top surface having a touch area, and a bottom surface opposite to the top surface; and a transparent conductive layer formed on the bottom surface of the surface substrate and having at least one electrode pattern arranged on the lateral side of the transparent conductive layer. When an external voltage is applied to the electrode pattern, a surface capacitance is generated on the touch area and variation of the surface capacitance is detected to determine a position where a user touches. A terminal impedance exists between the electrode patterns and has a value of 800-2000Ω. As the surface substrate is arranged on the surface of the overall capacitive touchscreen structure of the present invention, the capacitive touchscreen structure of the present invention is more durable and has higher yield. | 05-24-2012 |
20130319840 | ONE-PIECE LAMELLAR PROJECTIVE CAPACITIVE TOUCH PANEL STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A one-piece lamellar projective capacitive touch panel structure includes a substrate unit, a conductive unit, an insulating unit and a signal transmitting unit. The substrate unit includes a transparent substrate and a surrounding opaque layer formed on the bottom surface of the transparent substrate. The conductive unit includes a transparent conductive layer formed on the bottom surface of the transparent substrate to cover the surrounding opaque layer and a surrounding electrode layer formed on the bottom surface of the transparent conductive layer, and a terminal resistance substantially between 2000Ω and 2500Ω generated by the surrounding electrode layer. The insulating unit includes an insulating layer formed on the bottom surface of the transparent conductive layer to cover the surrounding electrode layer. The signal transmitting unit includes a signal transmitting cable between the surrounding electrode layer and the insulating layer and electrically connected to the surrounding electrode layer. | 12-05-2013 |
Hao-Wei Ku, Zhudong Township TW
Patent application number | Description | Published |
---|---|---|
20120097986 | WAFER LEVEL REFLECTOR FOR LED PACKAGING - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 04-26-2012 |
20120098006 | LIGHT EMITTING DIODE PACKAGE WITH PHOTORESIST REFLECTOR AND METHOD OF MANUFACTURING - Optical emitters are fabricated by forming and shaping photoresist reflectors on a package wafer using lithography processes, and bonding Light-Emitting Diode (LED) dies to the package wafer. | 04-26-2012 |
20120241784 | LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS AND METHODS OF MAKING THE SAME - A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material. | 09-27-2012 |
20130299855 | Wafer Level Reflector for LED Packaging - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 11-14-2013 |
Huei-Ting Ku, Dashu Township TW
Patent application number | Description | Published |
---|---|---|
20100067225 | LIGHT EMITTING DIODE LAMP TUBE - A light emitting diode (LED) lamp tube includes a tubular enclosure extending along an axial direction and having an inner peripheral surface. A lamp device is disposed in the enclosure, and includes a circuit board, and a plurality of LEDs electrically connected to the circuit board. Two connectors are disposed respectively at two ends of the enclosure and are electrically connected to the circuit board. The connectors are adapted to be electrically connected to a power source. An optical film unit is disposed on the inner peripheral surface of the enclosure. The optical film unit has a film body and a plurality of protrusions arranged along the axial direction and protruding from the film body toward the inner peripheral surface of the enclosure. | 03-18-2010 |
Huei-Ting Ku, Kaohsiung County TW
Patent application number | Description | Published |
---|---|---|
20100067230 | LIGHT EMITTING DIODE LAMP TUBE - A light emitting diode (LED) lamp tube includes a lamp device including a circuit board, and a plurality of LEDs mounted on the circuit board. The circuit board is disposed in a tubular enclosure such that an inner peripheral surface of the enclosure is divided into a non-illuminated portion and a light-receiving portion. The tubular enclosure has a plurality of tapered protrusions extending from the light-receiving portion toward the LEDs. Each of the tapered protrusions converges from the light-receiving portion toward the LEDs. Each of the tapered protrusions further has a maximum width at an outer end thereof, which increases gradually from a middle portion of the light-receiving portion toward junctions of the light-receiving portion and the non-illuminated portion. | 03-18-2010 |
20100072877 | LIGHT EMITTING DIODE LAMP TUBE - A light emitting diode (LED) lamp tube includes a circuit board and a tubular enclosure. The circuit board is disposed in the enclosure such that the enclosure is divided into a non-illuminated portion and a light-receiving portion. The light-receiving portion has two light-condensing side sections corresponding respectively to two sides of the circuit board, and a light-diffusing middle section connected between the light-condensing side sections. An outer surface of the light-receiving portion has a smoothly varying curvature. The light-condensing side sections cooperate with the light-diffusing middle section to diffuse uniformly LED light transmitted from an outer surface of the enclosure. | 03-25-2010 |
Keh-Chiang Ku, Sindan TW
Patent application number | Description | Published |
---|---|---|
20100013029 | Structure and a Method of Manufacture for Low Resistance NiSix - A device and a method for forming a metal silicide is presented. A device, which includes a gate region, a source region, and a drain region, is formed on a substrate. A metal is disposed on the substrate, followed by a first anneal, forming a metal silicide on at least one of the gate region, the source region, and the drain region. The unreacted metal is removed from the substrate. The metal silicide is implanted with atoms. The implant is followed by a super anneal of the substrate. | 01-21-2010 |
Keh-Chiang Ku, Sindan City TW
Patent application number | Description | Published |
---|---|---|
20080290420 | SiGe or SiC layer on STI sidewalls - A semiconductor structure includes a semiconductor substrate; an opening in the semiconductor substrate; a semiconductor layer in the opening and covering a bottom and sidewalls of the opening, wherein the semiconductor layer and the semiconductor substrate comprise different materials; and a dielectric material over the semiconductor layer and filling a remaining portion of the opening. | 11-27-2008 |
20080293204 | Shallow junction formation and high dopant activation rate of MOS devices - A method for forming a semiconductor structure includes providing a semiconductor substrate; forming a gate stack over the semiconductor substrate; implanting carbon into the semiconductor substrate; and implanting an n-type impurity into the semiconductor substrate to form a lightly doped source/drain (LDD) region, wherein the n-type impurity comprises more than one phosphorous atom. The n-type impurity may include phosphorous dimer or phosphorous tetramer. | 11-27-2008 |
20100096705 | IMPLANTATION METHOD FOR REDUCING THRESHOLD VOLTAGE FOR HIGH-K METAL GATE DEVICE - The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a high-k dielectric layer over a semiconductor substrate, forming a capping layer over the high-k dielectric layer, forming a metal layer over the capping layer, forming a semiconductor layer over the metal layer, performing an implantation process on the semiconductor layer, the implantation process using a species including F, and forming a gate structure from the plurality of layers including the high-k dielectric layer, capping layer, metal layer, and semiconductor layer. | 04-22-2010 |
20100105185 | REDUCING POLY-DEPLETION THROUGH CO-IMPLANTING CARBON AND NITROGEN - A method for forming a semiconductor structure includes providing a semiconductor substrate; forming a gate dielectric layer over the semiconductor substrate; forming a gate electrode layer over the gate dielectric layer; doping carbon and nitrogen into the gate electrode layer; and, after the step of doping carbon and nitrogen, patterning the gate dielectric layer and the gate electrode layer to form a gate dielectric and a gate electrode, respectively. | 04-29-2010 |
20100210086 | Junction Profile Engineering Using Staged Thermal Annealing - An annealing method includes performing an activation annealing on a wafer with a peak temperature of greater than about 1200° C., wherein the activation annealing has a first duration; and performing a defect-recovery annealing on the wafer at a defect-recovery temperature lower than the peak temperature for a second duration. The second duration is longer than the first duration. The annealing method includes no additional annealing steps at temperatures greater than about 1200° C., and no room-temperature cooling step exists between the activation annealing and the defect-recovery annealing. | 08-19-2010 |
