Patent application number | Description | Published |
20090026565 | Optical Module - The present invention includes: photoelectric conversion element | 01-29-2009 |
20090200748 | ROTATING MEMBER AND METHOD FOR COATING THE SAME - A pulsed discharge is generated between tip ends of a rotating member such as a blade and a discharge electrode including a hard material such as cBN in dielectric liquid or gas by a power supply for discharge to melt the discharge electrode, and a part of the discharge electrode is attached to the tip end of the rotating member to form an abrasive coating film including the hard materials such as cBN. | 08-13-2009 |
20100124490 | ROTATING MEMBER AND METHOD FOR COATING THE SAME - A pulsed discharge is generated between tip ends of a rotating member such as a blade and a discharge electrode including a hard material such as cBN in dielectric liquid or gas by a power supply for discharge to melt the discharge electrode, and a part of the discharge electrode is attached to the tip end of the rotating member to form an abrasive coating film including the hard materials such as cBN. | 05-20-2010 |
20100328894 | OPTICAL INTERCONNECTION DEVICE - Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules ( | 12-30-2010 |
20110079422 | MULTILAYER SUBSTRATE - A multilayer substrate is provided with a conductor plane region in which a plurality of conductor planes are disposed; a clearance region disposed adjacent to the conductor plane region so that the plurality of conductor planes are excluded from the clearance region. A plurality of signal vias are disposed through the clearance region so that the plurality of signal vias are isolated from the plurality of conductor planes. A conductor post is connected to one of the plurality of conductor planes and disposed between two of the signal vias in the clearance region. | 04-07-2011 |
20130050470 | SURFACE INSPECTION METHOD AND SURFACE INSPECTION APPARATUS FOR STEEL SHEET COATED WITH RESIN - A surface inspection method for a steel sheet coated with a resin, includes irradiating the steel sheet with sheet-like light, which has been linearly polarized at a predetermined polarization angle, at an incidence angle different from Brewster's angle of the coating by a predetermined angle or greater; and imaging linearly-polarized light of a polarization angle of 0 degrees at an acceptance angle different from a regular reflection angle of incident light by a predetermined angle. Accordingly, it is not necessary to change the incidence angle and the acceptance angle depending on resin components and it is possible to inspect a substrate steel surface of the steel sheet highly accurately without observing abnormalities in the coating itself. | 02-28-2013 |
20130192865 | NOISE SUPPRESSION STRUCTURE - A noise suppression structure of the present invention includes a current control unit provided on a ground layer and controlling current. The current control unit includes: a metal plane that is provided above the ground layer with an interval therebetween; and a short circuit plate that is arranged at one end portion of the metal plane, and connects the metal plane and the ground layer. A notch portion is provided in a portion of the metal plane. | 08-01-2013 |
20140049343 | CIRCUIT SUBSTRATE HAVING NOISE SUPPRESSION STRUCTURE - A circuit substrate has three wiring layers, wherein a signal line is formed in a first wiring layer; a ground plane is formed in a second wiring layer; a resonant line is formed in a third wiring layer. A circumferential slit is formed in the ground plane, wherein an island electrode separated from the ground plane is formed inside the slit. The left end of the resonant line is connected to the island electrode through an interlayer-connecting via, while the right end of the resonant line is connected to the ground plane through an interlayer-connecting via. A transmission line (or a microstrip line) is formed using the signal line and the ground plane, and therefore a complex resonator is formed to embrace the transmission line. This achieves band elimination with regard to a signal component of a resonance frequency among signals propagating through the microstrip line. Thus, it is possible to form a noise suppression structure without mounting additional parts on the circuit substrate, and therefore it is possible to effectively eliminate power distribution noise and noise propagating through the signal line with a small and simple configuration. | 02-20-2014 |
20140209367 | WIRING BOARD - It is impossible to make a wiring board for noise suppression thinner, therefore, a wiring board according to an exemplary aspect of the invention includes a first wiring layer, an intermediate layer, and a second wiring layer; wherein the second wiring layer, the intermediate layer, and the first wiring layer are stacked in this order; the first wiring layer comprises a first wiring and a second wiring separated from the first wiring; the intermediate layer comprises a first via and a second via; the second wiring layer comprises a third wiring and a non-wiring portion where wirings are not formed; the first wiring is separated from the third wiring; the first via and the second via electrically connect the second wiring to the third wiring respectively; the non-wiring portion is located at a portion corresponding to an area between the first via and the second via; and the first wiring and the second wiring cross over the non-wiring portion. | 07-31-2014 |