Kozasa, JP
Chihiro Kozasa, Yokohama-Shi JP
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20110304540 | IMAGE GENERATION SYSTEM, IMAGE GENERATION METHOD, AND INFORMATION STORAGE MEDIUM - An image generation system includes an image information acquisition section that acquires image information from an image sensor, a motion information acquisition section that acquires motion information about an operator based on the image information from the image sensor, an object control section that moves an object in a movement area based on the motion information about the operator, and an image generation section that generates an image displayed on a display section. The object control section limits movement of the object so that the object does not move beyond a movement limiting boundary set in the movement area even when it has been determined that the object has moved beyond the movement limiting boundary based on the motion information. | 12-15-2011 |
20110306420 | IMAGE GENERATION SYSTEM, IMAGE GENERATION METHOD, AND INFORMATION STORAGE MEDIUM - An image generation system includes an image information acquisition section that acquires image information from an image sensor, a skeleton information acquisition section that acquires skeleton information based on the image information from the image sensor, the skeleton information specifying a motion of an operator, a reliability information acquisition section that acquires reliability information that indicates reliability of the skeleton information, and an image generation section that generates an image displayed on a display section. The image generation section generates an image corresponding to the acquired reliability information as the image displayed on the display section. | 12-15-2011 |
20110306421 | IMAGE GENERATION SYSTEM, IMAGE GENERATION METHOD, AND INFORMATION STORAGE MEDIUM - An image generation system includes an image information acquisition section that acquires image information from an image sensor, a motion information acquisition section that acquires motion information about an operator based on the image information from the image sensor, a correction section that performs a correction process on the motion information based on at least one of an aspect ratio of the image sensor and an aspect ratio of a display section, and an image generation section that generates an image displayed on the display section. | 12-15-2011 |
20110306422 | IMAGE GENERATION SYSTEM, IMAGE GENERATION METHOD, AND INFORMATION STORAGE MEDIUM - An image generation system includes an image information acquisition section that acquires image information from an image sensor, a skeleton information acquisition section that acquires skeleton information based on the image information from the image sensor, the skeleton information specifying a motion of an operator viewed from the image sensor, a correction section that performs a correction process on position information about a bone of a skeleton indicated by the skeleton information, and an image generation section that generates an image based on a result of the correction process. | 12-15-2011 |
Junpei Kozasa, Osaka JP
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20100162864 | OPTICAL FILM TRANSPORT METHOD, AND APPARATUS USING THE SAME - In a process of transporting a strip-shaped optical film F, the optical film F is cut to a predetermined length. Thereafter, the sheet-like optical films F divided by the cutting are intermittently transported while the strip-shaped optical film F is fed by the predetermined length such that a portion to be cut next reaches a cutting action position. Further, a leading one of the sheet-like optical films F in the intermittent transport process is transported to a continuous transport process such that a rear end thereof passes the intermittent transport process in a subsequent intermittent transport operation. Herein, the sheet-like optical film F is transported to the downstream-side continuous transport process following the intermittent transport process to continuously transport the optical film F. | 07-01-2010 |
20100206859 | OPTICAL FILM CUTTING METHOD, AND APPARATUS USING THE SAME - A suction table | 08-19-2010 |
20110203430 | OPTICAL FILM CUTTING METHOD AND APPARATUS USING THE SAME - Nip rollers | 08-25-2011 |
20140041497 | OPTICAL FILM TRANSPORT METHOD, AND APPARATUS USING THE SAME - In a process of transporting a strip-shaped optical film F, the optical film F is cut to a predetermined length. Thereafter, the sheet-like optical films F divided by the cutting are intermittently transported while the strip-shaped optical film F is fed by the predetermined length such that a portion to be cut next reaches a cutting action position. Further, a leading one of the sheet-like optical films F in the intermittent transport process is transported to a continuous transport process such that a rear end thereof passes the intermittent transport process in a subsequent intermittent transport operation. Herein, the sheet-like optical film F is transported to the downstream-side continuous transport process following the intermittent transport process to continuously transport the optical film F. | 02-13-2014 |
Kazuaki Kozasa, Omura-Shi JP
