Patent application number | Description | Published |
20090205177 | METHOD OF FABRICATING PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, RADIOWAVE TIMEPIECE, WAFER AND JIG FOR WAFER - To efficiently fabricate a high quality piezoelectric vibrating piece regardless of an accuracy of an outer shape of a wafer, there is provided a method of fabricating a plurality of piezoelectric vibrating pieces at a time utilizing a wafer S, the method including a step of forming two or more of through holes | 08-20-2009 |
20090205183 | METHOD OF FABRICATING PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIOWAVE TIMEPIECE - To fabricate a plurality of piezoelectric vibrating pieces while firmly preventing a defect, a crack, or a breakage from being brought about at a wafer in the midst of fabrication, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a plurality of piezoelectric vibrating pieces from a wafer S, the method including a film forming step of respectively forming metal films M on both faces of the wafer, a patterning step of removing a region of the metal film on an inner side of an outer peripheral end of the wafer by a constant distance H, thereafter, patterning the metal film M to outer shapes of the plurality of piezoelectric vibrating pieces, an outer shape forming step of forming outer shapes of the plurality of piezoelectric vibrating pieces at the wafer a size of which is reduced by an amount of the constant distance by selectively removing the wafer by wet etching by constituting a mask by the patterned metal film, and a removing step of removing the metal film. | 08-20-2009 |
20100181872 | PIEZOELECTRIC VIBRATOR - A piezoelectric oscillator is provided, which has a through electrode providing reliable conduction between a piezoelectric vibrating piece and an external electrode with rare occurrence of a large stress caused by temperature variation in processing or deformation of a mounted base substrate, while the hermeticity of a cavity is maintained. A piezoelectric oscillator having a piezoelectric vibrating piece sealed in a cavity defined between a base substrate and a lid substrate includes a through electrode disposed in a through hole penetrating through the base substrate, and the through electrode has a glass frit filled in the through hole and fired and a core formed of a material containing only iron and nickel and disposed in the through hole together with the glass frit. The values of the thermal expansion coefficients of the base substrate, the glass frit, and the core are set as: base substrate glass≧frit>core. | 07-22-2010 |
20100301709 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - There is provided a piezoelectric vibrator | 12-02-2010 |
20100308694 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, FIXING JIG, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through-hole running through the base substrate; and an electroconductive core member which is formed to have two flat ends and a thickness substantially equal to that of the base substrate and is inserted into the center hole of the cylindrical body; and the through-hole, the cylindrical body and the core member are integrally fixed to each other by firing. | 12-09-2010 |
20100320872 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads. | 12-23-2010 |
20100320877 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator manufacturing method of the invention is a method for manufacturing a plurality of piezoelectric vibrators in which a piezo-electric vibration member is sealed up in a cavity formed between a base substrate and a lid substrate bonded to each other, all at once by utilizing a base substrate wafer and a lid substrate wafer, and the method comprises a recess forming step of forming, in the lid substrate wafer, a plurality of cavity recesses for forming cavities when the two wafers are overlaid; a through-electrode forming step of forming a plurality of through-electrodes in and through the base substrate wafer; a routing electrode forming step of forming a plurality of routing electrodes connected electrically with the through-electrodes, on the upper face of the base substrate wafer; a mounting step of bonding the plural piezoelectric vibration members to the upper face of the base substrate wafer via the routing electrodes; an overlaying step of overlaying the base substrate wafer and the lid substrate wafer thereby to house the piezoelectric vibration members in the cavities surrounded by the recesses and the two wafers; a bonding step of bonding the base substrate wafer and the lid substrate wafer thereby to seal up the piezoelectric vibration members in the cavities; an external electrode forming step of forming a plurality of external electrodes connected electrically with the through-electrodes, on the lower face of the base substrate wafer; and a cutting step of cutting the two bonded wafers thereby to shred them into the plural piezoelectric vibrators. The through-electrode forming step includes a through-hole forming step of forming a plurality of through-holes in and through the base substrate wafer; a setting step of disposing electroconductive core members which are formed to have two flat ends and a thickness substantially equal to that of the base substrate wafer, in those plural through-holes, and disposing connection members between the core mem-bers and the through-holes; and a firing step of firing the connection members at a predetermined temperature to thereby integrally fix the through-hole, the connection member and the core member to each other. | 12-23-2010 |
