Patent application number | Description | Published |
20100000718 | SILICON-BASED THERMAL ENERGY TRANSFER DEVICE AND APPARATUS - A thermal energy transfer device attached to an object to dissipate thermal energy from the object is provided. The thermal energy transfer device includes a non-metal base plate and a first non-metal fin structure. The base plate has a first primary surface and a second primary surface opposite the first primary surface, and includes at least one groove on the first primary surface. The fin structure has a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges that are between the first and the second primary surfaces including a first edge. The first fin structure is attached to the base plate with the first edge received in a first groove of the at least one groove of the base plate. | 01-07-2010 |
20100046569 | SILICON-BASED LENS SUPPORT STRUCTURE FOR DIODE LASER - An apparatus that includes a first diode laser and a silicon-based support structure is provided. The first diode laser is configured to emit a first laser beam when powered. The support structure includes a silicon-based support plate, a silicon-based first fin structure, and a silicon-based second fin structure. The support plate has a first primary surface and a second primary surface opposite the first primary surface. The first fin structure has a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges between the first and the second primary surfaces including a first edge and a second edge opposite the first edge. The first fin structure is physically coupled to the support plate with the first edge of the first fin structure attached to the first primary surface of the support plate. The second fin structure has a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges between the first and the second primary surfaces including a first edge and a second edge opposite the first edge. The second fin structure is physically coupled to the support plate with the first edge of the second fin structure attached to the first primary surface of the support plate. The first diode laser is physically coupled between the first and the second fin structures to emit the first laser beam in a direction away from the support plate. | 02-25-2010 |
20120103569 | Silicon-Based Cooling Package for Laser Gain Medium - Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. | 05-03-2012 |
20120195051 | Silicon-Based Cooling Package for Light-Emitting Devices - Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a silicon-based base plate and a silicon-based cover element disposed on the base plate. The base plate includes a recess to receive a light-emitting device therein. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the light-emitting device between the base plate and the cover element with at least a portion of a light-emitting surface of the light-emitting device exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate. | 08-02-2012 |
20120211199 | Silicon-Based Cooling Package with Diamond Coating for Heat-Generating Devices - Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a heat-generating device are described. In one aspect, a thermal energy transfer apparatus comprises a silicon-based manifold having an internal cavity, a first primary side, and a second primary side opposite the first primary side. The second primary side of the manifold has at least one coolant inlet port and at least one coolant outlet port that are connected to the internal cavity of the manifold, the at least one coolant inlet port being at a position directly opposite a position on the diamond layer where the heat-generating device is received. A diamond layer covers at least a portion of the first primary side of the manifold such that the heat-generating device is in direct contact with the diamond layer when the heat-generating device is received on the first primary side of the manifold. | 08-23-2012 |
20120275482 | Silicon-Based Lens Support Structure For Diode Laser - An apparatus that includes a silicon-based support member and a silicon-based alignment structure is provided. The silicon-based alignment structure is received on a receiving surface of the support member. The alignment structure includes a first surface and a second surface parallel to and facing the first surface with a gap defined therebetween and configured to receive a light-emitting device inside the gap with the first surface and the second surface in contact with the light-emitting device such that, when a collimating rod lens is disposed on the alignment structure and over the gap, a longitudinal center line of the collimating rod lens is not aligned with a mid-point of the gap. | 11-01-2012 |
20130206365 | Silicon-Based Cooling Package For Laser Gain Medium - Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. | 08-15-2013 |
20130258597 | Silicon-Based Cooling Package For Cooling And Thermally Decoupling Devices In Close Proximity - Various embodiments of an apparatus that simultaneously cools and thermally decouples adjacent electrically-driven devices in close proximity are provided. In one aspect, an apparatus comprises a first non-silicon heat sink and a first silicon-based heat sink disposed on the first non-silicon heat sink. The first silicon-based heat sink is configured to receive a first electrically-driven device on a first portion of the first silicon-based heat sink and to receive a second electrically-driven device on a second portion of the first silicon-based heat sink. The first silicon-based heat sink includes a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink. | 10-03-2013 |
