Patent application number | Description | Published |
20090314283 | Support of heat collectors in solar energy collectors - Examples and variations of apparatus and Methods for concentrating solar radiation are disclosed. | 12-24-2009 |
20100236600 | PARKING SOLAR ENERGY COLLECTORS - Disclosed are various apparatus and methods that may reduce or prevent damage to fragile components of solar collectors during storms, especially more violent storms such as hurricanes and sand-storms. | 09-23-2010 |
20110067692 | SOLID CORE STRUCTURE PARABOLIC TROUGH SOLAR ENERGY COLLECTION SYSTEM - Foam backed solid support structure and trough solar energy collector. A support structure has foam or other polymeric material, a plurality of end arms, and a plurality of end caps secured to the formed foam material. The foam material is cut into a parabolic or semi-parabolic shape, and a reflective element may be placed onto the formed foam material and secured mechanically, with adhesion, and/or integrated with the surface. A solar energy collector formed using a polymeric core may have longitudinally-extending cowling, end caps, and end arms as described. | 03-24-2011 |
20110073104 | PARABOLIC TROUGH SOLAR ENERGY COLLECTION SYSTEM - Examples and variations of apparatus and methods for concentrating solar radiations with trough solar energy collectors are disclosed. A support assembly for a trough solar energy collector has a plurality of transverse ribs attached to longitudinal rails and end assemblies secured to the rails. End assemblies may attach to longitudinal rails through transverse ribs, and guy wires may span from one of the end sections to the other. Transverse ribs may be formed of two rib sections with semi-parabolic shape. Solar energy collecting panels may be placed on the ribs and secured with cowlings and transverse panel-retaining strips, for instance. | 03-31-2011 |
20110220096 | Concentrated solar trough and mobile solar collector - Solar energy reflector, collector, array, and other equipment for converting solar energy to e.g. thermal energy. A reflector or collector may, for instance, comprise a plurality of longitudinal rails; a rib engaging and spanning the plurality of longitudinal rails; and a first mirror panel. The rib of the reflector or collector may have a slot that is parabolic or in the shape of a section of a parabola. A portion of the mirror panel such as an end portion or a portion located away from the ends may be positioned within the rib's slot. | 09-15-2011 |
20120186579 | Components and solar energy collection system - Scalable arm assemblies for solar energy collector. In one instance, two end arms of two collectors are formed with identical hubs, end fittings, and bottom fitting but different connectors between hubs and fittings. Separate solar energy collector panels or wings may be interconnected with e.g. an interconnect that is asymmetric in one direction but symmetric in a second direction in cross-section. A solar energy collector may also have a unique sprocket drive system. | 07-26-2012 |
20130228165 | SUPPORT OF HEAT COLLECTORS IN SOLAR ENERGY COLLECTORS - Examples and variations of apparatus and Methods for concentrating solar radiation are disclosed. | 09-05-2013 |
Patent application number | Description | Published |
20120323929 | COMPRESSION AWARE PHYSICAL DATABASE DESIGN - A plurality of indicators representing a plurality of respective candidate database configurations may be obtained, each of the candidate database configurations including a plurality of database queries and a plurality of candidate database indexes associated with a database table. A portion of the candidate database indexes included in the plurality of database indexes may be selected based on skyline selection. An enumeration of the portion of the plurality of the candidate database indexes may be determined based on a greedy algorithm. | 12-20-2012 |
20130318126 | TREE DATA STRUCTURE - A method of implementing a tree data structure comprises creating a parent and child relationship between a first node and a second node, in which the first node and second node are at the same hierarchical level of the tree data structure, and maintaining only one incoming pointer for each of the nodes in the tree data structure at all times. A tree data structure in which each node in the tree data structure has a single incoming pointer, and in which the tree data structure comprises a pointer directed to a local overflow node from a node at the same hierarchical level as the local overflow node. | 11-28-2013 |
20140040208 | EARLY RELEASE OF TRANSACTION LOCKS BASED ON TAGS - A computing system is associated with a first transaction and a second transaction. The first transaction is associated with an update to data and a release of at least one lock on the data prior to the first transaction being durable. The at least one lock is associated with and/or replaced with at least one tag. The computing system is to identify that the second transaction is to acquire the at least one tag based on a read of the data, determine whether the first transaction is durable based on the at least one tag, and delay a transaction commit for the second transaction until the first transaction is durable. | 02-06-2014 |
20140040218 | METHODS AND SYSTEMS FOR AN INTENT LOCK ENGINE - In at least some examples, a system may include a processor core and a non-transitory computer-readable memory in communication with the processor core. The non-transitory computer-readable memory may store an intent lock engine to manage intent locks based on a private lock table for each process associated with said processor core and a global lock table for a plurality of processes associated with at least one of a plurality of processor cores including said processor core. | 02-06-2014 |
