Patent application number | Description | Published |
20080223609 | Electronic device and electronic component mounting method - According to an aspect of an embodiment, an electronic device comprises a bonding material, an electronic component providing a plurality of pads on a bottom surface thereof, and a printed circuit board providing a plurality of pads on a surface thereof, at least one of the pads of the printed circuit board being connected to at least one of the pads of the electronic component by the bonding material so as to connect the printed circuit board with the electronic component electrically, wherein either the electronic component or the printed circuit board provides a dummy pad on which the bonding material is formed, the bonding material on the dummy pad butting against the other of the surfaces of the electronic component or the printed circuit board. | 09-18-2008 |
20090045245 | Solder repairing apparatus and method of repairing solder - A solder repairing apparatus includes a stage designed to place the surface of at least a specific part of an object along a reference plane within a specific spot defined on the stage. A heating unit applies a thermal energy to the specific spot. A dividing plate is designed to move into the specific spot in a vertical attitude perpendicular to the reference plane. The dividing plate exhibits a low solder wettability. The solder melts in response to the application of the thermal energy. When the dividing plate in the vertical attitude enters the specific spot, the dividing plate gets into the solder. Since the dividing plate exhibits a low solder wettability, the dividing plate repels the solder. The solder is divided into two parts. The division of the solder reliably eliminates a short circuit in the electronic circuit. | 02-19-2009 |
20090175010 | Method of repair of electronic device and repair system - A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board. | 07-09-2009 |
20090177359 | Collision damage reduction apparatus - A collision damage reducing apparatus for lessening vehicle collision damage, includes: designated obstacle detecting means detecting an object having a collision possibility to be a obstacle; calculating means obtaining a continuous detecting period, for which the object is detected as the obstacle; monitoring target acknowledging means, according to the continuous detecting period, deciding whether or not the obstacle is regarded as a monitoring target, and deciding whether or not the obstacle is regarded as an activation cause; reliability determining means judging a collision possibility if the continuous detecting period is longer than a threshold value, and defining a reliability level coefficient indicating obstacle's reliability if a result of the judging of the collision possibility is positive; attentiveness determining means defining attentiveness coefficient decreased according to attentiveness deterioration; and detecting period threshold value adjusting means decreasing the threshold value according to decrease in the attentiveness coefficient. | 07-09-2009 |
20100101848 | SUBSTRATE UNIT, INFORMATION PROCESSOR AND METHOD OF MANUFACTURING SUBSTRATE UNIT - A substrate unit includes an electronic component having a plurality of electrodes arranged in a given shape, a circuit substrate having a first face where the electronic component is mounted and the electrodes are jointed and a second face underside of the first face, and a resin-coated portion formed on the second face according to a projected area of the second face to which the given shape is projected. | 04-29-2010 |
20100213248 | MICRO COMPONENT REMOVING METHOD - A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive ( | 08-26-2010 |
20110006405 | SEMICONDUCTOR DEVICE, MANUFACTURE METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS - A semiconductor device includes a substrate, an electronic component and a resin member. The substrate has a first electrode. The electronic component is provided on the substrate, and has a second electrode electrically connected to the first electrode. The resin member alleviates an external stress to the second electrode of the electronic component. The resin member is disposed on the substrate at a region separated from the electronic component. | 01-13-2011 |
20110141705 | PRINTED WIRING BOARD AND ELECTRONIC APPARATUS - A printed wiring board supports an electronic component thereon. The printed wiring board includes an opening which is recessed from a surface of the printed wiring board. The opening has a dimension which houses the electronic component therein. A plurality of pads is disposed on a bottom surface of the opening. The plurality of pads has a skew arrangement in a grid pattern with respect to inner edges of the opening. | 06-16-2011 |