20130270255 | Silicon-Based Cooling Package With Preheating Capability For Compact Heat-Generating Devices - A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device is described. In one aspect, the apparatus comprises a silicon-based cooling device configured to receive the heat-generating device and at least one heating element disposed on the silicon-based cooling device. The at least one heating element is configured to maintain a temperature of at least a first region of the silicon-based cooling device in a predetermined condition when the heat-generating device is deactivated. | 10-17-2013 |
20130299135 | Silicon-Based Cooling Package For Laser Gain Medium - Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. | 11-14-2013 |
20130308279 | Thermal Energy Storage With A Phase-Change Material In A Non-Metal Container - A thermal energy storage apparatus that absorbs thermal energy from a heat-generating device is described. In one aspect, the thermal energy storage apparatus comprises a non-metal container and a phase-change material. The non-metal container is configured to receive the heat-generating device thereon. The phase-change material is contained in the non-metal container and configured to absorb at least a portion of heat from the heat-generating device through the non-metal container. | 11-21-2013 |
20140000856 | Silicon-Based Lens Support Structure And Cooling Package With Passive Alignment For Compact Heat-Generating Devices | 01-02-2014 |
20140003056 | Silicon-Based Lens Support Structure And Cooling Package With Passive Alignment For Compact Heat-Generating Devices | 01-02-2014 |
20140014161 | 3-D Solar Cell Device For Concentrated Photovoltaic Systems - A concentrated photovoltaic device that is capable of generating thermal and electrical energy from solar radiation using a three-dimensional solar cell design structure with no need for a sun-tracking system is provided. The three-dimensional solar cell structure uses liquid cooling to provide maximum energy utilization from both stored thermal and electrical solar energy. | 01-16-2014 |
20140030575 | Thermal Reservoir Using Phase-Change Material For Portable Applications - An apparatus using a phase-change material for thermal management in portable applications is described. In one aspect, the apparatus includes a phase-change material, a thermal reservoir, and a heat transport element. The thermal reservoir has a cavity therein to contain the phase-change material in the cavity. The heat transport element is made of a thermally conductive material. A first portion of the heat transport element traverses through the thermal reservoir and in contact with the phase-change material. A second portion of the heat transport element extends outside the thermal reservoir. Accordingly, at least part of the thermal energy from an object in contact with the heat transport element can be transported to the phase-change material via the heat transport element and be absorbed by the phase-change material as latent heat. The phase-change material may release at least part of the absorbed thermal energy at a later time. | 01-30-2014 |
20140124185 | Silicon-Based Thermal Energy Transfer Device And Apparatus - A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove. | 05-08-2014 |
20140131011 | Silicon-Based Thermal Energy Transfer Device And Apparatus - A thermal energy transfer apparatus is described. The apparatus includes a silicon-based support module and a plurality of silicon-based plate modules. The silicon-based support module includes a plurality of grooves on a first primary surface of the support module. The plurality of silicon-based plate modules each includes a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges that are between the first and the second primary surfaces. A first edge of the edges of each plate module is received in a respective one of the grooves of the support module to attach the respective plate module substantially orthogonally to the support module. | 05-15-2014 |
20140158329 | Silicon-Based Thermal Energy Transfer Device And Apparatus - A thermal energy transfer device is described. The device includes a silicon-based base plate and a silicon-based plate structure. The base plate includes a first primary surface and a second primary surface opposite the first primary surface. The plate structure includes a first primary surface, a second primary surface opposite and substantially parallel to the first primary surface, and a plurality of edges that are between the first and the second primary surfaces. A first edge of the edges of the plate structure is disposed on the first primary surface of the base plate at an angle greater than 0 degree between the first primary surface of the base plate and the first primary surface of the plate structure. | 06-12-2014 |
20140160685 | Composite Heat Sink Device For Cooling Of Multiple Heat Sources In Close Proximity - In one aspect, an apparatus comprises a substrate, a first electrically-driven device disposed on the substrate, a second electrically-driven device disposed on the substrate, and a composite heat sink device. The composite heat sink device comprises a first thermal conduction member, a second thermal conduction member, and a thermal insulation member. The first thermal conduction member is disposed on the first electrically-driven device such that at least a portion of the heat generated by the first electrically-driven device is transferred to the first thermal conduction member by conduction. The second thermal conduction member is disposed on the second electrically-driven device such that at least a portion of the heat generated by the second electrically-driven device is transferred to the second thermal conduction member by conduction. The thermal insulation member is disposed between and thermally decouples the first thermal conduction member and the second thermal conduction member from one another. | 06-12-2014 |