20140040219 | METHODS AND SYSTEMS FOR A DEADLOCK RESOLUTION ENGINE - In at least some examples, a system may include a processor core and a non-transitory computer-readable memory in communication with the processor core. The non-transitory computer-readable memory may store a deadlock resolution engine to resolve a deadlock condition based on an abort shortest pipeline policy. | 02-06-2014 |
20140040220 | METHODS AND SYSTEMS FOR DEADLOCK DETECTION - In at least some examples, a system may include a processor core and a non-transitory computer-readable memory in communication with the processor core. The non-transitory computer-readable memory may store deadlock detection engine to determine a deadlock condition, wherein the deadlock detection engine accounts for a set of database lock modes. | 02-06-2014 |
Patent application number | Description | Published |
20140049574 | INKJET HEAD DRIVING DEVICE - According to one embodiment, an inkjet head driving device includes a load-voltage generating circuit and a plurality of channel driving circuits provided to respectively correspond to a plurality of channels of an inkjet head. The load-voltage generating circuit selects any one voltage out of a reference voltage and a driving voltage having potential other than the reference voltage and outputs the voltage. Each of the channel driving circuits includes a first input terminal, a second input terminal, a third input terminal, an output terminal, a series circuit, and a parallel circuit. | 02-20-2014 |
20140111570 | INK JET HEAD DRIVING DEVICE - A driving device of an ink jet head including a plurality of ejection channels, includes a plurality of driving waveform generation portions that are provided so as to respectively correspond to the plurality of ejection channels, a random number generation portion that generates a random number, and a connection portion. The respective driving waveform generation portions receive printing data and correction data, generate a driving signal of the ejection channels on the basis of the received printing data, correct a waveform of the driving signal by using the received correction data, and then output the corrected waveform to the corresponding ejection channels. The connection portion connects the random number generation portion to the respective driving waveform generation portions such that a random number generated from the random number generation portion is supplied to each of the driving waveform generation portions as correction data having a value independent for each of the driving waveform generation portions. | 04-24-2014 |
20140160194 | DRIVING DEVICE AND DRIVING METHOD OF INKJET HEAD - There is provided a controller which sets electrodes which are respectively disposed on wall surfaces of a plurality of ink chambers which are arranged in parallel so as to be separated from each other by partitions made of a piezoelectric material, to a high impedance state. In addition, at a timing when an identical potential is applied to the electrodes of at least three ink chambers which are arranged in parallel so as to be separated from each other by mutually adjacent partitions, the controller sets electrodes of ink chambers other than ink chambers located on both sides to a high impedance state. | 06-12-2014 |
20140160195 | PULSE GENERATOR - A pulse generator forms, from setting data respectively stored in an ejection relevant waveform setting register and a first high impedance setting register, an ejection relevant driving pulse for setting an electrode of an ink chamber communicating with an ejection relevant nozzle to a high impedance state for a predetermined period. The pulse generator forms, from setting data respectively stored in an ejection both-side waveform setting register and a second high impedance setting register, an ejection both-side driving pulse for setting electrodes of ink chambers communicating with ejection both-side nozzles to the high impedance state for the predetermined period. The pulse generator outputs signals of the formed driving pulses to an inkjet head. | 06-12-2014 |
20140176627 | INKJET HEAD DRIVING METHOD AND DRIVING DEVICE - According to one embodiment, a driving device applies an ejection pulse signal that deforms a partition in such a way that an ink drop is ejected from a nozzle and an auxiliary pulse signal that deforms the partition to such an extent that an ink drop is not ejected from the nozzle, as a drive signal for providing a potential difference between electrodes, to an inkjet head at different timings so that the two pulse signals are not applied simultaneously. A constraint on output of the auxiliary pulse signal is significantly relaxed. | 06-26-2014 |
20150054872 | INK-JET HEAD DRIVE DEVICE - A drive device includes a circuit for selecting an arbitrary voltage among a plurality of kinds of voltages required for generating a drive signal for variably controlling potential applied to electrodes of channels. In the drive device, respective drive voltage input terminals and output terminals are respectively connected by a low-impedance connecting circuit which has low internal resistance, and a selected voltage input terminal and the output terminals are connected by a high-impedance connecting circuit which has high internal resistance. The drive device controls a drive waveform transition pattern of a drive signal such that the drive signal is output via the high-impedance connecting circuit while the potential applied to the respective electrode simultaneously changes in the same direction out of a positive direction and a negative direction and that the drive signal is output via the low-impedance connecting circuit in the other cases. | 02-26-2015 |
Patent application number | Description | Published |
