Patent application number | Description | Published |
20090109408 | LIGHT-FILTERING MODULE AND PROJECTING SYSTEM APPLIED THEREWITH - A light-filtering module includes a light-source module, a dichroic mirror and a first image unit. The light-source module outputs a light beam. The dichroic mirror divides the light beam into a first colored light and a dual colored light. The first image unit provides the first colored light with image information. The light-filtering module includes a light-filtering unit and a driving unit. The light-filtering unit located between the dichroic mirror and the first image unit is located at a light path of the first colored light. The driving unit includes a coupling element coupled to the light-filtering unit and a driving element utilized to drive the coupling element. The driving element drives the light-filtering unit, switching between a first status and a second status by the coupling element, and a wide-wavelength spectrum and a narrow-wavelength spectrum are provided when the light-filtering unit is in the first and second statuses, respectively. | 04-30-2009 |
20090109640 | OPTICAL ENGINE - An optical engine is provided, including an imaging module, a driver module and a connecting unit. The imaging module includes an imaging housing with an imaging space and an imaging unit installed in the imaging space. The imaging housing is made of a conductive material. The driver module includes a driver housing with a driver space and a driver circuit board installed in the driver space. The connecting unit includes at least one of the cables is electrically connected to the imaging unit and the driver circuit board and at least a protruding module protruding from the imaging housing (or the driver housing) to contact with the driver housing (or the imaging housing). The cable is installed in the protruding module made of a conductive material. | 04-30-2009 |
20090110020 | LIGHT EMITTING SYSTEM - A light emitting system is disclosed, including a light generator, a complex lens and an activating unit. The light generator provides a light beam emitted in a first direction in parallel to an optic axis. The complex lens, disposed on a path of the light beam, includes a plurality of micro structures for refracting the light beam. The activating unit includes an activating member coupled to the complex lens. The activating member activates the complex lens with an activation frequency to reciprocally move in a second direction alternate to the first direction. By the disposition of the complex lens, the energy of the light beam is uniformly distributed. Additionally, speckle produced by the light beam is reciprocally moved within an area by the activating unit, creating a photogene reaction, to successfully eliminate existence of the speckle. | 04-30-2009 |
Patent application number | Description | Published |
20120074436 | LED UNIT HAVING SELF-CONNECTING LEADS - An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and electrically connected to the chip and an encapsulant sealing the chip. The base includes a main body and a pair of steps. The leads each have two opposite ends protruding from two opposite ends of the main body and located below/above a corresponding step. The protruding ends of the leads of each LED are connected to those of adjacent LEDs to electrically connect the LEDs in series or in parallel. | 03-29-2012 |
20120074437 | LED UNIT HAVING UNIFORM LIGHT EMISSION - An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and electrically connected to the chip and an encapsulant sealing the chip. The base includes a main body and a pair of steps. The leads each have two opposite ends protruding from two opposite ends of the main body and located below/above a corresponding step. The protruding ends of the leads of adjacent LEDs are connected to each other. The encapsulants of adjacent LEDs are continuously connected together. Light emitted from the chips of the LEDs are evenly distributed in the encapsulants whereby the light from the LEDs forms a rectangular, uniform light source. | 03-29-2012 |
20120074452 | LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light emitting device package includes a base, a light emitting element, a mask, metal wires, an encapsulating layer and a cover layer. The base has a first surface bearing electrical structure thereon and an opposite second surface. The mask is arranged on the first surface to define a space receiving the light emitting element. Two openings are defined in the mask. The light emitting element has two pads exposed to an outside through the two openings respectively. The metal wires electrically connect the pads and the electrical structures. The encapsulating layer is filled in the space and two through holes in the base and encapsulates the light emitting element. The encapsulating layer is separated from the metal wires. The cover layer covers and protects the mask and the metal wires. A method of manufacturing the package is also provided. | 03-29-2012 |
20120086031 | LED PACKAGE, AND MOLD AND METHOD OF MANUFACTURING THE SAME - The present disclosure provides a light emitting diode (LED) package, which includes a first substrate with electrodes disposed on a top thereof and a second substrate with an LED chip disposed on a top thereof. The LED chip is connected with the electrodes via wires. A first package layer is disposed on the top of the first substrate to cover the wires and electrodes. A fluorescent layer is disposed on the top of the second substrate to cover the LED chip. The present disclosure also provides a mold and a method of manufacturing the LED package. | 04-12-2012 |
20120094404 | METHOD FOR DISTRIBUTING FLUORESCENCE ONTO LED CHIP - A method for distributing fluorescence onto a light emitting diode chip includes steps: providing a base; mounting the LED chip having a light-emergent face on the base; disposing a baffle sleeve on the base whereby the baffle sleeve surrounds the LED chip; disposing a solid fusible block with the fluorescence mixed therein on the LED chip; heating the solid fusible block to be in a liquid state, and the fusible block flowing over the light-emergent face of the LED chip; and cooling the fusible block to be in a solid state again. | 04-19-2012 |
20120098004 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a substrate, an LED die and an encapsulation. The substrate includes a supporting surface and a protrusion extending from the supporting surface along a first direction. The protrusion includes a distal end portion extending along a second direction. The first direction and the second direction define a non-zero angle there between. The LED die is arranged on the supporting surface of the substrate. The encapsulation lies on the supporting surface and covers the LED die and the protrusion to increase a bonding connection between the encapsulation and the substrate. | 04-26-2012 |
