Patent application number | Description | Published |
20090081424 | BONDING SHEET, BONDING METHOD AND BONDED BODY - A bonding sheet having a bonding film that can be firmly bonded to an object with high dimensional accuracy and efficiently bonded to the object at a low temperature, a bonding method which is capable of efficiently bonding such a bonding sheet and the object at a low temperature, and a bonded body formed by firmly bonding the bonding sheet and the object with high dimensional accuracy and therefore being capable of providing high reliability are provided. The bonding sheet is adapted to be bonded to an object. The bonding sheet includes a functional substrate having a specific function and a surface, and a bonding film provided on the side of the surface of the functional substrate, the bonding film containing metal atoms, oxygen atoms bonded to the metal atoms, and leaving groups each bonded to at least one of the metal and oxygen atoms, and having a surface. When energy is applied to at least a predetermined region of the surface of the bonding film, the leaving groups, which exist in the vicinity of the surface within the region, are removed from the bonding film so that the region develops a bonding property with respect to the object. | 03-26-2009 |
20090081432 | BASE MEMBER WITH BONDING FILM, BONDING METHOD AND BONDED BODY - A base member with a bonding film that can be firmly bonded to an object with high dimensional accuracy and efficiently bonded to the object at a low temperature, a bonding method which is capable of efficiently bonding such a base member and the object at a low temperature, and a bonded body formed by firmly bonding the base member and the object with high dimensional accuracy and therefore being capable of providing high reliability are provided. The base member is adapted to be bonded to an object through the bonding film thereof. The base member includes a substrate, a bonding film containing metal atoms, oxygen atoms bonded to the metal atoms, and leaving groups each bonded to at least one of the metal and oxygen atoms, and having a surface, and an intermediate layer provided between the substrate and the bonding film, the intermediate layer having such a property that its thickness can be changed by applying stress thereto. When energy is applied to at least a predetermined region of the surface of the bonding film, the leaving groups, which exist in the vicinity of the surface within the region, are removed from the bonding film so that the region develops a bonding property with respect to the object. | 03-26-2009 |
20090133820 | SEPARATING METHOD OF BONDED BODY - A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members. | 05-28-2009 |
20090136767 | BONDING METHOD AND BONDED BODY - A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members using a liquid droplet ejecting method, to form a liquid coating having a pattern corresponding to the predetermined pattern on the surface; drying the liquid coating so that it is transformed into the bonding film having the predetermined pattern on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film. | 05-28-2009 |
20090214856 | BONDED BODY AND METHOD OF MANUFACTURING BONDED BODY - A bonded body having high dimensional accuracy and manufactured easily without problems which occur in the solid bonding method and a method of manufacturing such a bonded body are provided. The bonded body includes a first base member having a first bonding surface; a second base member having a second bonding surface; and a bonding film through which the first base member and the second base member are boded together, the bonding film having two surfaces each making contact with the first bonding surface and the second bonding surface, the bonding film including a silicone portion containing a silicone material composed of silicone compounds and a plurality of gap members that regulate a distance between the first base member and the second base member, at least a part of the gap members provided in the silicone portion. In such a bonded body, energy for bonding is applied to a region of at least a part of the bonding film to develop a bonding property in a vicinity of each of the surfaces of the bonding film corresponding to the region so that the first base member and the second base member are bonded together through the bonding film due to the bonding property. | 08-27-2009 |
20090297869 | BONDING METHOD AND BONDED BODY - A bonding method includes: preparing a first substrate and a second substrate; forming a liquid coating film by applying a liquid material including silicone to at least one of the first substrate and the second substrate; drying the liquid coating film so as to obtain a bonding film; and developing adhesiveness around a surface of the bonding film by applying energy to the bonding film so as to obtain a bonded body obtained by bonding the first substrate and the second substrate each other with the bonding film interposed between the first substrate and the second substrate. In the device, bonding strength of the bonding film is adjusted by appropriately setting a condition for applying the energy. | 12-03-2009 |
20100243134 | BONDING METHOD AND BONDED STRUCTURE - A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles. | 09-30-2010 |
20100243145 | BONDING METHOD AND BONDED STRUCTURE - A bonding method includes: preparing a first base material to have liquid repellency against a silicone material-containing liquid material; applying the liquid material to a surface of the first base material to form a liquid coating in a predetermined shape, and drying the liquid coating to obtain a bonding film with the predetermined shape; imparting energy to the bonding film to develop adhesion near a surface of the bonding film, and bonding the first base material to a second base material via the bonding film, and then separating the first and second base materials from each other to transfer the bonding film to the second base material; and imparting energy to the bonding film after the transfer to develop adhesion near a surface of the bonding film, and bonding the second base material to a third base material via the bonding film to obtain a bonded structure. | 09-30-2010 |