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20080308129 | MANUFACTURING METHOD OF EPITAXIAL SILICON WAFER AND SUBSTRATE CLEANING APPARATUS - A manufacturing method of an epitaxial silicon wafer is provided. The epitaxial silicon wafer includes: a substrate cut out from a silicon monocrystal that has been manufactured, doped with nitrogen and pulled up in accordance with Czochralski method; and an epitaxial layer formed on the substrate. The manufacturing method includes: cleaning a surface of the substrate with fluorinated acid by spraying onto the surface of the substrate fluorinated acid vaporized by a bubbling tank of a substrate cleaning apparatus; and forming an epitaxial layer on the cleaned surface of the substrate. | 12-18-2008 |
20090053981 | METHOD OF RECYCLING ABRASIVE SLURRY - A method of recycling an abrasive slurry for recycling a slurry that: contains colloidal silica; and has been used in polishing semiconductor wafer(s) is provided. The method includes: adding a dispersant to the used slurry having been collected so as to prevent the used slurry from being gelled; irradiating ultrasound to the used slurry having been added with the dispersant so as to disperse a gelled portion and aggregated silica in the used slurry; and, by using a filter, removing a foreign substance contained in the used slurry having been irradiated with the ultrasound. | 02-26-2009 |
20100093177 | METHOD OF CLEANING SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER - A silicon wafer surface other than a defect is oxidized by ozone to form a silicon oxide film. A hydrofluoric acid is sprayed and subsequently a cleaning gas is sprayed onto the surface of the silicon wafer. | 04-15-2010 |
Kazuaki Kozasa, Hiratsuka-Shi JP
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20090042482 | ROUGH POLISHING METHOD OF SEMICONDUCTOR WAFER AND POLISHING APPARATUS OF SEMICONDUCTOR WAFER - A rough-polishing method for conducting a rough polishing before mirror-finish polishing on a semiconductor wafer using a polishing apparatus includes a first polishing step for polishing the semiconductor wafer using slurry containing colloidal silica supplied by a slurry supplying unit and a second polishing step for polishing the semiconductor wafer using alkali solution provided by mixing deionized water supplied from a deionized-water supplying unit and alkali concentrate solution supplied by an alkali-concentrate-solution supplying unit. The pH value of the alkali solution and polishing time in the second polishing step are determined based on the load current value of the polishing table in the first polishing step. | 02-12-2009 |
Kazuaki Kozasa, Nagasaki JP
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20090286333 | ETCHING METHOD AND ETCHING APPARATUS OF SEMICONDUCTOR WAFER - A method of etching a semiconductor wafer is provided. The method comprises the steps of: jetting a mixed gas including hydrogen fluoride and ozone onto a surface of a semiconductor wafer; monitoring the surface of the semiconductor wafer; analyzing the surface of the semiconductor wafer; and adjusting at least one of the hydrogen fluoride concentration and the ozone concentration in the mixed gas based on a result of the analysis. | 11-19-2009 |
20090298393 | SLURRY SUPPLYING APPARATUS AND METHOD OF POLISHING SEMICONDUCTOR WAFER UTILIZING SAME - A diluted slurry supplying apparatus utilized in a polishing apparatus for finishing a semiconductor wafer with a slurry containing colloidal silica and water-soluble polymer is provided. The polishing method comprises: a slurry supplier capable of supplying the slurry containing the colloidal silica and the water-soluble polymer; a diluent supplier capable of supplying a diluent containing an aggregation preventing agent to dilute the slurry; a mixer capable of receiving the slurry and the diluent having been supplied from the slurry supplier and the diluent supplier, respectively, the mixer forming a diluted slurry with a pH value of at least 9; and an ultrasonic vibrator capable of applying an ultrasonic vibration to the diluted slurry staying in the mixer or being fed out from the mixer. Here, the diluent supplying apparatus can change a dilution proportion of the diluted slurry. | 12-03-2009 |
20120305187 | ETCHING METHOD AND ETCHING APPARATUS OF SEMICONDUCTOR WAFER - A method and an apparatus of etching a semiconductor wafer are provided. The etching apparatus of a semiconductor wafer having a marker inside includes: a monitoring device capable of monitoring a surface of the semiconductor wafer so as to detect the marker; a nozzle capable of jetting a mixed gas that contains hydrogen fluoride and ozone onto the surface of the semiconductor wafer; a regulator capable of adjusting at least one of hydrogen fluoride concentration and ozone concentration in the mixed gas; and a controller capable of determining whether the marker is detected by the monitoring device and terminating the etching process. | 12-06-2012 |
Kenji Kozasa, Tsukuba-Shi JP
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20100140756 | APPARATUS FOR MANUFACTURING SILICON OXIDE THIN FILM AND METHOD FOR FORMING THE SILICON OXIDE THIN FILM - An object of the present invention is to provide a semiconductor thin film device which employs a silicon oxide thin film having an equivalent level of high insulating performance to those currently used in electronic devices, through a low-temperature printing process on a plastic substrate having plasticity or other types of substrates at a temperature equal to or lower than the heat resistant temperature of the substrate, and to provide a method for forming the device. The semiconductor thin film device is formed as follows: a coating film of a silicon compound including a silazane structure or a siloxane structure is formed on a plastic substrate having plasticity; the coating film is converted into a silicon oxide thin film; and the thin film is utilized as part of an insulating layer or a sealing layer. | 06-10-2010 |