20120098005 | LED PACKAGE - An exemplary encapsulation structure for encapsulating an LED chip includes a first encapsulation, a second encapsulation and a transparent resin layer with phosphorous compounds doped therein. The first encapsulation defines a receiving room for receiving the LED chip therein. The second encapsulation defines a receiving space for receiving the first encapsulation therein. The second encapsulation is separated from the first encapsulation to define a clearance between the first encapsulation and the second encapsulation. The transparent resin layer is filled in the clearance. The transparent resin layer has a uniform thickness. | 04-26-2012 |
20120098010 | LIGHT EMITTING ELEMENT PACKAGE - A light emitting element package includes a substrate, a light emitting element, and a package member. The substrate includes a first solder pad and a second solder pad. The light emitting element is mounted on the substrate and includes a p-type electrode and an n-type electrode. The package member is configured for enveloping the light emitting element. A first electrode and a second electrode are formed on the package member. The first electrode and the second electrode of the package member are electrically coupled to the p-type electrode and the n-type electrode of the light emitting element. The first electrode and the second electrode of the package member are electrically coupled to the first solder pad and the second solder pad of the substrate. | 04-26-2012 |
20120098021 | LED PACKAGE - An LED package includes a substrate, an LED chip and an encapsulation. The substrate includes a main plate, and a first soldering pad and a second soldering pad attached to the main plate. The first soldering pad and the second soldering pad are separated from each other. The LED chip includes a first electrode and a second electrode. The LED chip is mounted on the substrate with the second electrode electrically connected to the second soldering pad of the substrate. The encapsulation includes a main body enclosing the LED chip and an electric connecting unit electrically connecting the first electrode of the LED chip and the first soldering pad. | 04-26-2012 |
20120100646 | METHOD FOR DISTRIBUTING PHOSPHOR PARTICULATES ON LED CHIP - A method for distributing phosphor particulates on an LED chip, includes steps of: providing a substrate having an LED chip mounted thereon; dispensing an adhesive on the chip, wherein the adhesive have positively charged phosphor particulates doped therein; providing an upper mold and a lower mold for producing an electric field through the adhesive and moving the upper mold to press the adhesive, wherein the phosphor particulates are driven by the electric field to move to a top face of the chip; and curing the adhesive and removing the upper mold and the lower mold. | 04-26-2012 |
20120127742 | LED MODULE - An LED module includes a substrate comprising a base plate and an elastic arm extending from a periphery side of the base plate. The elastic arm includes a horizontal portion parallel to and spaced from the base plate. A receiving space is defined between the horizontal portion of the elastic arm and the base plate. A circuit layer is formed on the base plate. An LED is mounted on the base plate and electrically connects with the circuit layer. The LED comprises a base and at least one electrode extending outwardly from the base. The LED is fixed on the substrate via the at least one electrode slideably received in the receiving space with a downward force applied on the electrode by the horizontal portion of the elastic arm. | 05-24-2012 |
20120217525 | LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DEVICE HAVING THE SAME - An LED package includes a light transmissive encapsulation, an LED die embedded in the encapsulation from a bottom surface of the encapsulation, a positive electrode electrically connected to an anode of the LED die, and a negative electrode electrically connected to a cathode of the LED die. The encapsulation includes a light emitting surface opposite to the bottom surface thereof. The LED die includes a front surface for outputting light outward, and a back surface opposite to the front surface. The front surface is covered by the encapsulation and faces the light emitting surface of the encapsulation. The back surface is exposed outside. A light emitting device is provided by mounting the LED package to a circuit board. The circuit board has a heat conductor connecting with the LED die. | 08-30-2012 |
20120241789 | LED PACKAGE, METHOD FOR MAKING THE LED PACKAGE AND LIGHT SOURCE HAVING THE SAME - An LED package includes a light transmissive encapsulation, an LED die, a fluorescent layer, a baffle wall, a positive electrode and a negative electrode. The encapsulation includes a light emitting surface and a bottom surface opposite to the light emitting surface. The LED die, the fluorescent layer and the baffle wall are embedded in the encapsulation from the bottom surface side. The LED die includes a front surface for outputting light outward and a back surface opposite to the front surface. The front surface faces the light emitting surface of the encapsulation, and the back surface is exposed outside. The fluorescent layer is formed on the front surface of the LED die. The baffle wall surrounds the LED die and the fluorescent layer. The positive electrode and negative electrode are electrically connected to the LED die. | 09-27-2012 |
20120241790 | LED PACKAGE - An LED package comprises a substrate, a reflector, a light-absorbable layer, an encapsulation layer and an LED chip. The reflector comprises a first incline with an inclined angle surrounding the LED chip. The light-absorbable layer comprises a second incline with another inclined angle direct to the LED chip, wherein the inclined angle of the second incline is greater than that of the first incline and the inclined angle of the first incline is between 90 to 150 degrees. | 09-27-2012 |
20130034920 | MANUFACTURING METHOD OF LED PACKAGE STRUCTURE - A method for manufacturing a plurality of holders each being for an LED package structure includes steps: providing a base, pluralities of through holes being defined in the base to divide the base into a plurality of basic units; etching the base to form a dam at an upper surface of each of the basic units of the base; forming a first electrical portion and a second electrical portion on each basic unit of the base, the first electrical portion and the second electrical portion being separated and insulated from each other by the dam; providing a plurality of reflective cups each on a corresponding basic unit of the base, each of the reflective cups surrounding the corresponding dam; and cutting the base into the plurality of basic units along the through holes to form the plurality of holders. | 02-07-2013 |