20110272766 | High-K Metal Gate Device - A semiconductor device includes a semiconductor substrate and a transistor formed in the substrate, the transistor having a gate stack that has an interfacial layer formed on the substrate, a high-k dielectric layer formed over the interfacial layer, a metal layer formed over the high-dielectric layer, a capping layer formed between the interfacial layer and high-k dielectric layer; and a doped layer formed on the metal layer, the doped layer including at least F. | 11-10-2011 |
20110316079 | Shallow Junction Formation and High Dopant Activation Rate of MOS Devices - A semiconductor structure comprises a gate stack in a semiconductor substrate and a lightly doped source/drain (LDD) region in the semiconductor substrate. The LDD region is adjacent to a region underlying the gate stack. The LDD region comprises carbon and an n-type impurity, and the n-type impurity comprises phosphorus tetramer. | 12-29-2011 |
Ksuan-Chun Ku, Changhua County TW
Patent application number | Description | Published |
---|---|---|
20080252622 | SYSTEMS FOR DISPLAYING IMAGES AND DRIVING METHOD THEREOF - Systems for displaying images. The system comprises a signal driving circuit with X+1 shift registers connected in series, generating X+1 output pulses in sequence according to a start pulse and a clock signal, and a logic unit coupled to the X+1 shift registers, generating Z driving signals in sequence according to the X+1 output pulses and Y enabling signals, wherein Y, X and Z are integers, Y>1, X>0 and Z>X. | 10-16-2008 |
Mao-Tsai Ku, Yonghe City TW
Patent application number | Description | Published |
---|---|---|
20120006043 | IMPELLER MOUNTING STRUCTURE OF AIR CONDITIONING DEVICE - An impeller mounting structure of air conditioning device is provided, including an electric machine arranged between a condenser and an evaporator and a condenser impeller and an evaporator impeller. The electric machine is mounted to an air duct casing of the condenser. The condenser impeller and the evaporator impeller are mounted to a shaft of the electric machine at the same side of the electric machine. A central air duct casing is arranged between the condenser impeller and the evaporator impeller. The evaporator impeller is mounted inside the evaporator air duct casing. The condenser impeller and the evaporator impeller are provided with mated self-locking structures. The mounting structure provides the efficacies that the impeller mounting structure of air conditioning device makes the manufacturing and assembling simplified, the size of a movable air conditioning device reduced, balance of electric machine in operation enhanced, and the number of parts assembled reduced. | 01-12-2012 |
20120006045 | CONDENSED WATER UTILIZATION STRUCTURE OF AIR CONDITIONING DEVICE - A condensed water utilization structure is provided for an air conditioning device and includes a driving electric machine, a transmission mechanism coupled to the driving electric machine, a water pumping device, a water spraying tray, and a water collection tray positioned below the water spraying tray. The water pumping device includes a cylinder forming therein a water inlet chamber, a water outlet chamber, and a piston chamber. The piston chamber receives therein a piston coupled to the transmission mechanism. The water inlet chamber and the piston chamber communicate each other through a water inlet piston, and the water outlet chamber and the piston chamber communicate each other through a water outlet piston. The water inlet chamber has a water inlet port in communication with the water collection tray. The water outlet chamber has a water outlet port in communication with the water spraying tray through a pipe. | 01-12-2012 |
Ming-Chou Ku, Taichung City TW
Patent application number | Description | Published |
---|---|---|
20110233977 | Foldable Waist Support - A foldable wait support includes a foldable resilient board. The foldable resilient board includes a central portion, a pair of fordable portions and a pair of stand portions. Between the central portion and each of the fordable portions is formed with a first dent. Between each of the pair of fordable portions and each of the pair of stand portions is formed with a second dent. A first side of the foldable resilient board is provided with a female buckle strap which is located on the central portion to engage with a male buckle strap provided on one edge of each of the pair of stand portions. A second side of the foldable resilient board is provided with a binding strap and a loop which are located on the fordable portions. When folding, the first dents are folded towards the same direction, such that the foldable portions and the stand portions are folded over the first side of the central portion and the binding strap is to engage with the loop. The foldable resilient board is folded in a flat form for convenient storing and carrying. When unfolding, the second dent between the foldable portion and the stand portion is folded inward and the male buckle strap is to engage with the female buckle strap, such that at least one of the stand portions is perpendicular to the foldable portion. Because the foldable resilient board is resilient and extendable, the central portion is bent outwardly to have a predeterminded curved surface. The foldable waist support of the present invention can be placed on the back of a chair, on the chair or under the head of the user, providing a waist support to the user. | 09-29-2011 |
Ming-Kung Ku, Hsinchu County TW
Patent application number | Description | Published |
---|---|---|
20090038393 | LIQUID LEVEL SENSING APPARATUS WITH SELF-DIAGNOSIS FUNCTION AND METHOD FOR SELF-DIAGNOSING THEREOF - A liquid level sensing apparatus with self-diagnosis function suitable for sensing liquid level in a storage tank is provided. The liquid level sensing apparatus includes a lifting apparatus, a separated tank, and a liquid level sensor. The separated tank is disposed on the lifting apparatus and communicates with the storage tank. The liquid level sensor is disposed inside the separated tank. | 02-12-2009 |
Ming-Te Ku, Tu Cheng TW
Patent application number | Description | Published |
---|---|---|
20100252852 | COOLING BLOCK ASSEMBLY AND LED INCLUDING THE COOLING BLOCK - An LED includes a cooling block, an LED chip, two insulating layers, two electrically conductive layers and two gold wires. According to the invention, two open trenches are arranged by opening on the cooling block; the LED chip is fixed on a surface of the cooling block; the insulating layers are plated on inner walls of the trenches; the electrically conductive layers are plated on the insulating layers and are insulated from the cooling block; the gold wires are electrically conducted to the electrically conductive layers and the LED chip; since the insulating layers are only plated on parts, where the cooling block contacts the electrically conductive layers, the other parts of the cooling block are exposed, such that the cooling area is increased and the cooling performance is promoted; in addition, the invention is further to provide a cooling block assembly constituted by these cooling blocks. | 10-07-2010 |
Min-Yu Ku, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20080285799 | APPARATUS AND METHOD FOR DETECTING OBSTACLE THROUGH STEREOVISION - According to an apparatus and method for detecting an obstacle through stereovision, an image capturing module comprises a plurality of cameras and is used for capturing a plurality of images; an image processing module edge-detecting the image to generate a plurality of edge objects and object information corresponding to each edge object; an object detection module matches a focus and a horizontal spacing interval of the camera according to the object information to generate a relative object distance corresponding to each edge object; a group module compares the relative object distance with a threshold distance and groups the edge objects with the relative object distance smaller than the threshold distance to be an obstacle and obtains a relative obstacle distance corresponding to the obstacle. | 11-20-2008 |
Pei-Hsin Ku, Hsin Chu City TW
Patent application number | Description | Published |
---|---|---|
