Patent application number | Description | Published |
20100150476 | VESSEL OPENER APPARATUS AND METHOD - An apparatus that presents an “easy-fill” mechanism for plastic bags (e.g., zip-lock bags) and the like is provided. The apparatus employs two levers equipped with handles on one end and attachment mechanisms or clips on the other. The levers are configured to open a bag when the handle portions of the levers are closed. Similarly, the apparatus is configured to close the bag when the handle portions are separated. | 06-17-2010 |
20100199829 | STRING INTRUMENT - A string instrument includes a body portion having a first longitudinal axis, an elongate neck portion having a second longitudinal axis and first and second opposing ends located along the second longitudinal axis, and a fastener that secures one of the first or second ends to the body portion, wherein the first and second axes are misaligned from each other in a same plane. | 08-12-2010 |
20120011985 | SUPPORT BRIDGE - A support bridge includes a support platform having a top surface and a bottom surface and a holder attached to the top surface of the support platform. The holder includes a first set of support members separated by a first gap, a first material free region, in the first support member, that provides access from outside of the first member through the first member to the first gap, and a first securing member on a surface of the first support member bounding the first material free region, and a first plug configured to physically engage the first securing member to secure a first object disposed between the first members in the first gap to the holder and the support platform. | 01-19-2012 |
Patent application number | Description | Published |
20120179419 | METHODS AND SYSTEMS OF OBJECT BASED METROLOGY FOR ADVANCED WAFER SURFACE NANOTOPOGRAPHY - Disclosed herein is a system and method for enhanced and expanded localized geometry characterization. Objects of interest are classified according to user-defined parameters, and this enables enhanced contrast and more accurate feature detection, as well as more accurately defined feature object regions. | 07-12-2012 |
20130236085 | Systems and Methods of Advanced Site-Based Nanotopography for Wafer Surface Metrology - Systems and methods for providing micro defect inspection capabilities for optical systems are disclosed. Each given wafer image is filtered, treated and normalized prior to performing surface feature detection and quantification. A partitioning scheme is utilized to partition the wafer image into a plurality of measurement sites and metric values are calculated for each of the plurality of measurement sites. Furthermore, transformation steps may also be utilized to extract additional process relevant metric values for analysis purposes. | 09-12-2013 |
20130304399 | SYSTEMS AND METHODS FOR WAFER SURFACE FEATURE DETECTION, CLASSIFICATION AND QUANTIFICATION WITH WAFER GEOMETRY METROLOGY TOOLS - Systems and methods for providing micro defect inspection capabilities for optical systems such as wafer metrology tools and interferometer systems are disclosed. The systems and methods in accordance with the present disclosure may detect, classify and quantify wafer surface features, wherein the detected defects are classified and the important defect metrology information of height/depth, area and volume is reported. The systems and methods in accordance with the present disclosure therefore provide more values for quantifying the negative effect of these defects on the wafer quality. | 11-14-2013 |
20140114597 | Systems, Methods and Metrics for Wafer High Order Shape Characterization and Wafer Classification Using Wafer Dimensional Geometry Tool - Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage. | 04-24-2014 |