Patent application number | Description | Published |
20110051985 | PIEZOELECTRIC MICRO SPEAKER HAVING PISTON DIAPHRAGM AND METHOD OF MANUFACTURING THE SAME - Provided are a piezoelectric micro speaker having a piston diaphragm and a method of manufacturing the piezoelectric micro speaker. The piezoelectric micro speaker includes: a substrate having a cavity formed therein; a vibrating membrane that is disposed on the substrate and covers at least a center part of the cavity; a piezoelectric actuator disposed on the vibrating membrane so as to vibrate the vibrating membrane; and a piston diaphragm that is disposed in the cavity and performs piston motion by vibration of the vibrating membrane. When the vibrating membrane vibrates by the piezoelectric actuator, the piston diaphragm, which is connected to the vibrating membrane through a piston bar, performs a piston motion in the cavity. | 03-03-2011 |
20110064250 | PIEZOELECTRIC MICRO SPEAKER INCLUDING ANNULAR RING-SHAPED VIBRATING MEMBRANES AND METHOD OF MANUFACTURING THE PIEZOELECTRIC MICRO SPEAKER - A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a substrate having a cavity formed therein and a diaphragm that is disposed on the substrate that overlaps the cavity. A plurality of first vibrating membranes having concentric annular ring shapes are disposed in a first region of the diaphragm corresponding to a center of the cavity. A second vibrating membrane including a different material from that of the first vibrating membranes is formed in the second region of the diaphragm corresponding to an edge of the cavity. A piezoelectric actuator for vibrating the first vibrating membranes is formed on and between the concentric annular rings of the first vibrating membranes. | 03-17-2011 |
20110075867 | PIEZOELECTRIC MICRO SPEAKER INCLUDING WEIGHT ATTACHED TO VIBRATING MEMBRANE AND METHOD OF MANUFACTURING THE SAME - Provided are a piezoelectric micro speaker and a method of manufacturing the same. The piezoelectric micro speaker includes: a substrate having a cavity therein; a diaphragm that is disposed on the substrate, the diaphragm including a vibrating membrane that overlaps the cavity; a piezoelectric actuator that is disposed on the vibrating membrane; and a weight that is disposed in the cavity and attached to a center portion of the vibrating membrane. | 03-31-2011 |
20110075879 | PIEZOELECTRIC MICRO SPEAKER WITH CURVED LEAD WIRES AND METHOD OF MANUFACTURING THE SAME - A micro speaker includes a substrate having a cavity formed therein, a diaphragm formed on the substrate overlapping the cavity. The diaphragm includes a first vibration membrane formed in a first area corresponding to a center portion of the cavity and a second vibration membrane formed in a second area corresponding to an edge portion of the cavity and formed of material different from that used for the first vibration membrane. A piezoelectric actuator is formed including a first electrode layer formed on the first vibration membrane, a piezoelectric layer formed on the first electrode layer, and a second electrode layer formed on the piezoelectric layer, and first and second curved lead wires, respectively connected to the first and second electrode layers across the second area, which are symmetrical to the center of the piezoelectric actuator. | 03-31-2011 |
20110085684 | PIEZOELECTRIC MICRO SPEAKER - Provided is a piezoelectric micro speaker. The piezoelectric micro speaker includes a device plate having a front cavity, a front plate having a radiation hole which communicates with the front cavity in front of the device plate, and a rear plate having a rear cavity and a vent portion. A rear portion of the device plate forms a wall of the vent portion. The device plate includes at least one first vent hole which communicates with the vent portion, and the front plate includes at least one second vent hole which communicates with the first vent hole. | 04-14-2011 |
20130050802 | ELECTROWETTING DEVICE AND METHOD OF MANUFACTURING THE SAME - In one embodiment, the electrowetting device includes a first medium; a second medium that is not mixed with the first medium and has a refractive index different from a refractive index of the first medium; an upper electrode that adjusts an angle of a boundary surface between the first medium and the second medium; and a barrier wall that has a side surface surrounding the first and second mediums, allows the upper electrode to be disposed on a portion of the side surface, and has irregular widths. | 02-28-2013 |
20140124818 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - A light emitting device (LED) includes a stress control layer having a compressive stress on a substrate, a bonding layer on the stress control layer, a semiconductor layer on the bonding layer and including an active region for emitting light on the bonding layer, a first electrode on a lower surface of the substrate, and a second electrode on the semiconductor layer. The compressive stress of the stress control layer is between about 1 and about 20 GPa. | 05-08-2014 |
20140162053 | BONDED SUBSTRATE STRUCTURE USING SILOXANE-BASED MONOMER AND METHOD OF MANUFACTURING THE SAME - A bonded substrate structure includes a siloxane-based monomer layer between a first substrate and a second substrate, the siloxane-based monomer layer bonding the first substrate and the second substrate. The first substrate and the second substrate may be one of a silicon substrate and a silicon oxide substrate, respectively. | 06-12-2014 |
20140299231 | METAL-BASED SOLDER COMPOSITE INCLUDING CONDUCTIVE SELF-HEALING MATERIALS - A solder composite is provided. The solder composite may include: a metal-based solder matrix, a capsule dispersed in the solder matrix, and a self-healing material that is encapsulated in the capsule. The self-healing material may be configured to react with the solder matrix when in contact with the solder matrix such that at least one of an electrically conductive intermetallic compound and an electrically conductive alloy is formed. | 10-09-2014 |