20110050046 | PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, RADIO-CONTROLLED TIMEPIECE - Providing a piezoelectric vibrator and a manufacturing method thereof which is capable of achieving gettering in a state where the frequency change of the piezoelectric vibrating reed is suppressed. Providing a piezoelectric vibrator | 03-03-2011 |
20110140793 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured. The manufacturing method includes a penetration hole forming step of forming a plurality of penetration holes | 06-16-2011 |
20110140795 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - Provided is a method of manufacturing a piezoelectric vibrator of the invention, the piezoelectric vibrator including a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions, a package that accommodates the piezoelectric vibrating reed, and a pair of regulation films that is formed along a longitudinal direction of the vibration arm portions corresponding to each of the pair of vibration arm portions, the piezoelectric vibrator being capable of regulating a degree of vacuum in the package more than a certain level by irradiating the regulation films with a laser to evaporate a part of the regulation films. The method includes a gettering process of irradiating a laser in symmetrical positions via a center axis of the pair of vibration arm portions in the pair of regulation films. | 06-16-2011 |
20110148249 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - Provided is method of manufacturing a piezoelectric vibrator, which includes a tuning fork type piezoelectric vibrating reed that includes a pair of vibration arm portions, a package that accommodates the piezoelectric vibrating reed, and a pair of regulation films that is formed along a longitudinal direction of the vibration arm portions corresponding to the pair of vibration arm portions, the piezoelectric vibrator being capable of improving a degree of vacuum in the package by irradiating the regulation films with a laser to evaporate a part of the regulation films. The method having a frequency measurement process of measuring the frequency of the piezoelectric vibrating reed, and a gettering process of evaporating a part of a regulation film of a position corresponding to a front end side of the vibration arm portion when the measured frequency is higher than a permissible range and evaporating a part of the regulation film of a position of a proximal portion side of the vibration arm portion when the measured frequency is lower than the permissible range. | 06-23-2011 |
20110164473 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel and is mounted on the base substrate within the cavity; and a getter material of a metallic film that is formed on the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated. A restriction portion, which is arranged in the cavity and restricts a scattering direction of the getter material evaporated by the heating to suppress a scattering amount scattering toward the vibration arm portion, is formed in the base substrate or the lid substrate. | 07-07-2011 |
20110181368 | PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode members | 07-28-2011 |
20110193646 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole. | 08-11-2011 |
20110248788 | GLASS SUBSTRATE POLISHING METHOD, PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE - A glass substrate polishing method having polishing processes for polishing a glass substrate surface while supplying a polishing agent. The glass substrate polishing method is characterized in that the polishing processes include a first polishing process in which the surface of the glass substrate is polished using a first polishing pad made from a polishing cloth and a second polishing process in which the surface of the glass substrate is polished using a second polishing pad made from urethane foam. | 10-13-2011 |
20110249533 | GLASS SUBSTRATE POLISHING METHOD, PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE - A glass substrate polishing method for polishing a glass substrate using a polishing device is provided. The glass substrate polishing method is characterized in that the polishing device includes a surface plate that is rotationally driven around a first central axis, a plate that is rotatable around a second central axis eccentric from the first central axis and presses the glass substrate toward the surface plate, and a work holder that is formed on the plate and restricts movement of the glass substrate in a surface direction while holding the glass substrate in a state in which a central axis of the glass substrate is eccentric from the second central axis. The glass substrate is polished by rotating the surface plate while the glass substrate is rotatably held in the work holder in a state in which an abrasive is interposed between the glass substrate and the surface plate. | 10-13-2011 |
