Patent application number | Description | Published |
20090021643 | DIGITAL TELEVISION CHIP, SYSTEM AND METHOD THEREOF - A digital television chip having a reduced layout size is disclosed, comprising a multiplexer, and first and second converting units. The multiplexer, according to a control signal, outputs one of S-video signals SY and SC to the first converting unit, outputs the other of the S-video signals SY and SC to the second converting unit, outputs one of Tuner CVBS signals VIF and SIF to the first converting unit, outputs the other of the Tuner CVBS signals VIF and SIF to the second converting unit, or outputs a CVBS Line-in Video signal to one of the first and second converting units, for reducing the size of the chip. The first converting unit converts one of the S-video signals SY and SC, one of the Tuner CVBS signals VIF and SIF, or the CVBS Line-in Video signal into a first digital signal for signal processing. The second converting unit converts one of the S-video signals SY and SC, one of the Tuner CVBS signals VIF and SIF, or the CVBS Line-in Video signal into a second digital signal for signal processing. | 01-22-2009 |
20090027246 | ANALOG-TO-DIGITAL CONVERTER AND METHOD OF GAIN ERROR CALIBRATION THEREOF - The invention provides an analog-to-digital converter (ADC). The ADC comprises a plurality of stages connected in series, a gain error correction module, and a look-ahead module. Each of the stages derives a stage output value from a stage input signal and generates a stage output signal as the stage input signal of a subsequent stage, wherein one of the stages is selected as a target stage for estimating a gain value thereof. The gain error correction module delivers a correction number to the target stage to affect the stage output signal of the target stage and the stage output values of subsequent stages of the target stage, receives at least one auxiliary output value from a look-ahead module dedicated to the target stage, and derives an error estimate of the gain value of the target stage from the stage output values and the auxiliary output value. The look-ahead module generates the auxiliary output value according to the stage output value of the target stage, wherein the auxiliary output value is not affected by the correction number. | 01-29-2009 |
20090051574 | METHOD FOR GAIN ERROR ESTIMATION IN AN ANALOG-TO-DIGITAL CONVERTER AND MODULE THEREOF - The invention provides a method for gain error estimation in an analog-to-digital converter. In one embodiment, the analog-to-digital converter comprises a plurality of stages. A series of correction numbers applied to a target stage selected from the stages are correlated with a series of calculation values calculated according to digital output values of the stages to generate a series of gain error estimates. The series of gain error estimates are multiplied by a series of updating parameters to obtain a series of first values. A series of previous gain error values are multiplied by one minus the corresponding updating parameters to obtain a series of second values, wherein the series of previous gain values are obtained by delaying the present gain error values. The series of first values and the series of second values are correspondingly added to obtain a series of present gain error values for gain error correction. | 02-26-2009 |
20090055127 | METHOD FOR GAIN ERROR ESTIMATION FOR AN ANALOG-TO-DIGITAL CONVERTER - The invention provides a method for gain error estimation for an analog-to-digital converter. In one embodiment, the analog-to-digital converter comprises a plurality of stages. First, a series of correction numbers applied to a target stage selected from the stages are correlated with a series of first values calculated according to digital output values of the stages to generate a series of gain error estimates. Every first number of the series of gain error estimates is then averaged to obtain a series of second values. A second number of the series of second values is then averaged to obtain a gain error of the target stage. | 02-26-2009 |
20090294944 | SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREOF - A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements. | 12-03-2009 |
20100073209 | TRACK AND HOLD AMPLIFIERS AND ANALOG TO DIGITAL CONVERTERS - A track and hold amplifier is provided. The track and hold amplifier includes an input node receiving an analog signal, a buffer coupled between a first node and an output node, a first switch coupled between the input node and the first node, a plurality of switching circuits and a voltage generating unit. Each of the switching circuits includes a capacitor coupled between the first node and a second node. The voltage generating unit selectively provides a common signal and a reference signal to the capacitors of the switching circuits, wherein the reference signal is independent from the analog signal and the common signal. | 03-25-2010 |
20100225515 | TRACK AND HOLD AMPLIFIERS AND ANALOG TO DIGITAL CONVERTERS - A track and hold amplifier is provided. The track and hold amplifier includes an input node receiving an analog signal, a buffer coupled between a first node and an output node, a first switch coupled between the input node and the first node, a plurality of switching circuits and a voltage generating unit. Each of the switching circuits includes a capacitor coupled between the first node and a second node. The voltage generating unit selectively provides a common signal or a reference signal to the capacitors of the switching circuits, wherein the reference signal is independent from the analog signal. | 09-09-2010 |
20110032132 | DELTA-SIGMA ANALOG-TO-DIGITAL CONVERSION APPARATUS AND METHOD THEREOF - A delta-sigma analog-to-digital conversion apparatus for receiving an analog input signal to generate a digital output signal includes a subtracting unit, a quantizer, and a feedback unit. The subtracting unit is utilized for performing a subtraction function to generate a subtracted signal according to the analog input signal and a feedback signal. The quantizer is coupled to the subtracting unit and utilized for performing quantization to generate a quantized signal according to the subtracted signal. The feedback unit is coupled between the subtracting unit and the quantizer, and utilized for providing the feedback signal to the subtracting unit according to the quantized signal. The subtracting unit is arranged to reduce signal input swing of the quantizer. | 02-10-2011 |
20110187571 | DELTA-SIGMA ANALOG-TO-DIGITAL CONVERSION APPARATUS AND METHOD THEREOF - A delta-sigma analog-to-digital conversion apparatus for receiving an analog input signal to generate a digital output signal includes a subtracting unit, a quantizer, and a feedback unit. The subtracting unit is utilized for performing a subtraction function to generate a subtracted signal according to the analog input signal and a feedback signal. The quantizer is coupled to the subtracting unit and utilized for performing quantization to generate a quantized signal according to the subtracted signal. The feedback unit is coupled between the subtracting unit and the quantizer, and utilized for providing the feedback signal to the subtracting unit according to the quantized signal. The subtracting unit is arranged to reduce signal input swing of the quantizer. | 08-04-2011 |
20120009734 | SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREOF - A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements. | 01-12-2012 |