20140261623 | 3-D Solar Cell Device For A Concentrated Photovoltaic System - A low cost design for a concentrated photovoltaic (CPV) solar cell device is developed with a 3-D solar cell structure that eliminates the need for sun-ray tracking and with improved electricity conversion efficiency for cooling solar cells. The 3-D solar cell structure can be built with conventional monocrystalline or polycrystalline silicon or with multi-junction III-V solar material, joining two or more solar cell segments perpendicular to a base solar cell. This structure is able to collect all incident sunlight from sunrise to sunset. | 09-18-2014 |
20140265876 | Automatic Color Balancing of Light-Emitting Diode-Based Lighting - Apparatus and method of color balancing LED-based lighting are provided. In one aspect, an apparatus comprises an image sensor that senses images of objects, an illumination device, and control logic. The illumination device comprises an LED that emits red light, an LED that emits green light, and an LED that emits blue light. The control logic receives an imaging signal from the image sensor related to a sensed image of a first object that is illuminated by the illumination device. The control logic controls color balancing of light emitted by the illumination device according to an optical characteristic of the image of the first object. | 09-18-2014 |
20140268859 | Apparatus and Method of Precision-Controlled Distribution of Lighting of High Uniformity - An apparatus for illumination is provided. In one aspect, the apparatus comprises a light guide device including a hollow light pipe portion, an opening, and a distal end longitudinally opposite from the opening. The opening is configured to receive at least a portion of an illumination device therein. Either or both of the light pipe portion and the distal end has a textured surface thereof. | 09-18-2014 |
20140269798 | Silicon-Based Cooling Apparatus For Laser Gain Medium - Embodiments of silicon-based thermal energy transfer apparatus for a gain medium of a laser system are provided. In one aspect, a silicon-based thermal energy transfer apparatus includes silicon-based first and second manifolds each having internal coolant flow channels therein. When the first and second manifolds are coupled together, a first groove on the first manifold and a second groove on the second manifold form a through hole configured to receive the gain medium therein. The through hole has a polygonal cross section when viewed along a longitudinal axis of the gain medium. | 09-18-2014 |
20140290926 | Silicon-Based Heat-Dissipation Device For Heat-Generating Devices - Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device. | 10-02-2014 |
20140293543 | Silicon-Based Heat Dissipation Device For Heat-Generating Devices - Embodiments of a silicon-based heat dissipation device and a chip module assembly utilizing the silicon-based heat dissipation device are described. In one aspect, the chip module assembly includes a chip module and a primary heat dissipation module. The chip module includes a board and at least one heat-generating device. The board includes a first primary side and a second primary side opposite the first primary side. The at least one heat-generating device is disposed on the first primary side of the board. The primary heat dissipation module includes at least one silicon-based heat dissipation device disposed on the at least one heat-generating device. | 10-02-2014 |
20140321489 | Silicon-Based Cooling Package for Light-Emitting Devices - Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a non-metal base plate and a silicon-based cover element disposed on the base plate. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the one or more light-emitting devices between the base plate and the cover element with at least a portion of a light-emitting surface of each of the one or more light-emitting devices exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate. | 10-30-2014 |
20150091156 | Three-Dimensional Silicon Structure For Integrated Circuits And Cooling Thereof - Embodiments of a three-dimensional silicon structure for integrated circuits and cooling thereof are described. In one aspect, a device includes a silicon substrate having a first primary side and a second primary side opposite the first primary side. The first primary side includes a circuit structure disposed thereon. The second primary side includes a plurality of fins monolithically formed thereon. | 04-02-2015 |
20150098191 | Silicon Heat-Dissipation Package For Compact Electronic Devices - Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween. | 04-09-2015 |
20150200150 | Thermal Management In Electronic Apparatus With Phase-Change Material And Silicon Heat Sink - Embodiments of an electronic apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the electronic apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit and the phase-change material. The main unit comprises a substrate and at least one integrated-circuit (IC) chip disposed on the substrate. The phase-change material is in direct contact with each IC chip of the at least one IC chip to absorb and dissipate heat generated by the at least one IC chip. | 07-16-2015 |