20090030348 | Concurrently measuring a force exerted upon each of a plurality of teeth - A system and method for concurrently measuring a force exerted upon a tooth is disclosed. In one aspect of the invention, the system includes a target tooth attached to a force gauge which is coupled to a motion module for adjusting the tooth to a reference position. The method includes utilizing a motion module of a force measurement device is utilized to adjust each target tooth of a plurality of target teeth to be located in a reference position. Next, each target tooth receives a dental appliance. Then an exerted force is measured by the dental appliance upon each target tooth utilizing a coordinate system of the force gauge. | 01-29-2009 |
20090092942 | INJECTION IMPRESSION TRAY - The present invention relates to an improved dental impression tray and related methods. In one embodiment, a dental impression tray includes a first portion for receiving impression material from a source and a second portion is configured for receiving a patient's upper or lower teeth and will at least partial define a cavity shaped to receive the teeth during use. In use, impression material introduced into the first portion can pass through openings and into the second portion and around a patient's teeth. | 04-09-2009 |
20090191502 | ORTHODONTIC REPOSITIONING APPLIANCES HAVING IMPROVED GEOMETRY, METHODS AND SYSTEMS - The present invention provides methods and systems including orthodontic tooth positioning appliances. An exemplary appliance can include teeth receiving cavities shaped such that, when worn by a patient, repositioning the patient's teeth from a first arrangement toward a subsequent or target arrangement. Appliances can include a cavity having one or more shaped features or protrusions shaped and/or positioned so as to apply a desired force to a patient's tooth received in the cavity and move the tooth along a desired path or direction. | 07-30-2009 |
20100138025 | ORTHODONTIC SYSTEMS AND METHODS INCLUDING PARAMETRIC ATTACHMENTS - Orthodontic systems and related methods are disclosed for designing and providing improved or more effective tooth moving systems for eliciting a desired tooth movement and/or repositioning teeth into a desired arrangement. Methods and orthodontic systems of the invention include tooth attachments having improved or optimized parameters selected or modified for more optimal and/or effective application of forces for a desired/selected orthodontic movement. Attachments of the present invention can be customized to a particular patient (e.g., patient-customized), a particular movement, and/or a sub-group or sub-set of patients, and configured to engage an orthodontic tooth positioning appliance worn by a patient, where engagement between the attachment and orthodontic appliance results in application of a repositioning force or series/system of forces to the tooth having the attachment and will generally elicit a tooth movement. | 06-03-2010 |
20160067013 | ORTHODONTIC SYSTEMS AND METHODS INCLUDING PARAMETRIC ATTACHMENTS - Orthodontic systems and related methods are disclosed for designing and providing improved or more effective tooth moving systems for eliciting a desired tooth movement and/or repositioning teeth into a desired arrangement. Methods and orthodontic systems of the invention include tooth attachments having improved or optimized parameters selected or modified for more optimal and/or effective application of forces for a desired/selected orthodontic movement. Attachments of the present invention can be customized to a particular patient (e.g., patient-customized), a particular movement, and/or a sub-group or sub-set of patients, and configured to engage an orthodontic tooth positioning appliance worn by a patient, where engagement between the attachment and orthodontic appliance results in application of a repositioning force or series/system of forces to the tooth having the attachment and will generally elicit a tooth movement. | 03-10-2016 |
20160081769 | ARCH ADJUSTMENT APPLIANCE - The present disclosure provides method, systems, and devices for adjusting an arch of teeth. An appliance includes a removable shell formed of a first material having a number of cavities formed therein, wherein the number of cavities are shaped to receive teeth of a patient, and an arch element extending from the removable shell in a lingual direction and across at least a portion of the arch width of the removable shell, wherein the arch element is designed to expand an arch of the teeth of the patient, wherein the arch element has a width specific to a stage of a treatment plan. | 03-24-2016 |
Patent application number | Description | Published |
20140051256 | ETCH WITH MIXED MODE PULSING - A method for etching a dielectric layer disposed below a patterned organic mask with features, with hardmasks at bottoms of some of the organic mask features is provided. An etch gas is provided. The etch gas is formed into a plasma. A bias RF with a frequency between 2 and 60 MHz is provided that provides pulsed bias with a pulse frequency between 10 Hz and 1 kHz wherein the pulsed bias selectively deposits on top of the organic mask with respect to the dielectric layer. | 02-20-2014 |
20140179106 | IN-SITU METAL RESIDUE CLEAN - A method for forming devices in an oxide layer over a substrate, wherein a metal containing layer forms at least either an etch stop layer below the oxide layer or a patterned mask above the oxide layer, wherein a patterned organic mask is above the oxide layer is provided. The substrate is placed in a plasma processing chamber. The oxide layer is etched through the patterned organic mask, wherein metal residue from the metal containing layer forms metal residue on sidewalls of the oxide layer. The patterned organic mask is stripped. The metal residue is cleaned by the steps comprising providing a cleaning gas comprising BCl | 06-26-2014 |