20130135900 | LIGHT SOURCE APPARATUS OF BACKLIGHT MODULE - A light source apparatus includes a light guide plate, a number of optical fibers, at least two first light emitting diodes, and at least two second LEDs. Each fiber has a light exiting surface facing the light guide and at least two light entrances at both ends of the fiber. The second LEDs are located on both sides of the light guide plate. Light generated by the first LEDs has a wavelength longer than that generated by the second LEDs. The light generated from the first LEDs enters the light guide plate after travelling through the optical fiber to mix with the light generated from the second LEDs to provide a good color rendering property of the light generated by the light source. | 05-30-2013 |
Patent application number | Description | Published |
20120025258 | LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE - An exemplary LED module includes a board and an LED package mounted on the plate. The LED package includes a base, an LED chip mounted on a top surface of the base, two electrodes formed on the base and electrically connected to the LED chip and the board, and an encapsulant encapsulating the LED chip. A plurality of grooves are defined in the bottom surface of the base. When the LED package is secured on the plate via solder paste, the grooves function as a container for receiving excessive solder paste, thereby preventing the solder paste from spilling and floating or inclination of the LED package. | 02-02-2012 |
20120080696 | LIGHT EMITTING DIODE MODULE - An LED module includes a plurality of lighting sources each including a substrate, a first and second lead frames arranged on the substrate, an LED chip electrically connected to the first and the second lead frames, and an encapsulation covering the LED chip. The first lead frame of each of the lighting sources connects with the second lead frame of an adjacent lighting source electrically and mechanically. | 04-05-2012 |
20120091485 | LIGHT EMITTING DEVICE - A light emitting diode device comprises a light source and a gas vent device. The gas vent device comprises a base having a collector, wherein a conversion element is located inside the collector. A portion of heat generated from the light source is transferred into thermal energy to gasify the conversion element and the other portion is dissipated via the gas vent device. Therefore, the light emitting device is able to provide illuminant and gasify the conversion element simultaneously. | 04-19-2012 |
20120091487 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package comprises a substrate and a lens. The substrate comprises two electrodes and a LED chip disposed thereon, wherein the LED chip electrically connects to one of the electrodes via a conductive wire. The connection between the conductive wire and the corresponding electrode is covered by an encapsulation. The lens is located on the substrate and covers the encapsulation. Moreover, the substrate comprises at least two tunnels inside the covering of the lens penetrating the substrate. A collector is located between the substrate and the lens, wherein a transparent layer is formed inside the collector by injecting fluid material through the tunnels or directly injecting fluid material into the collector. A method for manufacturing the light emitting diode package is also provided. | 04-19-2012 |
20120107975 | METHOD FOR PACKAGING LIGHT EMITTING DIODE - An LED packaging method includes: providing a mold with two isolated receiving spaces and a substrate with a die supporting portion and an electrode portion respectively received in the two receiving spaces; disposing an LED die on the die supporting portion and electrically connecting the LED die to the electrode portion of the substrate by metal wires; injecting a light wavelength converting material into the first receiving space and covering the LED die with the light wavelength converting material; communicating the first receiving space to the second receiving space, injecting a first light transmissive material into the communicated first and second spaces, and covering the light wavelength converting material and the metal wires with the first light transmissive material; and removing the mold to obtain a packaged LED. | 05-03-2012 |
20130062650 | LED PACKAGE AND MOLD OF MANUFACTURING THE SAME - The present disclosure provides a light emitting diode (LED) package, which includes a first substrate with electrodes disposed on a top thereof and a second substrate with an LED chip disposed on a top thereof. The LED chip is connected with the electrodes via wires. A first package layer is disposed on the top of the first substrate to cover the wires and electrodes. A fluorescent layer is disposed on the top of the second substrate to cover the LED chip. The present disclosure also provides a mold and a method of manufacturing the LED package. | 03-14-2013 |
20140051195 | METHOD OF MANUFACTURING ENCAPSULATION STRUCTURE FOR ENCAPSULATING LED CHIP - A method of manufacturing an encapsulation structure for encapsulating an LED chip includes the following steps: providing a first encapsulation defining a receiving room for receiving the LED chip therein and a second encapsulation defining a receiving space for receiving the first encapsulation therein; providing a mounting tablet defining an entrance therein, mounting the first encapsulation and the second encapsulation on the mounting tablet with a clearance defined therebetween communicating with the entrance; injecting a liquid transparent resin with phosphorous compounds disturbed therein into the clearance via the entrance; and solidifying the liquid transparent resin to form a transparent resin layer interconnecting the first encapsulation and the second encapsulation. | 02-20-2014 |
20140134766 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE - A method of manufacturing a light emitting device package, includes following steps: providing a base which having a first surface and an opposite second surface, and electrical structures formed on the first surface, defining two through holes through the first and second surfaces; mounting a light emitting element on the first surface, the light emitting element having one pad on a top surface thereof; forming a mask on the first surface, the mask covering the light emitting element and defining at least one opening for exposing the at least one pad; electrically connecting the at least one pad to the electrical structures via at least one metal wire; filling liquid encapsulating material in a space between the mask and the first surface to form an encapsulating layer that encapsulating the light emitting element, the encapsulating layer being separated from the at least one metal wire and comprising phosphors therein. | 05-15-2014 |