20100288014 | Gas sensor and method thereof - A gas sensor comprises a first surface-acoustic-wave device, at least one further surface-acoustic-wave device, and a control device. The first surface-acoustic-wave device includes a piezoelectric substrate, a pair of transducers and an external circuit. The pair of transducers consists of a first transducer and a second transducer, and they are formed on two sides of the piezoelectric substrate. The first transducer is utilized to generate a surface acoustic wave on the piezoelectric substrate. The external circuit electrically connects to the pair of transducers. At least one further surface-acoustic-wave device includes at least one first surface-acoustic-device and a sensing porous thin film of which two sides are formed on the pair of the transducers. The control device is utilized to control only one external circuit to become activated at one time. | 11-18-2010 |
Po-Kang Ku, New Taipei TW
Patent application number | Description | Published |
---|---|---|
20110175794 | MULTI-BAND ANTENNA - A multi-band antenna ( | 07-21-2011 |
Po-Wen Ku, Hsinchu County TW
Patent application number | Description | Published |
---|---|---|
20090080464 | MULTIMEDIA DATA SYNCHRONIZATION METHOD AND SYSTEM - A multimedia data system comprising a synchronization unit. The synchronization unit receives a demodulated bitstream, checks whether a FAW pattern corresponding to a candidate of the bitstream exists, checks whether an additional information corresponding to the candidate of the bitstream is valid when the FAW pattern exists, determines a hit weighting corresponding to the candidate according to the checking result, determines whether the hit weighting meets a criterion and outputs a synchronization signal when the hit weighting meets the criterion. | 03-26-2009 |
20140323890 | METHOD AND SYSTEM FOR SIGNAL ANALYZING AND PROCESSING MODULE - Embodiments of the invention disclose a method and a system for signal analyzing and a processing module of the system. The signal analyzing system includes a plurality of first electrodes, a plurality of second electrodes, and a processing module. The first electrodes transmit a plurality of first input signals. The second electrodes transmit a plurality of second input signals. The processing module generates a body electrical signal according to at least one of the plurality of first input signals and at least one of the plurality of second input signals, generates a first filtered signal corresponding to the plurality of first input signals, generates a second filtered signal corresponding to the plurality of second input signals, and generates a lead signal according to the body electrical signal, the first filtered signal and the second filtered signal. | 10-30-2014 |
Shao-Yen Ku, Jhubei City TW
Patent application number | Description | Published |
---|---|---|
20100126531 | METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR DEVICE FABRICATION EQUIPMENT USING SUPERCRITICAL FLUIDS - A process of cleaning a semiconductor device fabrication equipment is provided. In one embodiment, the semiconductor device fabrication equipment is placed in a chamber; a fluid is introduced into the chamber; a pressure and temperature of the fluid is controlled to bring the fluid to a supercritical state; the semiconductor device fabrication equipment is cleaned by having the supercritical fluid contact the semiconductor device fabrication equipment; the supercritical fluid is removed from the chamber; and the semiconductor device fabrication equipment is removed from the chamber. | 05-27-2010 |
20100178772 | METHOD OF FABRICATING HIGH-K METAL GATE DEVICES - The present disclosure provides a method for fabricating a semiconductor device. The method includes providing a semiconductor substrate having a first region and a second region, forming a high-k dielectric layer over the semiconductor substrate, forming a first metal layer and a first silicon layer by an in-situ deposition process, patterning the first silicon layer to remove a portion overlying the second region, patterning the first metal layer using the patterned first silicon layer as a mask, and removing the patterned first silicon layer including applying a solution. The solution includes a first component having an [F—] concentration greater than 0.01 M, a second component configured to adjust a pH of the solution from about 4.3 to about 6.7, and a third component configured to adjust a potential of the solution to be greater than −1.4 volts. | 07-15-2010 |
20120202156 | CLEANING PROCESS FOR SEMICONDUCTOR DEVICE FABRICATION - A method of making an integrated circuit is provided. The method includes providing a substrate having a photosensitive layer. The photosensitive layer is exposed to a radiation beam. The exposed photosensitive layer is developed in a first chamber. In the first chamber, a cleaning process is performed on the developed photosensitive layer. The cleaning process includes using a rinse solution including at least one of ozone, hydrogen peroxide, and oxalic acid. | 08-09-2012 |
20130056031 | Apparatus and Methods for Movable Megasonic Wafer Probe - Methods and apparatus for a movable megasonic wafer probe. A method is disclosed including positioning a movable probe on a wafer surface, the movable probe having an open bottom portion that exposes a portion of the wafer surface; applying a liquid onto the wafer surface through a bottom portion of the movable probe; and moving the movable probe at a predetermined scan speed to traverse the wafer surface, applying the liquid to the wafer surface while moving over the wafer surface. In additional embodiments the method includes providing a transducer for applying megasonic energy to the wafer surface. Apparatus embodiments are disclosed including the movable megasonic wafer probe. | 03-07-2013 |
20130109140 | Semiconductor Device and Method of Manufacture | 05-02-2013 |
20130142594 | Methods for Transporting Wafers Between Wafer Holders and Chambers - An apparatus comprises a process chamber, and a loadlock connected to the process chamber. The loadlock is configured to have a wafer holder disposed therein. The wafer holder is configured to store a plurality of wafers, and is configured to transport the plurality of wafers away from the loadlock. | 06-06-2013 |
20130288436 | Aqueous Cleaning Techniques and Compositions for use in Semiconductor Device Manufacturing - Some embodiments relate to a manufacturing method for a semiconductor device. In this method, a semiconductor workpiece, which includes a metal gate electrode thereon, is provided. An opening is formed in the semiconductor workpiece to expose a surface of the metal gate. Formation of the opening leaves a polymeric residue on the workpiece. To remove the polymeric residue from the workpiece, a cleaning solution that includes an organic alkali component is used. | 10-31-2013 |
20140141541 | LOADING PORT, SYSTEM FOR ETCHING AND CLEANING WAFERS AND METHOD OF USE - A loading port includes a housing and a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP). The loading port further includes a connector configured to receive an inert gas. At least one of the plurality of stations is configured to deliver the inert gas to the FOUP to purge an interior of the FOUP of moisture. A system including the loading port and a method of using the system are also described. | 05-22-2014 |
20140158155 | WAFER CLEANING - One or more techniques or systems for cleaning wafers during semiconductor fabrication or an associated brush are provided herein. In some embodiments, the brush includes a brush body and one or more inner hole supports within the brush body. For example, a first inner hole support and a second inner hole support define a first inner hole associated with a first size. For another example, a third inner hole support and a fourth inner hole support define a second inner hole associated with a second size different than the first size. In some embodiments, a cleaning solution is applied to a wafer based on a first flow rate at a first brush position and based on a second flow rate at a second brush position. In this manner, a flow field associated with wafer cleaning is provided, thus enhancing cleaning efficiency, for example. | 06-12-2014 |
20140213063 | METHOD AND SYSTEM FOR ENERGIZED AND PRESSURIZED LIQUIDS FOR CLEANING/ETCHING APPLICATIONS IN SEMICONDUCTOR MANUFACTURING - A wet chemical processing method and apparatus for use in semiconductor manufacturing and in other applications, is provided. The method and apparatus provide for energizing a processing liquid such as a cleaning or etching liquid using ultrasonic, megasonic or other energy waves or by combining the liquid with a pressurized gas to form a pressurized spray, or using both. The energized, pressurized fluid is directed to a substrate surface using a fluid delivery system and overcomes any surface tensions associated with liquids, solids, or air and enables the processing liquid to completely fill any holes such as contact holes, via holes or trenches, formed on the semiconductor substrate. | 07-31-2014 |