20140220709 | CONTROLLING CD AND CD UNIFORMITY WITH TRIM TIME AND TEMPERATURE ON A WAFER BY WAFER BASIS - Exemplary embodiments are directed to controlling CD uniformity of a wafer by controlling trim time on temperature in a plasma processing system. The plasma processing system has a wafer support assembly including a plurality of independently controllable temperature control zones across a chuck and a controller that controls each temperature control zone. The controller receives process control and temperature data associated with at least one wafer previously processed in a plasma chamber of the plasma processing system, and critical device parameters of a current wafer to be processed in the plasma chamber. The controller calculates a target trim time and a target temperature profile of the current wafer based on the process control and temperature data, and the critical device parameters. The current wafer is trimmed during the target trim time while the temperature of each device die location is controlled based on the target temperature profile. | 08-07-2014 |
20140302678 | INTERNAL PLASMA GRID APPLICATIONS FOR SEMICONDUCTOR FABRICATION - The embodiments disclosed herein pertain to improved methods and apparatus for etching a semiconductor substrate. A plasma grid assembly is positioned in a reaction chamber to divide the chamber into upper and lower sub-chambers. The plasma grid assembly may include one or more plasma grids having slots of a particular aspect ratio, which allow certain species to pass through from the upper sub-chamber to the lower sub-chamber. In some cases, an electron-ion plasma is generated in the upper sub-chamber. Electrons that make it through the grid to the lower sub-chamber are cooled as they pass through. In some cases, this results in an ion-ion plasma in the lower sub-chamber. The ion-ion plasma may be used to advantage in a variety of etching processes. | 10-09-2014 |
20150053347 | CONTROLLING CD AND CD UNIFORMITY WITH TRIM TIME AND TEMPERATURE ON A WAFER BY WAFER BASIS - Exemplary embodiments are directed to controlling CD uniformity of a wafer by controlling trim time on temperature in a plasma processing system. The plasma processing system has a wafer support assembly including a plurality of independently controllable temperature control zones across a chuck and a controller that controls each temperature control zone. The controller receives process control and temperature data associated with at least one wafer previously processed in a plasma chamber of the plasma processing system. The controller also receives critical device parameters of a current wafer to be processed in the plasma chamber. The controller calculates a target trim time and a target temperature profile of the current wafer based on the process control and temperature data of the at least one previously processed wafers and the critical device parameters of the current wafer. The current wafer as subjected to a trimming operation for a duration of the target trim time while controlling temperatures in the temperature control zones to thereby control temperature of each device die location based on the target temperature profile. | 02-26-2015 |
20150249016 | METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE IN A PLASMA ETCH CHAMBER - A method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber comprises supporting the substrate on a support surface of a substrate support assembly that includes an array of independently controlled thermal control elements therein which are operable to control the spatial and temporal temperature of the support surface of the substrate support assembly to form independently controllable heater zones which are formed to correspond to a desired temperature profile across the upper surface of the semiconductor substrate. The etch rate across the upper surface of the semiconductor substrate during plasma etching depends on a localized temperature thereof wherein the desired temperature profile is determined such that the upper surface of the semiconductor substrate is planarized within a predetermined time. The substrate is plasma etched for the predetermined time thereby planarizing the upper surface of the substrate. | 09-03-2015 |
20160086795 | INTERNAL PLASMA GRID APPLICATIONS FOR SEMICONDUCTOR FABRICATION - The embodiments disclosed herein pertain to improved methods and apparatus for etching a semiconductor substrate. A plasma grid assembly is positioned in a reaction chamber to divide the chamber into upper and lower sub-chambers. The plasma grid assembly may include one or more plasma grids having slots of a particular aspect ratio, which allow certain species to pass through from the upper sub-chamber to the lower sub-chamber. In some cases, an electron-ion plasma is generated in the upper sub-chamber. Electrons that make it through the grid to the lower sub-chamber are cooled as they pass through. In some cases, this results in an ion-ion plasma in the lower sub-chamber. The ion-ion plasma may be used to advantage in a variety of etching processes. | 03-24-2016 |
20160111515 | AIR GAP SPACER INTEGRATION FOR IMPROVED FIN DEVICE PERFORMANCE - A method for providing a FinFET device with an air gap spacer includes providing a substrate a plurality of fins and a dummy gate arranged transverse to the plurality of fins; depositing a sacrificial spacer around the dummy gate; depositing a first interlayer dielectric (ILD) layer around the sacrificial spacer; selectively etching the dummy polysilicon gate relative to the first ILD layer and the sacrificial spacer; depositing a replacement metal gate (RMG); etching a portion of the RMG to create a recess surrounded by the sacrificial spacer; and depositing a gate capping layer in the recess. The gate capping layer is at least partially surrounded by the sacrificial spacer and is made of silicon oxycarbide (SiOC). | 04-21-2016 |