Patent application number | Description | Published |
20090063074 | Mask Haze Early Detection - Detecting haze formation on a mask by obtaining an optical property of the mask and determining progress of the haze formation based on the obtained optical property. | 03-05-2009 |
20100201961 | System For Improving Critical Dimension Uniformity - A system for improving substrate critical dimension uniformity is described. The system includes an exposing means for exposing a plurality of mask patterns on a first plurality of substrates at predetermined locations with common splits of focus ({F | 08-12-2010 |
20110133347 | METHOD AND APPARATUS OF PROVIDING OVERLAY - Provided is an apparatus that includes an overlay mark. The overlay mark includes a first portion that includes a plurality of first features. Each of the first features have a first dimension measured in a first direction and a second dimension measured in a second direction that is approximately perpendicular to the first direction. The second dimension is greater than the first dimension. The overlay mark also includes a second portion that includes a plurality of second features. Each of the second features have a third dimension measured in the first direction and a fourth dimension measured in the second direction. The fourth dimension is less than the third dimension. At least one of the second features is partially surrounded by the plurality of first features in both the first and second directions. | 06-09-2011 |
20110267593 | METHOD AND APPARATUS FOR MAINTAINING DEPTH OF FOCUS - A method includes directing a beam of radiation along an optical axis toward a workpiece support, measuring a spectrum of the beam at a first time to obtain a first profile, measuring the spectrum of the beam at a second time to obtain a second profile, determining a spectral difference between the two profiles, and adjusting a position of the workpiece support along the optical axis based on the difference. A different aspect involves an apparatus having a workpiece support, beam directing structure that directs a beam of radiation along an optical axis toward the workpiece support, spectrum measuring structure that measures a spectrum of the beam at first and second times to obtain respective first and second profiles, processing structure that determines a difference between the two profiles, and support adjusting structure that adjusts a position of the workpiece support along the optical axis based on the difference. | 11-03-2011 |
20120308112 | EXTRACTION OF SYSTEMATIC DEFECTS - In one embodiment, a method for extracting systematic defects is provided. The method includes inspecting a wafer outside a process window to obtain inspection data, defining a defect pattern from the inspection data, filtering defects from design data using a pattern search for the defined defect pattern within the design data, inspecting defects inside the process window with greater sensitivity than outside the process window, and determining systematic defects inside the process window. A computer readable storage medium, and a system for extracting systematic defects are also provided. | 12-06-2012 |
20130056886 | Method and Apparatus of Providing Overlay - Provided is an apparatus that includes an overlay mark. The overlay mark includes a first portion that includes a plurality of first features. Each of the first features have a first dimension measured in a first direction and a second dimension measured in a second direction that is approximately perpendicular to the first direction. The second dimension is greater than the first dimension. The overlay mark also includes a second portion that includes a plurality of second features. Each of the second features have a third dimension measured in the first direction and a fourth dimension measured in the second direction. The fourth dimension is less than the third dimension. At least one of the second features is partially surrounded by the plurality of first features in both the first and second directions. | 03-07-2013 |
20130176558 | DETECTING METHOD FOR FORMING SEMICONDUCTOR DEVICE - In one embodiment, a method for detecting design defects is provided. The method includes receiving design data of an integrated circuit (IC) on a wafer, measuring wafer topography across the wafer to obtain topography data, calculating a scanner moving average from the topography data and the design data to provide a scanner defocus map across the wafer, and determining a hotspot design defect from the scanner defocus map. A computer readable storage medium, and a system for detecting design defects are also provided. | 07-11-2013 |
20130201461 | METHOD AND APPARATUS TO CHARACTERIZE PHOTOLITHOGRAPHY LENS QUALITY - Provided is a method of characterizing photolithography lens quality. The method includes selecting an overlay pattern having a first feature with a first pitch and a second feature with a second pitch different than the first pitch, performing a photolithography simulation to determine a sensitivity coefficient associated with the overlay pattern, and providing a photomask having the overlay pattern thereon. The method also includes exposing, with a photolithography tool, a wafer with the photomask to form the overlay pattern on the wafer, measuring a relative pattern placement error of the overlay pattern formed on the wafer, and calculating a quality indicator for a lens in the photolithography tool using the relative pattern placement error and the sensitivity coefficient. | 08-08-2013 |
20130259358 | SYSTEM AND METHOD FOR ALIGNMENT IN SEMICONDUCTOR DEVICE FABRICATION - A method of determining overlay error in semiconductor device fabrication includes receiving an image of an overlay mark formed on a substrate. The received image is separated into a first image and a second image, where the first image includes representations of features formed on a first layer of the substrate and the second image includes representations of the features formed on a second layer of the substrate. A quality indicator is determined for the first image and a quality indicator is determined for the second image. In an embodiment, the quality indicators include asymmetry indexes | 10-03-2013 |