20140216499 | CLEANING COMPOSITION AND METHOD FOR SEMICONDUCTOR DEVICE FABRICATION - A method of cleaning a substrate such as semiconductor substrate for IC fabrication is described that includes cleaning the semiconductor substrate with a mixture of ozone and one of an acid and a base. Exemplary acids and bases include HCl, HF, and NH | 08-07-2014 |
20140216500 | Single Wafer Cleaning Tool with H2SO4 Recycling - Some embodiments relate to methods and apparatus for mitigating high metal concentrations in photoresist residue and recycling sulfuric acid (H | 08-07-2014 |
20140242804 | Integrated Platform for Improved Wafer Manufacturing Quality - The present disclosure relates to a method and apparatus for performing a dry plasma procedure, while mitigating internal contamination of a semiconductor substrate. In some embodiments, the apparatus includes a semiconductor processing tool having a dry process stage with one or more dry process elements that perform a dry plasma procedure on a semiconductor substrate received from an input port. A wafer transport system transports the semiconductor substrates from the dry process stage to a wet cleaning stage located downstream of the dry process stage. The wet cleaning stage has one or more wet cleaning elements that perform a wet cleaning procedure to remove contaminants from a surface of the semiconductor substrates before the semiconductor substrate is provided to an output port. The wet cleaning procedure prior removes internal contaminants of the dry process procedure from the semiconductor substrate and thereby improves wafer manufacturing quality. | 08-28-2014 |
20150027489 | MECHANISMS FOR CLEANING WAFER AND SCRUBBER - Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid. | 01-29-2015 |
20150064928 | PHOTORESIST REMOVAL - Among other things, one or more systems and techniques for removing a photoresist from a semiconductor wafer are provided. The photoresist is formed over the semiconductor wafer for patterning or material deposition. Once completed, the photoresist is removed in a manner that mitigates damage to the semiconductor wafer or structures formed thereon. In an embodiment, trioxygen liquid is supplied to the photoresist. The trioxygen liquid is activated using an activator, such as an ultraviolet activator or a hydrogen peroxide activator, to create activated trioxygen liquid used to remove the photoresist. In an embodiment, the activation of the trioxygen liquid results in free radicals that aid in removing the photoresist. In an embodiment, an initial photoresist strip, such as using a sulfuric acid hydrogen peroxide mixture, is performed to remove a first portion of the photoresist, and the activated trioxygen liquid is used to remove a second portion of the photoresist. | 03-05-2015 |
Sheng Jing Ku, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20090133498 | MULTIAXIAL GYROSCOPE - The present invention relates to a multiaxial gyroscope, which comprises a vibration-sensing device, a plurality of elastic connecting parts, a first substrate, and a plurality of electrodes. The first ends of the elastic connecting parts are adapted on the periphery of the vibration-sensing device. The sidewall of the first substrate connects with the second ends of the elastic connecting parts. The plurality of electrodes is located on the periphery of the vibration-sensing device and is opposite to the plurality of elastic connecting parts. The vibration-sensing device comprises a ring and a plurality of vibration blocks. By means of the vibration blocks, the sensing area as well as the driving amplitude of the gyroscope can be increased effectively. Thereby, the intensity of the sensed signals of the gyroscope can be enhanced. | 05-28-2009 |
Shih-Liang Ku, Xinpu Township TW
Patent application number | Description | Published |
---|---|---|
20110089446 | LIGHT-EMITTING DIODE HAVING OPTICAL FILM STRUCTURE THEREON - The invention discloses a light-emitting diode having an optical film structure thereon. The light-emitting diode includes a substrate, a light-emitting laminated structure, and an optical film structure. The light-emitting laminated structure is formed on the substrate, and the optical film structure is formed on the light-emitting laminated structure. The optical film structure is made of a dielectric material and has a light output plane, wherein the light output plane has plural roughened structures thereon. | 04-21-2011 |
Shu-Lan Ku, Taipei Hsien TW
Patent application number | Description | Published |
---|---|---|
20100139026 | Wiper Blade Spoiler Assembly - A wiper blade assembly includes a wiper blade and a spoiler assembly. The wiper blade includes a wiper strip. The spoiler assembly defines a internal opening for receiving a first portion of the wiper strip. The spoiler assembly is slidingly and removably mounted to the wiper blade by inserting the first portion of the wiper strip in the internal opening. | 06-10-2010 |
Shu-Yuan Ku, Hsin-Chu City TW
Patent application number | Description | Published |
---|---|---|
20100124823 | NOVEL METHOD FOR REMOVING DUMMY POLY IN A GATE LAST PROCESS - A method is provided for fabricating a semiconductor device. The method includes removing a silicon material from a gate structure located on a substrate through a cycle including: etching the silicon material to remove a portion thereof, where the substrate is spun at a spin rate, applying a cleaning agent to the substrate, and drying the substrate; and repeating the cycle, where a subsequent cycle includes a subsequent spin rate for spinning the substrate during the etching and where the subsequent spin rate does not exceed the spin rate of the previous cycle. | 05-20-2010 |
Shu-Yuan Ku, Zhubei City TW
Patent application number | Description | Published |
---|---|---|
20100270598 | METHOD FOR FORMING HIGHLY STRAINED SOURCE/DRAIN TRENCHES - A multi-step etching process produces trench openings in a silicon substrate that are immediately adjacent transistor structures formed over the substrate surface. The multi-step etching process is a Br-based etching operation with one step including nitrogen and a further step deficient of nitrogen. The etching process does not attack the transistor structure and forms an opening bounded by upper surfaces that extend downwardly from the substrate surface and are substantially vertical, and lower surfaces that bulge outwardly from the upper vertical sections and undercut the transistor structure. The aggressive undercut produces a desirable stress in the etched silicon surface. The openings are then filled with a suitable source/drain material and SSD transistors with desirable I | 10-28-2010 |
20120018786 | HIGHLY STRAINED SOURCE/DRAIN TRENCHES IN SEMICONDUCTOR DEVICES - A semiconductor device is formed by a multi-step etching process that produces trench openings in a silicon substrate immediately adjacent transistor gate structures formed over the substrate surface. The multi-step etching process is a Br-based etching operation with one step including nitrogen and a further step deficient of nitrogen. The etching process does not attack the transistor structure and forms the openings. The openings are bounded by upper surfaces that extend downwardly from the substrate surface and are substantially vertical, and lower surfaces that bulge outwardly from the upper vertical sections and undercut the transistor structure. The openings may be filled with a suitable source/drain material to produce SSD transistors with desirable I | 01-26-2012 |
Ta-Chih Ku, Yuanlin Township TW
Patent application number | Description | Published |
---|---|---|
20090013844 | SHEET TRIMMER - A trimmer that is operable to cut at least one sheet includes a base having a support surface configured to support the at least one sheet and a rail extending across at least a portion of the base. A plane extends substantially perpendicularly from the support surface and through the rail. The trimmer also includes a cutting assembly slidably coupled to the rail and having a blade. The blade is tilted relative to the plane. | 01-15-2009 |
Te-Kai Ku, Hsinchu County TW
Patent application number | Description | Published |
---|---|---|
20090310366 | Light Emitting Diode Lens Structure and An Illumination Apparatus Incorporating with the LED Lens Structure - A light emitting diode lens structure includes a lens having an upper section and a lower section. The lower section is provided with a light emitting diode accommodation part. The upper section is coated with a specular reflection layer to form a reflecting surface facing the light emitting diode accommodation part. An illumination apparatus with the light emitting diode lens structure includes a lampshade, a locking module, an electrode module, and a light emitting diode. The lampshade has a reflecting light surface and an aperture. The locking module is coupled on the lampshade and has a through hole corresponding to the aperture. The electrode module is coupled on the locking module and corresponds to the through hole. This design provides a significant reduction in glare to reduce eyestrain. | 12-17-2009 |
