Patent application number | Description | Published |
20090321912 | Semiconductor device and method of manufacturing the same - A semiconductor device includes a substrate, a semiconductor chip, and first and second insulations. The substrate has at least a first region and a second region. The semiconductor chip structure covers the first region. The first insulation covers the second region. The first insulation has a first thermal expansion coefficient approximately equal to that of the semiconductor chip structure. The second insulation covers the semiconductor chip structure and the first insulation so that the semiconductor chip structure and the first insulation are sandwiched between the substrate and the second insulation. The second insulation has a second thermal expansion coefficient approximately equal to that of the substrate. | 12-31-2009 |
20100252923 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - A semiconductor device of the present invention includes a semiconductor chip formed with an electrode pad on a front side thereof, a wiring board having a wiring pattern, the wiring board having a front side opposing the back side of the semiconductor chip, a wire for electrically connecting the electrode pad of the semiconductor chip with the wiring pattern of the wiring board, an external terminal arranged on the back side of the wiring board for electrical connection with the electrode pad through the wire and the wiring pattern, and a sealant for fixing the semiconductor chip on the front side of the wiring board so as to form a hollow which is continuous to a portion straddling the entirety of the back side of the semiconductor chip and the front side of the wiring board, and continuous to a portion adjacent to at least one outer peripheral surface of the semiconductor chip except for the back side of the same. The wiring board includes a throughhole in communication with the hollow. | 10-07-2010 |
20100258933 | Semiconductor device, method of forming the same, and electronic device - A semiconductor device includes a substrate, a stack of semiconductor chips, and a first sealing material. The substrate may include, but is not limited to, a chip mounting area and a higher-level portion. The higher level portion surrounds the chip mounting area. The higher-level portion is higher in level than the chip mounting area. The stack of semiconductor chips is disposed over the chip mounting area. A first sealing material seals the stack of semiconductor chips. The first sealing material is confined by the higher-level portion. | 10-14-2010 |
20100301468 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device may include, but is not limited to a wiring board, a first insulator, a semiconductor chip, and a second insulator. The first insulator penetrates the wiring board. A top end of the first insulator is higher in level than an upper surface of the wiring board. The semiconductor chip is disposed on the top end of the first insulator. The semiconductor chip is separated from the upper surface of the wiring board. The second insulator covers the semiconductor chip and the upper surface of the wiring board. | 12-02-2010 |
20110294428 | COMMUNICATION DEVICE, READER/WRITER DEVICE, COMMUNICATION SYSTEM, AND COMMUNICATION METHOD - There is provided a communication device including a secure communication unit configured to perform secure communication with an external reader/writer device, the secure communication being secure close-proximity communication, a first communication unit configured to perform high-speed communication with the reader/writer device, the high-speed communication being close-proximity communication that is faster than the secure communication, a second communication unit configured to, when communication via the high-speed communication is disconnected, communicate with the reader/writer device with a communication mode that is different from a communication mode of the high-speed communication, a power transmission unit configured to receive power transmitted from the reader-writer device by power transmission, and a secondary battery configured to store the power received by the power transmission unit. The second communication unit may be configured to, when communication via the high-speed communication is disconnected, operate with the power stored in the secondary battery. | 12-01-2011 |
20110302042 | COMMUNICATION DEVICE, COMMUNICATION METHOD, AND COMMUNICATION SYSTEM - There is provided a communication device including a secure communication unit configured to perform secure communication, the secure communication being secure close-proximity communication, a high-speed communication unit configured to perform high-speed communication, the high-speed communication being close-proximity communication that is faster than the secure communication, and a power transmission unit configured to perform power transmission. Communication via the secure communication and the power transmission of the power transmission unit may be performed at timings that do not temporally overlap with each other. | 12-08-2011 |
20120118939 | PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE - The process for manufacturing the semiconductor device and the apparatus, which achieve stable production of semiconductor devices with improved connection reliability, is presented. First terminals of circuit boards | 05-17-2012 |
20120126402 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device includes a wiring board; a stack of semiconductor chips disposed over the wiring board, each of the semiconductor chip comprising via electrodes, the semiconductor chips being electrically coupled through the via electrodes to each other, the semiconductor chips being electrically coupled through the via electrodes to the wiring board; a first seal that seals the stack of semiconductor chips; and a second seal that covers the first seal. The first seal is smaller in elastic modulus than the second seal. | 05-24-2012 |
20130290175 | COMMUNICATION DEVICE, COMMUNICATION METHOD, AND COMMUNICATION SYSTEM - There is provided a communication device including a secure communication unit configured to perform secure communication, the secure communication being secure close-proximity communication, a high-speed communication unit configured to perform high-speed communication, the high-speed communication being close-proximity communication that is faster than the secure communication, and a power transmission unit configured to perform power transmission. Communication via the secure communication and the power transmission of the power transmission unit may be performed at timings that do not temporally overlap with each other. | 10-31-2013 |