20130314708 | Method and Apparatus for Maintaining Depth of Focus - A method includes directing a beam of radiation along an optical axis toward a workpiece support, measuring a spectrum of the beam at a first time to obtain a first profile, measuring the spectrum of the beam at a second time to obtain a second profile, determining a spectral difference between the two profiles, and adjusting a position of the workpiece support along the optical axis based on the difference. A different aspect involves an apparatus having a workpiece support, beam directing structure that directs a beam of radiation along an optical axis toward the workpiece support, spectrum measuring structure that measures a spectrum of the beam at first and second times to obtain respective first and second profiles, processing structure that determines a difference between the two profiles, and support adjusting structure that adjusts a position of the workpiece support along the optical axis based on the difference. | 11-28-2013 |
20140253901 | Two-Dimensional Marks - A method for controlling semiconductor production through use of a Focus Exposure Matrix (FEM) model includes taking measurements of characteristics of a two-dimensional mark formed onto a substrate, the two-dimensional mark including two different patterns along two different cut-lines, and comparing the measurements with a FEM model to determine focus and exposure conditions used to form the two-dimensional mark. The FEM model was created using measurements taken of corresponding two-dimensional marks formed onto a substrate under varying focus and exposure conditions. | 09-11-2014 |
20140257761 | Hybrid Focus-Exposure Matrix - A method for controlling semiconductor production through use of a hybrid Focus Exposure Matrix (FEM) model includes taking measurements of a set of structures formed onto a substrate. The method further includes using a FEM model to determine focus and exposure conditions used to form the structure The model was created through use of measurements of structures formed on a substrate under varying focus and exposure conditions, the measurements being taken using both an optical measurement tool and a scanning electron microscope. | 09-11-2014 |
20150067617 | Method and System for Overlay Control - A method for overlay monitoring and control is introduced in the present disclosure. The method comprises forming resist patterns on one or more wafers in a lot by an exposing tool; selecting a group of patterned wafers in the lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot. | 03-05-2015 |
20150079700 | SYSTEMS AND METHODS FOR SIMILARITY-BASED SEMICONDUCTOR PROCESS CONTROL - The present disclosure provides methods and systems for providing a similarity index in semiconductor process control. One of the methods disclosed herein is a method for semiconductor fabrication process control. The method includes steps of receiving a first semiconductor device wafer and receiving a second semiconductor device wafer. The method also includes a step of collecting metrology data from the first and second semiconductor device wafers. The metrology data includes a first set of vectors associated with the first semiconductor device wafer and a second set of vectors associated with the second semiconductor device wafer. The method includes determining a similarity index based in part on a similarity index value between a first vector from the first set of vectors and a second vector from the second set of vectors and continuing to process additional wafers under current parameters when the similarity index is above a threshold value. | 03-19-2015 |
Patent application number | Description | Published |
20080204730 | Method and System for Improving Accuracy of Critical Dimension Metrology - A method for improving accuracy of optical critical dimension measurement of a substrate is provided. A process parameter that influences the refractive index and extinction coefficient of a thin film in the substrate is identified. A refractive index and extinction coefficient across a plurality of wavelengths as a function of the process parameter is identified. During the regression modeling of the optical critical dimension measurement, the refractive index and extinction coefficient across the plurality of wavelengths is adjusted through the function via the process parameter. | 08-28-2008 |
20080227228 | Measurement of Overlay Offset in Semiconductor Processing - A method of semiconductor manufacturing including forming an overlay offset measurement target including a first feature on a first layer and a second feature on a second layer. The first feature and the second feature have a first predetermined overlay offset. The target is irradiated. The reflectivity of the irradiated target is determined. An overlay offset for the first layer and the second layer is calculated using the determined reflectivity. | 09-18-2008 |
20080233487 | Method and System for Optimizing Lithography Focus and/or Energy Using a Specially-Designed Optical Critical Dimension Pattern - Disclosed is a method and a system for optimizing lithography focus and/or energy using a specially-designed optical critical dimension pattern. A wafer comprising a plurality of photomasks is received. Critical dimension, line-end shortening, and side wall angle of the plurality of photomasks are measured using an integrated metrology equipment. A spectrum analysis is performed in a simulated spectra library to form analysis data. The analysis data is stored into a plurality of lookup tables of an optical critical dimension library. A lookup of the plurality of lookup tables is performed to determine a focus or energy of the wafer. | 09-25-2008 |
20080248403 | METHOD AND SYSTEM FOR IMPROVING CRITICAL DIMENSION UNIFORMITY - A method for improving critical dimension uniformity of a wafer includes exposing a plurality of mask patterns on a first plurality of substrates at predetermined locations with common splits conditions of focus and exposure dose for each of the first plurality of substrates to form a plurality of perturbed wafers; measuring a critical dimension of the plurality of mask patterns at each of the predetermined locations for each of the plurality of perturbed wafers; averaging the critical dimension measured at each of the predetermined locations over the plurality of perturbed wafers to form a perturbed critical dimension map; measuring a sidewall angle of the plurality of mask patterns; averaging the sidewall angle measured to form a perturbed sidewall angle map; and providing the perturbed critical dimension map and the perturbed sidewall angle map to an exposure tool. | 10-09-2008 |