20100095954 | Solar Tracking Device For Solar Panel - A solar tracking device for solar panel includes a barrel body, a light transmitting unit, a projecting unit, a photosensor unit, and a lens. The light transmitting unit is disposed at a first end of the barrel body oriented toward the sun. The light transmitting unit has a light-transmittable crossing point provided at a center thereof. The projecting unit is an opaque member arranged between the first end and a second end of the barrel body. The photosensor unit is arranged to one side of the projecting unit, so that the projecting unit is located between the light transmitting unit and the photosensor unit. The photosensor unit has a locating center preset at a center of the projecting unit. The lens is arranged between the projecting unit and the photosensor unit. The barrel body is a telescopic barrel enabling the solar tracking device to switch between different operating angle modes. | 04-22-2010 |
20110253194 | PHOTOELECTRIC CONVERSION - A photoelectric conversion is capable of converting the light energy into electrical power, comprising a tempered glass layer, a lens module, a substrate and a heat sink unit, wherein the lens module is formed from a plurality of lens units, which locate at one side of the tempered glass layer. A gap is formed via a plurality of protruding poles located between the lens units and the tempered glass layer. The gap is filled with transparent rubbers. A plurality of receiving units is located one side of the substrate for dissipating heat energy from the receiving units. The light energy is converted through the receiving units into the electrical energy by focusing the light to the receiving units via the tempered glass layer and the lens module. | 10-20-2011 |
20110253883 | LIGHT COLLECTOR - A light collector is capable of collecting a incident light, comprises a light condenser having an incident surface and an exit surface, a light reflecting unit having two end surfaces and a receiving unit, wherein the incident light enters through the incident surface of the light condenser and the light condenser alters an optical distance and an optical direction of the incident light so that the incident light is transmitted evenly to the exit surface of the light condenser. A reflecting layer is positioned inside the light reflecting unit, and the light condenser is positioned at one end surface of the light reflecting unit in order to receive the incident light from the exit surface. The receiving unit is used to receive the incident light exiting from the light reflecting unit so that a photoelectrical process is carried out and the incident light is converted into electrical energy. | 10-20-2011 |
Tsang-Hsing Ku, Taoyuan Hsien TW
Patent application number | Description | Published |
---|---|---|
20110168589 | CASE STRUCTURE AND OPTICAL DEVICE HAVING SUCH CASE STRUCTURE - A case structure includes a covering member and a lid member. The covering member includes a main boy, a first coupling part and a first positioning part. The lid member includes a lid plate, a second coupling part and a second positioning part. The second coupling part of the lid member and the first coupling part of the covering member are engaged with each other so that the lid plate is coupled with the main body and pivotal with respect to the main body. When the lid plate is rotated to a first position, the second positioning part is interference-fitted into the first positioning part so that the lid plate is positioned with respect to the main body. | 07-14-2011 |
20110216426 | OPTICAL DEVICE - An optical device includes a lens module, a case structure and an optical adjusting mechanism. The optical adjusting mechanism includes a first adjusting member, a second adjusting member and an elastic element. The first adjusting member includes a first interference transmission structure. The second adjusting member is movably connected with the case structure, and includes a second interference transmission structure. In response to the movement of the lens module, the elastic element elastically urges against the second adjusting member so that the second adjusting member is movable within a predetermined distance range, and the second interference transmission structure presses against and engages with the first interference transmission structure. Once the second adjusting member is moved, the first adjusting member is synchronously moved so that optical parameters of the lens module are adjusted through the first adjusting member. | 09-08-2011 |
20120188034 | MAGNETIC FIX STRUCTURE APPLYING ON A PROJECTION DEVICE - The invention is a magnetic fix structure that applies on a projection device. The magnetic fix structure includes a first magnetic connector set and a second magnetic connector set, and the projection device includes a projection module housing and a power module housing. The first magnetic connector set and the second magnetic connector set are disposed on the projection module housing and the power module housing respectively. Therefore, through the attraction between the first magnetic connector set and the second magnetic connector set, the power module housing can be fixed onto the projection module housing. | 07-26-2012 |
20140016249 | DISPLAY DEVICE, ASSEMBLY METHOD OF A DISPLAY DEVICE AND ASSEMBLY STRUCTURE FOR USE IN A DISPLAY - A display device is provided. The display device has an upper case, a lower case, at least one fastening unit and at least one adjustable module. The upper case and the lower case respectively have at least one first fasten hole and at least one second fasten hole. The second fasten hole coaxially communicates with the first fasten hole. Through the second fasten hole, the unit is fixed in the first fasten hole to fasten the upper case and the lower case together. The adjustable module has an adjustable unit with a through hole penetrating therethrough. Furthermore, the adjustable unit is partially disposed in the second fasten hole. By disposing the adjustable unit and the fastening unit within the second fasten hole, the display device could be made more compact and the overall cost can be decreased. | 01-16-2014 |
Tsu-Hsien Ku, Miao-Li TW
Patent application number | Description | Published |
---|---|---|
20080291383 | Liquid crystal panel with protrusions for narrowing gap between substrates thereof and method for manufacuring same - An exemplary liquid crystal panel includes a first substrate and a second substrate parallel to each other to define a gap therebetween, a sealant disposed around the gap to provide an accommodating space, a liquid crystal layer disposed in the accommodating space, a plurality of signal lines disposed on at least one of the first and second substrates, and a plurality of protrusions at a peripheral side of the liquid crystal layer. The protrusions are configured to narrow the gap thereat. A part of each signal line is disposed between the sealant and the corresponding one of the first and second substrates, and each of the protrusions is arranged between two respective signal lines. A related method for manufacturing a liquid crystal panel is also provided. | 11-27-2008 |
Tsu Yi Ku, Keelung City TW
Patent application number | Description | Published |
---|---|---|
20080232370 | Method of communication in LAN without setting IP - A method of communication in LAN without setting IP is provided, especially for LAN with a host device and at least a peripheral device. The method includes: (1) the host device sending the peripheral device a broadcast search packet through LAN, (2) the peripheral device establishing a new routing table according to the packet, (3) the peripheral device returning a response packet containing IP data to the host device, (4) the host device establishing a new routing table according to the response packets returned from peripheral device, and (5) the host device performing wired or wireless LAN communication with peripheral device according to the new routing table. Therefore, the host device and the device can automatically detect IP data even they may belong to different sub-net to achieve the communication in LAN without setting IP. | 09-25-2008 |
Wei Cheng Ku, Hsinchu Hsiang TW
Patent application number | Description | Published |
---|---|---|