Momoko Kozasa, Atsugi-Shi JP
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20100196062 | INTERMEDIATE TRANSFER BELT, IMAGE FORMING METHOD, AND IMAGE FORMING APPARATUS FOR USE IN ELECTROPHOTOGRAPHY - An intermediate transfer belt for use in electrophotography including plural linear convexities is provided. The plural linear convexities have a height of from 0.01 to 1 μm and a width of from 0.5 to 5 μm. | 08-05-2010 |
Naoto Kozasa, Yokohama-Shi JP
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20140357012 | MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR OPTICAL SUBSTRATE HAVING CONCAVO-CONVEX PATTERN USING FILM-SHAPED MOLD, AND MANUFACTURING METHOD FOR DEVICE PROVIDED WITH OPTICAL SUBSTRATE - A method for manufacturing an optical substrate includes: a step for preparing a long film-shaped mold; a step for preparing a sol; a step for forming a coating film of the sol on a substrate; a step for drying the coating film; a step for pressing a pattern surface of the film-shaped mold against the dried coating film with a pressing roll while feeding the film-shaped mold to the pressing roll; a step for releasing the film-shaped mold from the coating film; and a step for baking the coating film to which the concave and convex pattern has been transferred. | 12-04-2014 |
Nobuhiro Kozasa, Hagagun JP
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20140353116 | PART MOUNTING FACILITY AND PART MOUNTING METHOD - A part mounting facility is provided with substantially U-shaped conveyance paths having return bends, and the substantially U-shaped conveyance paths are formed by providing conveyance paths, which are in part mounting work regions, with the return bends. The substantially U-shaped conveyance paths are connected to each other, and the upstream-most substantially U-shaped conveyance path among the connected substantially U-shaped conveyance paths is connected to the downstream-most substantially U-shaped conveyance path to enable a workpiece conveyance dolly to circulate along the conveyance paths. | 12-04-2014 |
Nobuhiro Kozasa, Tochigi JP
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20090288284 | Panel integrating method - An outer panel and an inner panel are integrated by placing peripheral parts of the outer panel on a top surface of a lower mold such that bending parts formed by bending the peripheral parts of the outer panel are set up upward; placing a central portion of the outer panel on a top surface of a lifting device; lifting the central portion of the outer panel by the lifting device to open leading end sides of the bending parts of the outer panel outward; placing the inner panel on the top surface of the outer panel so as to superimpose those onto each other; lowering the central portion of the outer panel by the lifting device; and pressing the bending parts toward the lower mold by an upper mold to further bend the bending parts, and making the bending parts to closely contact with the peripheral parts of the inner panel. | 11-26-2009 |
20090301235 | Inspection system and inspecting method - An inspection system for inspecting a processing accuracy of a work piece is provided. The inspection system includes a supporting mechanism which supports the work piece in a same posture as a posture in which the work piece is assembled to a body; a load reproduction device which applies a load to the work piece along a substantially vertical direction; and a measurement device which measures positions of at least one characteristic portion of the work piece while the load is being applied to the work piece. | 12-10-2009 |
20120117783 | PANEL POSITIONING APPARATUS AND PANEL INTEGRATION METHOD - A panel positioning apparatus is provided with an outer panel supporting device | 05-17-2012 |
Takehito Kozasa, Tsukuba-Shi JP
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20090140235 | Semiconductor element and process for producing the same - The present invention provides a thin film transistor having excellent formability and processability, and particularly a thin film transistor using plastics as a substrate; an organic semiconductor as an active layer; and SiO | 06-04-2009 |
Yoshihiko Kozasa, Tokyo JP
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20130281903 | LEG SUPPORTER - A lower leg supporter supports a gastrocnemius muscle from upper, lower, left, and right sides without interfering with movement of an Achilles tendon and which can suppress excessive vibration or deformation of such muscle to reduce a wearer's fatigue. The lower leg supporter includes a first anchor section that secures a tubular knitted fabric to a below-knee part, a second anchor section that secures the tubular knitted fabric to an above-ankle part, and an X-shaped gastrocnemius muscle support section located at a joining part of such muscle and an Achilles tendon on the back surface side of the tubular knitted fabric. Two ends of the X-shaped knitted fabric are joined to the first anchor section to support the gastrocnemius muscle. The other two ends of the X-shaped knitted fabric are joined to the second anchor section, and extend to both edges of the Achilles tendon. | 10-24-2013 |