20110131007 | Measurement Of Overlay Offset In Semiconductor Processing - A system for overlay offset measurement in semiconductor manufacturing including a radiation source, a detector, and a calculation unit. The radiation source is operable to irradiate an overlay offset measurement target. The detector is operable to detect a first reflectivity and a second reflectivity of the irradiated overlay offset measurement target. The calculation unit is operable to determine an overlay offset using the detected first and second reflectivity by determining a predetermined overlay offset amount which provides an actual offset of zero. | 06-02-2011 |
Patent application number | Description | Published |
20090168006 | ATTACHMENT PROCESS FOR FLEXIBLE SUBSTRATES AND PATTERNED SEALANT USED THEREIN - An attachment process for flexible substrates and a patterned sealant used therein are provided. The attachment process is mainly used to manufacture flexible liquid-crystal displays (LCDs). Firstly, a patterned sealant with an opening is applied to a first substrate, and then a liquid crystal material is filled in the patterned sealant. During a pressing process for combining the first substrate and a second substrate, bubbles can be automatically evacuated from the opening of the patterned sealant, and the patterned sealant will deform and expand to seal the opening after the pressing process. By applying the patterned sealant with an opening in the manufacturing process of flexible LCDs, bubbles are easily evacuated and the opening of the patterned sealant is directly and automatically sealed in the pressing process under the atmospheric pressure. | 07-02-2009 |
20100072244 | WEB TRANSPORTATION GUIDING APPARATUS AND METHOD - A guiding apparatus and method for a shift generated by a web during web transportation is provided, in which a coarse position guiding module and a fine position guiding module function to directly adjust the web so as to compensate the shift occurred during the process of transportation according to a position of the web. By means of monitoring a location of the fine position guiding module at any time, a reference of the coarse position guiding module will be adjusted when the location of the fine position guiding module satisfies the condition defined in the guiding method, so as to change a position where the web enters into the fine position guiding module. | 03-25-2010 |
20130137560 | SUCTION-TYPE TRANSMISSION APPARATUS - A suction-type transmission apparatus includes at least one suction region allocation member and a suction wheel member. The suction region allocation member has a chamber and through holes communicating with the chamber. The suction wheel member is pivoted to the suction region allocation member, and includes an inner lining body with gas flow channels disposed in parallel, and an outer ring sleeve. The inner lining body has gas holes corresponding to the through holes and being in communication with the gas flow channels. The outer ring sleeve with micro-pores in communication with the gas flow channels is sleeved on the inner lining body, and wraps the gas flow channels. The chamber is connected to a gas extraction port, and at least one sealing element is selectively disposed in the chamber to seal at least one of the through holes for forming a suction region of the suction wheel member. | 05-30-2013 |
20140116851 | CONVEYOR APPARATUS - A conveyor apparatus including a control module, an unwinding module, at least one tension sensing module, and a rewinding module is provided. The tension sensing module includes a load cell disposed between a set of rollers. An objet is conveyed along a conveying direction perpendicular to an axis of the roller. A wrap angle is formed by the object and the roller with a fulcrum of the loadi cell served as a center, and the wrap angle is less than 180°. The rewinding and unwinding modules have different actuating units electrically connected to the control module respectively, such that the object is wound or unwound by the rewinding and the unwinding modules. | 05-01-2014 |
Patent application number | Description | Published |
20130160837 | Photoelectrode and Method for Preparing the Same - The present invention relates to an photoelectrode and the preparation method thereof, wherein said photoelectrode comprises a substrate and a titania layer composed of a mesoporous titania bead having a diameter of 200-1000 nm, specific surface area of 50-100 m | 06-27-2013 |
20130160838 | Solar Cell - The present invention relates to a solar cell comprising an anode, a cathode, and an electrolyte, wherein said anode comprises a substrate and a titania layer composed of a mesoporous titania bead having a diameter of 200-1000 nm, specific surface area of 50-100 m | 06-27-2013 |
20130164532 | MESOPOROUS TITANIA BEAD AND METHOD FOR PREPARING THE SAME - The present invention relates to a mesoporous titania bead and the preparation method thereof, wherein said mesoporous titania bead has a diameter of 200-1000 nm, specific surface area of 50-100 m | 06-27-2013 |
20140144493 | MESOPOROUS TITANIA BEAD AND METHOD FOR PREPARING THE SAME - The present invention relates to a mesoporous titania bead and the preparation method thereof, wherein said mesoporous titania bead has a diameter of 200-1000 nm, specific surface area of 50-100 m | 05-29-2014 |
Patent application number | Description | Published |
20130127677 | Radio-Frequency Device and Wireless Communication Device - The present invention discloses an RF device for a wireless communication device, including a grounding element, an antenna, including a radiating element, a feed-in element, a coupling element, a switch, coupled between the coupling element and the grounding element, for connecting or disconnecting the grounding element to the coupling element, such that the antenna respectively operates in a first frequency band and a second frequency band, and a grounding terminal, for coupling the grounding element, a capacitive sensing element, for sensing an environment capacitance within a specific range through the radiating element, at least one capacitor, for blocking a DC route from the grounding terminal to the grounding element. | 05-23-2013 |
20130130633 | Radio-Frequency Device and Wireless Communication Device - A radio-frequency (RF) device and a wireless communication device include a capacitive sensing unit capable of using a radiating element of an antenna to sensing an environment capacitance within a specified range, such that an RF signal processing device is capable of adjusting power of an RF signal accordingly, to prevent affecting a user. When the radiating element of the antenna includes a direct-current signal route to a ground terminal, the RF device and the wireless communication device further includes at least a capacitor for cutting off the direct-current signal route. | 05-23-2013 |