20090009198 | PROBING DEVICE - A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer. | 01-08-2009 |
20090212801 | METHOD OF MAKING HIGH-FREQUENCY PROBE, PROBE CARD USING THE HIGH-FREQUENCY PROBE - A high frequency probe preparation method for making a high frequency probe for high frequency testing to assure signal integrity by means of making a sleeve assembly subject to the size of a predetermined bare needle and then sleeving bare needle by the sleeve assembly to form a high-frequency probe is disclosed to include the steps of: a) providing an insulated tube, and b) forming a conducting layer on the outer surface of the insulated tube which having a metal layer for grounding. The insulated tube and the conducting layer constitute the sleeve assembly. The metal layer is formed by means of physical deposition, chemical deposition, mixture of physical and chemical deposition or electrochemical deposition. | 08-27-2009 |
20100253378 | PROBE FOR HIGH FREQUENCY SIGNAL TRANSMISSION - A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly. | 10-07-2010 |
20110095778 | PROBE CARD - A probe card is provided. The probe card detaches or separates a probe assembly and a test signal generator which generates test signals from the tester and the printed circuit board, so as to form a probe system module. The probe system module is secured into a probe card module by one or more securing unit. The probe card module includes the printed circuit board. Control signals from the tester are wirelessly transmitted to the probe system module and drive the probe system module to generate the corresponding test signals. Therefore, the loss or distortion of the test signals due to having longer transmitting distances will be reduced and thus the test quality can be improved. | 04-28-2011 |
20110221462 | PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING AND IMPEDANCE MATCHING METHOD THEREFORE - A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate. | 09-15-2011 |
20120242360 | High-frequency coupling testing device by coupling effect - Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe. Further, the filter between the coupling circuit and the high-frequency circuit can be adjusted by changing the number of the coupling metal probes surrounding the high-frequency metal probe, or by changing the distances between the coupling metal probes and the high-frequency metal probes. | 09-27-2012 |
20120274347 | INTEGRATED HIGH-SPEED PROBE SYSTEM - An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system. | 11-01-2012 |
20140103948 | PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING - A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate. | 04-17-2014 |
Wei Cheng Ku, Zhubei City TW
Patent application number | Description | Published |
---|---|---|
20100237886 | PROBE CARD - A probe card is provided. The probe card can serialize, analogise and divide a digital signal by a parallel-to-serial converter, a parallel-to-serial converter, and a power divided unit respectively. The probe card can increase signal channels, and is not restricted by signal channels of a tester to test more DUTs simultaneously. Moreover, the probe card has fine impedance matching and channels separating to raise testing efficiency and reduce signal loss. | 09-23-2010 |
Wei-Chun Ku, Chia-Yi TW
Patent application number | Description | Published |
---|---|---|
20100274550 | Integrated development structure having virtual inputs/outputs for embedded hardware/software - With the present invention, buses and silicon IPs are simulated together. A virtual platform is provided for designing hardware and system. And correct and fast simulations of I/Os are provided through the I/Os on a FPGA. Thus, software performances are monitored and system bottlenecks are acquired. | 10-28-2010 |
Wei-Chun Ku, Min-Hsiung TW
Patent application number | Description | Published |
---|---|---|
20100107167 | MULTI-CORE SOC SYNCHRONIZATION COMPONENT - The present invention discloses a multi-core SOC synchronization component, which comprises a key administration module, a thread schedule unit supporting data synchronization and thread administration, and an expansion unit serving to expand the memory capacity of the key administration module. The present invention can improve interconnect traffic and prevents from interconnect blocking. The present invention can function as a standard interface of different components. Thus, the present invention can solve the synchronization problem and effectively accelerate product design. | 04-29-2010 |
Wen-Chen Ku, Wurih Township TW
Patent application number | Description | Published |
---|---|---|
20090250887 | Cinquefoil chuck - An improved cinquefoil chuck comprises a clamping jaw mechanism provided with a plurality of clamping jaws that may release and close and that are connected to and driven by a driving mechanism. The clamping jaw mechanism is connected to and driven by an autorotation mechanism to rotate, and the cinquefoil chuck is used to make the clamping jaw mechanism automatically rotate for safe and easy operation. | 10-08-2009 |
Winnie Ku, Taipei Hsien TW
Patent application number | Description | Published |
---|---|---|
20090160681 | Numeiric keyboard device with voice interaciton and the method thereof - The numeric keyboard device of the present invention includes a key matrix, an audio I/O module for sending and receiving audio signals, an audio microprocessor for processing audio signals sent and received by the audio I/O module, an MCU that scans the key status of the key matrix, and a function switch that sends a first command to the key matrix to be further processed by the MCU and such that after processing said first command, the MCU sends an interrupt signal to the audio microprocessor to generate an enable signal that activates a voice interaction mode of the numeric keyboard device of the present invention. | 06-25-2009 |
Yao-Ching Ku, Hsin-Chu City TW
Patent application number | Description | Published |
---|---|---|
20090187866 | Electrical Parameter Extraction for Integrated Circuit Design - A system, method, and computer readable medium for generating a parameterized and characterized pattern library for use in extracting parasitics from an integrated circuit design is provided. In an embodiment, a layout of an interconnect pattern is provided. A process simulation may be performed on the interconnect pattern. In a further embodiment, the interconnect pattern is dissected into a plurality of segments taking into account OPC rules. A parasitic resistance and/or parasitic capacitance associated with the interconnect pattern may be determined by a physical model and/or field solver. | 07-23-2009 |
Ying-Hsien Ku, Chungho City TW
Patent application number | Description | Published |
---|---|---|
20100064278 | PROGRAMMING SYSTEM AND PROGRAM EXPANDING METHOD - The invention provides a programming system comprising a software component, a client side, and N expanding module. The software component comprises a receiving/processing interface and N first link interface; the client side could be used for transferring client information to the software component through the receiving/processing interface; and each expanding module is corresponding to one of the first link interface and comprises an expanding content. Accordingly, a connecting relation could be built between the software component and one expanding module, corresponding to the client information, of the N expanding module through the first link module, so that the software component can communicate with the expanding module to obtain the expanding content. | 03-11-2010 |
Ying-Ming Ku, Taoyuan City TW
Patent application number | Description | Published |
---|---|---|
20080290817 | LED Indicator Device for AC Power Plug or Socket - An LED indicator device is mounted in an AC power plug or socket and electrically connected in parallel with an AC power source. The LED indicator device includes a driving/current-limiting circuit to which an LED lighting circuit is coupled. The driving/current-limiting circuit includes a driving/current-limiting capacitor and a discharge resistor connected in parallel with the driving/current-limiting capacitor. The LED lighting circuit includes an LED, a protective instantaneous current-limiting resistor coupled to the LED, a rectifying diode connected in parallel with the LED, and a protective instantaneous voltage-limiting capacitor connected in parallel with the LED. The LED is lit to show the position and on/off state of the AC power plug or socket. Three LEDs emitting different colors and associated driving/current-limiting circuits and associated LED lighting circuits can be utilized to indicate incorrect power connection or short circuit of the AC power plug or socket. | 11-27-2008 |
