Patent application number | Description | Published |
20100059883 | METHOD OF FORMING BALL BOND - A method of forming a ball bond ( | 03-11-2010 |
20100295169 | SEMICONDUCTOR SUBSTRATE AND METHOD OF CONNECTING SEMICONDUCTOR DIE TO SUBSTRATE - A semiconductor substrate includes a substrate layer and a circuit film formed over the substrate layer. One or more openings are formed in the circuit film and the substrate layer. Conductive plates are formed over the circuit film at the peripheries of the openings. A semiconductor die is attached to the circuit film, below the openings with an adhesive material. A conductive material is disposed in the openings to electrically connect the semiconductor die to the conductive plates. | 11-25-2010 |
20110012257 | HEAT SPREADER FOR SEMICONDUCTOR PACKAGE - A semiconductor package including a substrate, a die attached to the substrate and a heat spreader. The heat spreader has a heat dissipating portion with an upper surface, a lower surface and a perimeter. The lower surface overlies and is spaced apart from the die to provide a clearance therebetween. Supports are spaced about the perimeter of the heat dissipating portion and depend downwardly therefrom. Each support is located on the substrate to establish an opening between adjacent supports. | 01-20-2011 |
20110062569 | SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS - A QFP type packaged device includes down-set leads to allow for more I/O's and a smaller foot print. The device includes a die attached to a flag of a lead frame. Die pads are electrically connected to leads of the lead frame with wires. The leads are bent and include indentations so that they are exposed at the bottom side of the package. The leads are also trimmed so that they do not extend out of the sides of the packaged device. | 03-17-2011 |
20110066347 | SELF MONITORING BRAKING SYSTEM FOR VEHICLES - A self monitoring vehicle braking system includes multiple sensors that gather data associated with the braking system. The data includes wheel speed, road inclination, moisture associated with a surface of the braking system, and audio associated with the road. A processor receives the data from the sensors and processes the data to determine whether a condition of the braking system falls within defined limits and provides to the driver of the vehicle an indication of the braking system condition. | 03-17-2011 |
20110068469 | SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS - A semiconductor package includes an integrated circuit die having first and second sets of connection pads, bond wires, and a substrate with connection pads. The bond wires electrically connect the second set of connection pads of the die with the substrate connection pads. Prior to connecting the wires to the second connection pads, a free air ball (FAB) is formed and pressed against a respective one of the connection pads of the first set to form a pre-formed ball bond. | 03-24-2011 |
20110084375 | SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED STAND-OFF - A semiconductor device includes a substrate having first and second major surfaces and conductive traces, and solder balls attached to the second major surface of the substrate. A semiconductor die including an integrated circuit (IC) is attached to one of the major surfaces of the substrate. The IC is electrically connected to the solder balls by the conductive traces. The substrate includes an integrally molded stand-off feature that prevents the solder balls near the corners and the sides of the substrate from being knocked off during handling. The stand-off feature also maintains a predetermined distance between the substrate and a printed circuit board (PCB) when the substrate is attached to the PCB, and then a reflow process is performed. The stand-off feature also prevents open connections between the solder balls and the PCB that may be caused by warping of the PCB or the weight of the semiconductor die. The semiconductor device may include a stiffener ring attached to the second major surface of the substrate and surrounding the conductive balls. | 04-14-2011 |
20110248390 | LEAD FRAME FOR SEMICONDUCTOR PACKAGE - A lead frame for providing electrical interconnection to an Integrated Circuit (IC) die. The lead frame includes a die support area for receiving and supporting the IC die and a plurality of leads surrounding the die support area. A plurality of interconnect receiving portions is formed in the die support area. The interconnect receiving portions are for providing electrical interconnection to first bumps on a bottom surface of the IC die. The leads are for providing electrical interconnection to second bumps on a surface of the IC die, the second bumps surrounding the first bumps. | 10-13-2011 |
20120074549 | SEMICONDUCTOR DEVICE WITH EXPOSED PAD - A semiconductor device has a die attached to a die pad and electrically connected to lead fingers. The die, a top surface of the die pad, and a first portion of the lead fingers are covered with a mold compound. A second portion of the lead fingers project from the mold compound and allow for external electrical connection to the die. The mold compound around the die and lead fingers is extended such that a cavity is formed below the die pad. The die pad is exposed via the cavity. A heat sink may be inserted into the cavity and attached to the bottom surface of the die pad. | 03-29-2012 |
20130113054 | SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME - A packaged semiconductor device with a cavity formed by a cover or lid mounted to a substrate. The lid covers one or more semiconductor sensor dies mounted on the substrate. The dies are coated with a gel or spray on coating, and the lid is encapsulated with a mold compound. A hole or passage may be formed through the cover and mold compound to expose the sensor dies to selected environmental conditions. | 05-09-2013 |
20140264793 | LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF - A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead frame, the die and the bond wires. The lead frame includes spaced apart first and second frame members each having an inner peripheral edge and an opposing outer peripheral edge, spaced apart lead pads disposed between the inner peripheral edges of the first and second frame members, and conductive leads disposed proximate to the outer peripheral edge of each of the first and second frame members. The die is mounted on the lead pads. | 09-18-2014 |
20140367840 | MOLD CAP FOR SEMICONDUCTOR DEVICE - A semiconductor package has a substrate with a solder mask layer, and upper and lower surfaces. Conductive traces and electrical contacts are formed on the substrate, and vias are formed in the substrate to electrically connect the conductive traces and electrical contacts. A semiconductor die is attached on the upper surface of the substrate. A mold cap is formed on the upper surface of the substrate and covers the die and the conductive traces. The mold cap includes a mold body having clipped corners and extensions that extend from each of the clipped corners. The extensions and clipped corners help prevent package cracking. | 12-18-2014 |
20150014793 | PRESSURE SENSOR HAVING DOWN-SET FLAG - A semiconductor sensor device has a lead frame having an outer frame with wire bond pads and a die pad to which a pressure sensor die is mounted. The die pad is vertically offset from the outer frame and wire bond pads by tie bars that have down set structures. The die pad has an opening, and the sensor die is mounted on the first die attach pad such that the opening provides access to an active region of the sensor die. Pressure sensitive gel is applied over the active region of the sensor die. Molding compound covers the sensor die and gel. The molding compound has a hole corresponding to the opening in the die pad to enable ambient atmospheric pressure outside of the sensor device to reach the sensor die via the pressure sensitive gel. | 01-15-2015 |
20150054099 | PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD - A semiconductor sensor device is assembled using a pre-molded lead frame having first and second die flags. The first die flag includes a cavity. A pressure sensor die (P-cell) is mounted within the cavity and a master control unit die (MCU) is mounted to the second flag. The P-cell and MCU are electrically connected to leads of the lead frame with bond wires. The die attach and wire bonding steps are each done in a single pass. A mold pin is placed over the P-cell and then the MCU is encapsulated with a mold compound. The mold pin is removed leaving a recess that is next filled with a gel material. Finally a lid is placed over the P-cell and gel material. The lid includes a hole that that exposes the gel-covered active region of the pressure sensor die to ambient atmospheric pressure outside the sensor device. | 02-26-2015 |
20150084169 | SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER - A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle. | 03-26-2015 |