20130154888 | Tunable antenna and Related Radio-Frequency Device - A tunable antenna is disclosed. The tunable antenna includes a ground element for providing grounding, a signal feed-in terminal, a radiation unit electrically connected to the signal feed-in terminal and including a long side extended from the signal feed-in terminal along a first direction, a short side extended from the signal feed-in terminal along a second direction, and a branch electrically connected between the signal feed-in terminal and the ground element, a coupling unit for coupling to the long side, and a switch unit for connecting or disconnecting the coupling unit to/from the ground element to change a coupling relationship between the coupling unit and the long side, such that the tunable antenna respectively operates in a first frequency band and a second frequency band. | 06-20-2013 |
20130189934 | Radio-Frequency Device, Wireless Communication Device and Method for Enhancing Antenna Isolation - A radio-frequency (RF) device for a wireless communication device includes an antenna disposition area, and a plurality of antennas of a same type, formed in the antenna disposition area by different arrangements, for receiving or transmitting a plurality of wireless signals of a same frequency band. | 07-25-2013 |
Patent application number | Description | Published |
20100207786 | Driving safety auxiliary network administration system and method thereof - This specification discloses a driving safety auxiliary network administration system and the method thereof. Vehicles in motion communicate with each other about their geographical locations and current moving states within a communication range. At least one of the vehicles in the communication range becomes the router of several other vehicles that are at dead corners of wireless communications. The router is responsible for transferring vehicle state signals of those vehicles out of direct communications between them. Therefore, all the vehicles in the communication range are not blocked by terrains, buildings or other vehicles. All of them are taken into account to assess and find possible dangerous vehicles. This technique can effectively solve the problem of dead corners in driving safety auxiliary network communications. Highly important packets can be immediately and reliably transmitted to the corresponding vehicles, providing efficient warnings. | 08-19-2010 |
20110018737 | Vehicle Collision Avoidance System and Method - A vehicle collision avoidance system is implemented in a host vehicle. A wireless communication module in the host vehicles wirelessly broadcasts vehicle information packages of the host vehicle and receives external vehicle information packages from other neighboring vehicles. Based on the received vehicle information packages, a collision avoidance process is performed. The process has steps of mapping coordinates system, categorizing collision zones, determining whether a possible collision position exists, calculating a collision time and outputting warning messages. The estimations of the possible collision position and the collision time are not affected by the positions of the neighboring vehicles. Therefore, the neighboring vehicles approaching the host vehicle from different direction are effectively monitored. | 01-27-2011 |
20130079948 | INERTIAL SENSOR CALIBRATION METHOD FOR VEHICLES AND DEVICE THEREFOR - An inertial sensor calibration method has steps of mounting an observer device and an inertial sensor of a vehicle carrying on an inertial move, acquiring actual vehicle motion data from the observer device and inertial signal data of the inertial sensor, calculating an integral corresponding to the vehicular dynamic variation model with respect to the inertial signal data to obtain predicted vehicle sensor data and calculating variations of the actual vehicle motion data, acquiring differences between the two calculated data, applying an energy optimization and a discretization to the differences so as to obtain parametric error variances, and feeding back the parametric error variances to the vehicular dynamic variation model to calibrate the parameters associated with offset and scale factor and acquire a calibrated vehicular dynamic variation model. Under the premise of no GPS, electronic compass or pressure sensor, the present invention can secure positioning continuity and reliability. | 03-28-2013 |
Patent application number | Description | Published |
20100187656 | Bipolar Junction Transistors and Methods of Fabrication Thereof - Design and methods for fabricating bipolar junction transistors are described. In one embodiment, a semiconductor device includes a first fin comprising a first emitter region, a first base region, and a first collector region. The first emitter region, the first base region, and the first collector region form a bipolar junction transistor. A second fin is disposed adjacent and parallel to the first fin. The second fin includes a first contact to the first base region. | 07-29-2010 |
20100232203 | ELECTRICAL ANTI-FUSE AND RELATED APPLICATIONS - A first terminal and a second terminal of a FinFET transistor are used as two terminals of an anti-fuse. To program the anti-fuse, a gate of the FinFET transistor is controlled, and a voltage having a predetermined amplitude and a predetermined duration is applied to the first terminal to cause the first terminal to be electrically shorted to the second terminal. | 09-16-2010 |
20100244144 | ELECTRICAL FUSE AND RELATED APPLICATIONS - In various embodiments, the fuse is formed from silicide and on top of a fin of a fin structure. Because the fuse is formed on top of a fin, its width takes the width of the fin, which is very thin. Depending on implementations, the fuse is also formed using planar technology and includes a thin width. Because the width of the fuse is relatively thin, a predetermined current can reliably cause the fuse to be opened. Further, the fuse can be used with a transistor to form a memory cell used in memory arrays, and the transistor utilizes FinFET technology. | 09-30-2010 |
20120264269 | Bipolar Junction Transistors and Methods of Fabrication Thereof - A method of forming a semiconductor device is provided. The method includes forming a first fin above a substrate, forming a first emitter region in a first portion of the first fin, forming a first collector region in a second portion of the first fin, and forming a first base region in a third portion of the first fin. The third portion of the first fin is disposed underneath a first gate electrode. The method further includes forming a second fin adjacent to the first fin and above the substrate. The second fin is composed of a semiconductor material. The method also includes forming a first base contact over the second fin. The first base contact is coupled to the first base region through the second fin, the substrate, and the first fin. | 10-18-2012 |