20080293290 | Extension Cord Using LED as Indicator Lamp - An extension cord includes a cable, a plug on an end of the cable, and a socket casing on the other end of the cable. A lighting device is mounted in the plug or the socket casing. The lighting device includes an LED electrically connected in parallel to conductive wires in the cable and a DC converting circuit electrically connected to the LED. The DC converting circuit converts an AC voltage from the plug into a DC voltage supplied to the LED for lighting the LED. Light beams emitted by the LED transmit through the plug or the socket casing to show the extension cord and to indicate on/off state of the extension cord. Another lighting device may be mounted in the other of the plug and the socket casing. An optical fiber may be mounted in the cable and lit to show the cable. | 11-27-2008 |
Ying-Ming Ku, Hsinwu TW
Patent application number | Description | Published |
---|---|---|
20110222193 | APPARATUS FOR GROUND FAULT CURRENT INTERRUPTER WITH OVERALL END-OF-LIFE INDICATION AND SHUTDOWN PROTECTION FUNCTION - An apparatus for ground fault current interrupter with overall end-of-life indication and shutdown protection function includes a first silicon-controlled rectifier, a reverse unit, a test switch unit and a ground fault current interrupter. The ground fault current interrupter includes a second silicon-controlled rectifier, a switch unit, a switch control unit and a rectifier filter unit. When a test current leakage signal is generated, a drive power is provided to the reverse unit, and the input power supply generates a current leakage phenomenon. If the ground fault current interrupter fails, then the second silicon-controlled rectifier will not be triggered, which makes the reverse unit trigger the first silicon-controlled rectifier, such that the rectifier filter unit outputs a DC power flowing through the first silicon-controlled rectifier to interrupt a power supply of the switch control unit. Therefore, the input power supply electrically connected to the switch unit can not deliver any power to the load electrically connected to the switch unit. | 09-15-2011 |
20120056697 | INCORRECT-CIRCUIT DEACTIVATION DEVICE OF MAGNETIC GFCI OUTLET - An incorrect-circuit deactivation device of a magnetic GFCI outlet includes an electromagnetic coil seat, a magneto-conductive core driven by the electromagnetic coil seat to displace, and two magnetic elements located on both sides of the magneto-conductive core. The magneto-conductive core is connected to a first electrical conductive end. The first electrical conductive end is positioned to face a second electrical conductive end. Electric power is supplied when the first electrical conductive end is brought into contact with the second electrical conductive end. The electromagnetic coil seat senses a reverse current to make the magneto-conductive core to displace toward one of the magnetic elements when there is a ground fault, thereby departing the first electrical conductive end from the second electrical conductive end to cut off the electric current. | 03-08-2012 |
20120256712 | INCORRECT-CIRCUIT DEACTIVATION DEVICE OF MAGNETIC GFCI OUTLET - An incorrect-circuit deactivation device of a magnetic GFCI outlet includes an electromagnetic coil seat, a magneto-conductive core driven by the electromagnetic coil seat to displace, and two magnetic elements located on both sides of the magneto-conductive core. The magneto-conductive core is connected to a first electrical conductive end. The first electrical conductive end is positioned to face a second electrical conductive end. Electric power is supplied when the first electrical conductive end is brought into contact with the second electrical conductive end. The electromagnetic coil seat senses a reverse current to make the magneto-conductive core to displace toward one of the magnetic elements when there is a ground fault, thereby departing the first electrical conductive end from the second electrical conductive end to cut off the electric current. | 10-11-2012 |
You-En Ku, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20090196718 | HOLDING APPARATUS - A holding apparatus for holding a semiconductor wafer comprises a pneumatic cylinder, a plunger movably connected to the pneumatic cylinder, an inlet pipe connected to the pneumatic cylinder, and a relief valve connected to the inlet pipe. Clean dry air is pumped into the pneumatic cylinder through the inlet pipe to impel the plunger in a first direction to contact the wafer. A part of the air in the inlet pipe is discharged through the relief valve to regulate air pressure to the pneumatic cylinder. | 08-06-2009 |
Yuan-Chin Ku, Hsin-Chuang City TW
Patent application number | Description | Published |
---|---|---|
20100205763 | Universal Adaptors for Connecting Wiper Blades to Wiper Arms - An adaptor assembly is provided to connect a wiper blade to a plurality of wipe arms. The adaptor assembly includes a proximal member, a distal member, and a pair of side walls disposed between the proximal member and the distal member. A plurality of seats are provided adjacent to the side walls for supporting the plurality of wiper arms. At least one of the plurality of wiper arms defines a U-shaped housing. | 08-19-2010 |
Yuan-Chin Ku, Taipei Hsien TW
Patent application number | Description | Published |
---|---|---|
20080295273 | NON-BRACKET WINDSHIELD WIPER - A non-bracket windshield wiper includes an H-shaped and smoothly arched elastic metal bow strip having a middle neck and two longitudinal crevices at two sides of the neck, a holder frame mounted with a packing member and riveted to the middle part of the elastic metal bow strip for mounting to a windshield, two holding strips respectively coupled to the longitudinal crevices of the elastic metal bow strip, two back rubber strips respectively coupled to two top engagement structures of the holding strips, a rubber wiper blade coupled to two bottom engagement structures of the holding strips, and two end caps respectively capped on the two ends of the elastic metal bow strip. | 12-04-2008 |
Yuan-Chin Ku, Sinjhuang City TW
Patent application number | Description | Published |
---|---|---|
20100024151 | FRAMELESS WINDSHIELD WIPER STRUCTURE - A frameless windshield wiper includes a curved resilient metal plate, two flexible bars, two rubber back covers, a rubber wiping strip, and two end closure caps. The resilient metal plate is an elongate plate having an H-shape including a central connection section connecting between two strips defining therebetween elongate slits so that the metal plate assumes a fork-like configuration having opposite fork-like open ends. The central section is riveted to a coupler over which a plastic protective cap is fit. The flexible bars have upper and lower faces respectively forming upper and lower retainers to which the rubber back covers and the rubber wiping strip are respectively fit. The end caps are fit to opposite ends of the metal plates. Thus, an automobile windshield wiper that can be efficiently and easily assembled is provided. | 02-04-2010 |
Yu-Fu Ku, Chiayi County TW
Patent application number | Description | Published |
---|---|---|
20110158288 | Apparatus With Temperature Self-Compensation And Method Thereof - A system for compensating a thermal effect is provided and includes a substrate structure and a microcantilever. The substrate structure includes a first piezoresistor. The first piezoresistor is buried in the substrate structure and has a first piezoresistance having a first relation to a first variable temperature. The microcantilever has the thermal effect and a second piezoresistance having a second relation to the first variable temperature, wherein the thermal effect is compensated based on the first and the second relations. | 06-30-2011 |
Yu Hsien Ku, Hsinchu Hsien TW
Patent application number | Description | Published |
---|---|---|
20110090994 | Decoding Method and Associated Apparatus - A decoding method for determining a preferred survivor path in a decoding process is provided. The method includes calculating a first determination value of a first survivor path at a first time point, the first determination value being determined by a first sub determination value and a second determination value at a second time point, and the second time point being prior to the first time point; calculating a third determination value of a second survivor path at the first time point, the third determination value being determined by a second sub determination value and a fourth determination value at the second time point; and when a difference between the first determination value and the third determination value is equal to or less than a predetermined value, determining the preferred survivor path at the first time point according to the second and the fourth determination values, or the first and the second sub determination values. | 04-21-2011 |
