Patent application number | Description | Published |
20090027869 | Electronic device and method for manufacturing electronic device - An electronic device is provided with an improved reliability and a reduced contamination in a functional unit of an exposed element, and a method for manufacturing thereof is also provided. An electronic device includes a light receiving element, a frame member composed of a first resin provided so as to surround a photo acceptor unit of the light receiving element, and an encapsulating resin layer composed of a second resin and filling a periphery of the frame member. The photo acceptor unit of the light receiving element is exposed in a space surrounded by the frame member. The upper surface of the frame member and the upper surface of the encapsulating resin layer form a common plane, or the upper surface of the frame member is higher than the upper surface of the encapsulating resin layer. | 01-29-2009 |
20100055833 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH FUNCTIONAL PORTION OF ELEMENT IS EXPOSED - A method of manufacturing a semiconductor device includes: forming a first resin layer on a wafer having a light receiving portion; patterning the first resin layer into a predetermined shape and forming a first resin film on the light receiving portion; dividing the wafer into light receiving elements; mounting the light receiving elements on an upper surface of a lead frame; a sealing step of forming a sealing resin layer around the first resin film; and removing the first resin film such that a portion of the light receiving element is exposed to the outside, and in the sealing step, the upper surface of the first resin film is flush with the upper surface of the sealing resin layer, or the upper surface of the first resin film is higher than the upper surface of the sealing resin layer. | 03-04-2010 |
20100096717 | ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE - To reduce cracks in a functional unit of a semiconductor element in a process for manufacturing an electronic device, a frame member surrounds a functional unit and an optically-transparent layer is formed on a wafer. A resin layer is formed by injecting resin into a cavity of an encapsulating metallic mold while a molding surface of the encapsulating metallic mold segment contacts an upper surface of the frame member. After forming the resin layer, an optically-transparent layer is formed inside the frame member. The resin layer is formed by injecting resin while the frame member contacts the molding surface of the encapsulating metallic mold segment. Therefore, pressure applied in the encapsulation is exerted over the frame member around the functional unit. Further, the optically-transparent layer is formed after encapsulation. This avoids pressure applied to the functional unit from the contact of the encapsulating metallic mold segment with the optically-transparent layer. | 04-22-2010 |
20110096515 | ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF - Provided is an electronic device of high reliability having an exposed functional portion. An electronic device | 04-28-2011 |
20120180311 | ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF - Provided is an electronic device of high reliability having an exposed functional portion. An electronic device | 07-19-2012 |
20120282740 | ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE - The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member. | 11-08-2012 |
20120286437 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE - An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity. | 11-15-2012 |
20120322208 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - A method for manufacturing an electronic device includes forming a resin film over a wafer, the wafer including a plurality of elements formed therein, each of the elements including a functional unit, patterning the resin film to form a plurality of frame members, each of the frame members being provided on each of the elements and surrounding the functional unit, dividing the wafer into the elements, and providing an encapsulation. | 12-20-2012 |