Patent application number | Description | Published |
20080284255 | VOICE COIL MOTORS AND PRE-COMPRESSION GENERATION DEVICES THEREOF - A voice coil motor. At least one guide bar is connected to a fixed base. A coil is connected to the fixed base. A support base is movably fit on the guide bar. An annular magnetic member is connected to the support base and surrounded by the coil. A magnetization direction of the annular magnetic member parallels a moving direction of the support base and annular magnetic member. The annular magnetic member includes a first magnetic pole and a second magnetic pole. The first magnetic pole is disposed in the coil and separated from the bottom thereof. The second magnetic pole is disposed outside the coil. The coil interacts with the annular magnetic member to generate a first force, driving the support base and annular magnetic member to move along the magnetization direction of the annular magnetic member. | 11-20-2008 |
20090140581 | VOICE COIL MOTORS - A voice coil motor. A guide bar connects to a fixed base. A coil connects to the fixed base and includes a first winding portion and a second winding portion. A current direction in the first winding portion is opposite that in the second winding portion. A support base movably fits on the guide bar. A magnetic member connects to the support base and includes a first magnetic pole and a second magnetic pole. A magnetization direction of the magnetic member parallels a moving direction of the support base and magnetic member and is perpendicular to a central axis of the coil. The first and second magnetic poles respectively oppose the first and second winding portions of the coil. The first and second magnetic poles respectively interact with the first and second winding portions to generate a first force and a second force, moving the support base and magnetic member. | 06-04-2009 |
20100033031 | Voice coil motor for optical device - A voice coil motor. A first coil is connected to a fixed base and includes a first winding portion and a second winding portion connected to and opposite the first winding portion. A second coil is connected to the fixed base and includes a third winding portion and a fourth winding portion connected to and opposite the third winding portion. A first magnetic member is connected to a support base and includes a first magnetic pole and a second magnetic pole. The first and second magnetic poles oppose the first and third winding portions, respectively. A second magnetic member is connected to the first magnetic member and includes a third magnetic pole and a fourth magnetic pole. The third magnetic pole opposes the second winding portion and abuts the first magnetic pole. The fourth magnetic pole opposes the fourth winding portion and abuts the second magnetic pole. | 02-11-2010 |
20110134416 | FOCAL POSITION DETECTING APPARATUS AND METHOD - A focal position detecting apparatus, for detecting a focusing condition and a tilting condition of an object, includes a planar beam generating module, an optical system, an optical sensor and a cylindrical lens. The planar beam generating module generates a planar light beam along a first path. The optical system is disposed on the first path, wherein the planar light beam, reflected by the object, passes through the optical system along a second path. The optical sensor is disposed on the second path. The cylindrical lens is disposed on the second path between the optical system and the optical sensor and an axis of the cylindrical lens is perpendicular to the second path. The planar light beam passes through the optical system and the cylindrical lens along the second path, before it is incident on the optical sensor to form a linear light spot for determining defocusing degree. | 06-09-2011 |
Patent application number | Description | Published |
20090009679 | Backlight Module - A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction. | 01-08-2009 |
20090034177 | Supporting Assembly for a Liquid Crystal Display - A supporting assembly for a LCD includes a front bezel, a cover, a first fastener, a back bezel, a second fastener, a frame, a lighting carrier. The cover is extended from the front bezel. The first fastener is disposed on the cover. The back bezel is coupled to the front bezel and has an opening opposite the cover. The second fastener is disposed on the back bezel and fastened to the first fastener. The frame is disposed between the front bezel and the back bezel and has a carrier socket opposite the cover. The lighting carrier is plugged into the carrier socket. | 02-05-2009 |
20090052176 | Replacable Light Source for Light Source Module and Back Light Module - The present invention provides a light source module for using in a backlight module which includes a frame, a light source and a lid. The frame has two opposite side walls, and each of the side walls includes an inner side surface, a top surface and a cave. The cave has a first opening and a second opening connected with each other on the inner surface and the top surface respectively. Each of the inner surfaces is facing the other side wall, and the top surface intersects the inner surface with an angle. A light source has two opposite ends, and each of ends includes a positioning block. The positioning block engages with the cave through the second opening, and the light source extends along a first direction perpendicular to the inner surface, through the first opening and towards the opposite side wall of the frame. The lid covers the second opening and restricts the positioning block from moving relatively to the cave from the second opening. | 02-26-2009 |
20100238371 | Backlight Module - A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction. | 09-23-2010 |
20110109832 | Supporting Assembly for a Liquid Crystal Display - A supporting assembly for a LCD includes a front bezel, a cover, a first fastener, a back bezel, a second fastener, a frame, a lighting carrier. The cover is extended from the front bezel. The first fastener is disposed on the cover. The back bezel is coupled to the front bezel and has an opening opposite the cover. The second fastener is disposed on the back bezel and fastened to the first fastener. The frame is disposed between the front bezel and the back bezel and has a carrier socket opposite the cover. The lighting carrier is plugged into the carrier socket. | 05-12-2011 |