Patent application number | Description | Published |
20090281762 | IC device-in-pocket detection with angular mounted lasers and a camera - A detection method and apparatus is provided. The detection apparatus includes at least two angular mounted lasers, a surface for receiving laser lines emitted by the angular mounted lasers, a camera for detecting a laser pattern formed by the laser lines on the surface, and a processor for analyzing the laser pattern. The lasers emit orthogonal laser lines on a surface of the device. The camera detects a laser pattern on the surface of the device and the processor analyzes the laser pattern to determine whether the position of the device is in pocket based on the analysis and position algorithms. | 11-12-2009 |
20090289206 | Camera based vision alignment with device group guiding for semiconductor device testing handlers - A vision alignment system and method is provided. The vision alignment system includes one or more grouped alignment plates with guiding inserts configured to receive multiple devices, and groups of three actuators, configured to actuate the alignment plates to correct the position offsets of multiple devices as a group. The position offsets between the device and contactor are determined by a device-view camera during runtime and a contactor-view camera during calibration time. The vision alignment system also includes a pick-and-place handler, configured to transport devices. | 11-26-2009 |
20100017161 | Vision alignment with multiple cameras and common coordinate at contactor for ic device testing handlers - A method and apparatus for aligning a device with a contactor is provided. The apparatus includes a pick and place device, for transporting the device. A first camera acquires an image of the device relative to device holder fiducials of the pick and place device. A second camera detects the location of the contactor relative to fiducials positioned on an alignment frame plate. A third camera to image frame and device holder fiducials to correlate the first and second camera coordinates. Given a processor determines the alignment difference between the device and the contactor. A plurality of actuators align the device with the contactor. | 01-21-2010 |
20110010122 | CALIBRATING SEPARATELY LOCATED CAMERAS WITH A DOUBLE SIDED VISIBLE CALIBRATION TARGET FOR IC DEVICE TESTING HANDLERS - A camera coordinate calibration system and method are provided. The system includes a calibration contactor having at least two fiducials. The system also includes a double sided visible calibration target. A pick and place handler is provided with a device holder having at least two fiducials, where the device holder is configured to pickup the double sided visible calibration target and place the target onto the calibration contactor. The system includes a device view camera configured to image a first side of the double sided visible calibration target inserted into the device holder, and a contactor view camera configured to image a second side of the target inserted into the calibration contactor. A processor is provided that calculates a common coordinate system for the device view camera and the contactor view camera based on the images of the first and second sides of the double sided visible calibration target. | 01-13-2011 |
20110228080 | UP-LOOK CAMERA BASED VISION APPARATUS TO AUTO ALIGN PICK-AND-PLACE POSITIONS FOR DEVICE HANDLERS - A method of pick-and-place alignment comprises (a) determining a pick location of a device from a tray of devices; (b) determining place location of the device using an up-looking camera; and (c) determining offset error for the device by comparing the pick location and the place location. The method may further comprise repeating steps (a)-(c) for additional devices on the tray of devices; and generating an offset map for alignment of devices on the tray. The method further uses the offset map to make pick and place corrections during runtime. | 09-22-2011 |
20130215256 | IMAGING SYSTEM WITH DEFOCUSED AND APERTURE-CROPPED LIGHT SOURCES FOR DETECTING SURFACE CHARACTERISTICS - A system for detecting characteristics of a surface includes multiple sources of lights, a platform structure configured to support the surface, a lens aligned with the platform structure, a cropping aperture, and an image receiver. The platform structure is configured to receive light from the source of light and the lens is positioned such that the source of light is not in focus, but the detected surface is in focus. The cropping aperture is configured to crop light reflected from the surface, and the image receiver is configured to receive the light conditioned by the cropping aperture. | 08-22-2013 |
20140347446 | METHOD AND APPARATUS FOR IC 3D LEAD INSPECTION HAVING COLOR SHADOWING - A system for three-dimensional inspection of leads mounted on an integrated circuit device includes an integrated circuit device, a first light source having a first color, a second light source having a second color different from the first color, a RGB color camera and a processor. The first light source is disposed at an acute angle to the integrated circuit device, and is configured to illuminate the leads such that lead shadows are created in a first color plane. The second light source is disposed in front of a surface of the integrated circuit device on which the leads are mounted, and is configured to illuminate the leads in a second color plane. The camera is configured to image the illuminated leads and lead shadows. The processor is configured to analyze the first and second color planes of a single image to detect three-dimensional bent leads. | 11-27-2014 |
20150015286 | MICRO-VISION ALIGNMENT SYSTEM WITH GUIDING RINGS FOR IC TESTING - A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array. | 01-15-2015 |