20110249535 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method of manufacturing a piezoelectric vibrator according to the invention includes the steps of: inserting a core portion of a conductive rivet member, which includes a planar base portion and the core portion extending in a direction vertical to the surface of a base portion, into a penetration hole of the base substrate and bringing the base portion of the rivet member into contact with a first surface of the base substrate; applying a paste-like glass frit on a second surface of the base substrate and moving a first squeegee which comes into contact with the second surface with an attack angle in one direction to thereby fill the glass frit in the penetration hole; and moving a second squeegee which comes into contact with the second surface with an attack angle in a direction opposite to the one direction to thereby fill the glass frit applied redundantly on the second surface in the penetration hole. | 10-13-2011 |
20110255378 | PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method of manufacturing a package capable of sealing an electronic component in a cavity formed between a plurality of substrates bonded to each other includes a penetration electrode forming step of forming a penetration electrode which passes through a first substrate of the plurality of substrates in the thickness direction and which electrically connects the inside of the cavity and the outside of the package to each other. The package manufacturing method is characterized in that the penetration electrode forming step includes a through hole forming step of forming a through hole for disposing the penetration electrode in the first substrate and a filling step of filling a filler into the through hole under a decompressed atmosphere. | 10-20-2011 |
20110261658 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit. | 10-27-2011 |
20110291523 | PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE - This package manufacturing method is a method for manufacturing a package using a rivet having a flat plate-shaped head portion and a core portion protruding from a rear surface of the head portion. The package includes: a plurality of substrates that are bonded to each other: a cavity that houses an object to be housed in an airtightly sealed state; the core portion which is disposed in a through hole that penetrates a base substrate and which electrically connects the object to be housed with the outside; and a glass frit that is filled between the through hole and the core portion and is fired to form a seal between the through hole and the core portion. The package manufacturing method includes: a rivet disposing step of inserting the core portion into the through hole until the rear surface of the head portion comes into contact with a first surface of the base substrate; a glass frit filling step of filling the glass frit in a paste form between the through hole and the core portion; and a firing step of integrally fixing the through hole, the rivet and the glass frit by firing the filled glass frit, and sealing between the through hole and the core portion. A gas relief passage, which leads from a base end of the core portion to a side surface or a front surface of the head portion, is formed on the rear surface of the head portion of the rivet. | 12-01-2011 |
20110305119 | PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE - Provided is a manufacturing method of a package including a plurality of substrates that are bonded to each other, a cavity that is formed inside the plurality of substrates, and through electrodes that conduct current between the inside of the cavity and the outside of the plurality of substrates. The through electrodes are each formed such that a conductive core portion made of a metal material is arranged in a hole portion of a through electrode forming substrate made of a glass material. The manufacturing method includes: a hole portion forming step of forming the hole portion, into which the core portion is inserted, in a through electrode forming substrate wafer; a core portion inserting step of inserting the core portion into the hole portion formed in the through electrode forming substrate wafer; a welding step of heating the through electrode forming substrate wafer and welding it to the core portion; and a cooling step of cooling the through electrode forming substrate wafer. In the welding step, the through electrode forming substrate wafer is welded to the core portion by heating the through electrode forming substrate wafer to a temperature higher than a softening point of the glass material while a pressurizing die is placed on a surface of the through electrode forming substrate wafer and the through electrode forming substrate wafer is pressed by the pressurizing die. | 12-15-2011 |
20120206998 | ANODIC BONDING APPARATUS, METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - An anodic bonding apparatus includes a first intermediate member that is disposed between an upper surface (an outer surface) of a lead substrate wafer and a first heater, has heat conductivity, and can be flexible; and a second intermediate member that is disposed between a lower surface (an outer surface) of a base substrate wafer and a second heater, has conductivity and heat conductivity, and can be flexible, wherein the first intermediate member is formed so that a central portion thereof bulges toward the base substrate wafer further than a periphery portion thereof, and the second intermediate member is formed so that a central portion thereof bulges toward the lead substrate wafer further than a periphery portion thereof, and, the first intermediate member and the second intermediate member are evenly deformed. | 08-16-2012 |