20110268171 | Signal Selection Apparatus and Method Thereof - A signal selection apparatus for selecting a target signal from a plurality of input signals is provided. The input signals correspond to different time indexes. The signal selection apparatus comprises a weight calculation unit for generating a corresponding weight respectively for each of the input signals, a processing unit for processing the input signals respectively to generate a plurality of processed signals according to the weights, and a selection unit for selecting a signal with a larger energy from the processed signals as the target signal, wherein the weights are used for adjusting an individual energy of the input signals such that the time index of the target signal is earlier within the input signals. | 11-03-2011 |
Yu-Hsien Ku, Taipei Hsien TW
Patent application number | Description | Published |
---|---|---|
20100188003 | Electronic device, a control system and a method of controlling a light-emitting element thereof - A control system and a method of controlling a light-emitting element thereof are disclosed. The control system is used to adjust a light-emitting element of an electronic device. The control system comprises a control module, a signal input module, and a signal output module. The signal output module has a register. The signal input module and the signal output module are electrically connected to the control module. The method of controlling the light-emitting element comprises the follow steps: determining whether there is a signal inputted by means of the control system; if the signal is detected, adjusting the setting of the register according to the signal; generating a control signal; and adjusting the brightness level of the light-emitting element according to the control signal. | 07-29-2010 |
Yu-Hsuan Ku, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20110077430 | Method and precursor for production of no-carrier-added N-(4-[18F] fluorobutyl)-Ethacrynic amide - The present invention is related to a precursor for no-carrier-added fluorine-18 labeled ethacrynic acid, N-(4-[ | 03-31-2011 |
Yung-Chuan Ku, Taichung TW
Patent application number | Description | Published |
---|---|---|
20080305579 | Method for fabricating semiconductor device installed with passive components - A method for fabricating a semiconductor device installed with passive components is provided. The method includes: having at least a passive component make a bridge connection between a ground circuit and a power circuit of each of a plurality of substrate units; electrically connecting a conductive circuit on a cutting path between substrate units to the ground circuit and the power circuit, and forming a short circuit loop; or electrically connecting the conductive circuit on the cutting path between the substrate units to the power circuit and the ground circuit via bonding wires, and forming a short circuit loop; or applying a wire bonding machine to form a stud bump on the power circuit, and then forming a short circuit loop via the power circuit and ground loop of the wire bonding machine; therefore, via the short circuit loop, the passive component is capable of releasing electricity filled therein from previous plasma clean process of substrate units and chips; and grounding the chips and the substrate units and electrically connecting powers and signals to prevent the chips from being damaged due to sudden current impulses resulting from the discharging of the passive components when the passive components are electrically connected to the chips. | 12-11-2008 |
Yun-Sheng Ku, Miaoli County TW
Patent application number | Description | Published |
---|---|---|
20120057217 | DISPLAY - A display including a pixel array substrate, an opposite substrate and a fluid medium is provided. The pixel array substrate includes a first substrate including pixel regions and pixel structures disposed in the pixel regions. Each pixel region includes a distribution region of pixel electrode and a non-electrode region. A pixel electrode of the pixel structure is disposed in the distribution region of pixel electrode and has at least one slit extending from the non-electrode region toward the distribution region of pixel electrode. The opposite substrate includes a second substrate and a common electrode disposed on the second substrate and contacting a polar fluid. The fluid medium includes the polar fluid and a non-polar fluid and flows between the pixel array substrate and the opposite substrate. The non-polar fluid is contracted toward the non-electrode region when a voltage difference is generated between the pixel and the common electrodes. | 03-08-2012 |
20120146984 | ELECTROFLUIDIC DEVICE AND OPERATION METHOD THEREOF - An electrofluidic device includes first structural layer and second structural layer. First structural layer includes first substrate; and first electrode and second electrode on the first substrate. The second electrode has an indent region surrounding and without contacting first electrode. First hydrophobic layer is at least over the second electrode. Second structural layer at one side of the first structural layer with a gap includes second substrate and groove structure layer. The groove structure layer includes an indent groove, corresponding to the indent region of the second electrode. Second hydrophobic layer is over the groove structure layer. Polar fluid is disposed in the indent groove and remains in contact with the first electrode. Non-polar fluid is disposed in the gap between the first and second structural layers. | 06-14-2012 |
20120170101 | ELECTROFLUIDIC DISPLAY DEVICE AND DRIVING METHOD THEREOF - An electrofluidic display device including a first structure layer and a second structure layer is provided. The first structure layer includes a first substrate. A trench structure layer is disposed on the first substrate and has a trench surrounding an indent groove of a second substrate. A first electrode layer is disposed on the first substrate. A first hydrophobic layer is disposed on the first electrode layer. The second structure layer having the second substrate is located aside the first substrate with a gap. A groove structure layer is disposed on the second substrate. The groove structure has the indent groove surrounded by the trench. A second electrode layer is disposed on the groove structure layer. A second hydrophobic layer is disposed on the second electrode layer. Polar fluid is disposed in the indent groove. Non-polar fluid is disposed in the gap between the first and second substrates. | 07-05-2012 |
20120243071 | ELECTRO-WETTING DISPLAY DEVICE - An electro-wetting display device is provided. The device includes a first substrate and a second substrate disposed opposite thereto. A plurality of first electrodes and a plurality of corresponding second electrodes are disposed on the first substrate and face the second substrate. A barrier layer is between the plurality of first electrodes and the plurality of second electrodes, such that the plurality of first electrodes is electrically insulated from the plurality of second electrodes. A plurality of ribs is on the first substrate to form a plurality of pixel regions. A polar liquid and a non-polar liquid are between the first and second substrates. The barrier layer is between the polar liquid and at least one of the plurality of first electrodes and the plurality of second electrodes, and the non-polar liquid is in direct contact with the barrier layer in each pixel region. | 09-27-2012 |
Yu-Tzu Ku, Taichung Industrial Park TW
Patent application number | Description | Published |
---|---|---|
20100072937 | MOBILE POSITIONING STRUCTURE FOR AN AXIAL ROD MOTOR - A mobile positioning structure for an axial rod motor comprises a base on which being disposed a stator, and on the stator is disposed a mover on which being mounted an optical signal reader. The stator is provided with a plurality of measurement marks. The position of the mover on the stator is read by the cooperation of an optical reader and measurement marks, such an optical signal reading method is not affected by the magnetic field. Hence, the data detected will be more accurate with less error. | 03-25-2010 |
Zong-Yao Ku, Kaohsiung TW
Patent application number | Description | Published |
---|---|---|
20080268223 | Composite sheet for mounting a workpiece and the method for making the same - The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect. | 10-30-2008 |
20090252949 | COMPOSITE SHEET FOR MOUNTING A WORKPIECE AND THE METHOD FOR MAKING THE SAME - The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect. | 10-08-2009 |