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Jun Qian

Jun Qian, Sunnyvale, CA US

Patent application numberDescriptionPublished
20080239308HIGH THROUGHPUT MEASUREMENT SYSTEM - A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.10-02-2008
20080243433METHODS AND APPARATUS FOR GENERATING A LIBRARY OF SPECTRA - A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.10-02-2008
20090033942Determining Physical Property of Substrate - A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.02-05-2009
20090275265ENDPOINT DETECTION IN CHEMICAL MECHANICAL POLISHING USING MULTIPLE SPECTRA - A computer implemented method includes obtaining at least one current spectrum with an in-situ optical monitoring system, comparing the current spectrum to a plurality of different reference spectra, and determining based on the comparing whether a polishing endpoint has been achieved for the substrate having the outermost layer undergoing polishing. The current spectrum is a spectrum of light reflected from a substrate having an outermost layer undergoing polishing and at least one underlying layer. The plurality of reference spectra represent spectra of light reflected from substrates with outermost layers having the same thickness and underlying layers having different thicknesses.11-05-2009
20100184357Polishing Pad and System with Window Support - A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the spacer contacts the end of the optical fiber, a top surface of the spacer contacts the underside of the window, and the vertical aperture is aligned with the optical fiber.07-22-2010
20100261413Determining Physical Property of Substrate - A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.10-14-2010
20110046918METHODS AND APPARATUS FOR GENERATING A LIBRARY OF SPECTRA - A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.02-24-2011
20110256812CLOSED-LOOP CONTROL FOR IMPROVED POLISHING PAD PROFILES - Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.10-20-2011
20110269377Automatic Generation of Reference Spectra for Optical Monitoring of Substrates - A computer-implemented method of generating reference spectra includes polishing a first substrate in a polishing apparatus having a rotatable platen, measuring a sequence of spectra from the substrate during polishing with an in-situ monitoring system, associating each spectrum in the sequence of spectra with a index value equal to a number of platen rotations at which the each spectrum was measured, and storing the sequence of spectra as reference spectra.11-03-2011
20110281501FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING - A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.11-17-2011
20110294400Determining Physical Property of Substrate - A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.12-01-2011
20110301847Automatic Initiation Of Reference Spectra Library Generation For Optical Monitoring - A method of generating reference spectra includes polishing a first substrate in a polishing apparatus, measuring a sequence of spectra from the first substrate during polishing with an in-situ optical monitoring system, for each spectrum in the sequence of spectra, determining a best matching reference spectrum from a first plurality of first reference spectra to generate a sequence of reference spectra, calculating a value of a metric of fit of the sequence of spectra to the sequence of reference spectra, comparing the value of the metric of fit to a threshold value and determining whether to generate a second library based on the comparison, and if the second library is determined to be generated, storing the sequence of spectra as a second plurality of reference spectra.12-08-2011
20120028813Selecting Reference Libraries For Monitoring Of Multiple Zones On A Substrate - A method of configuring a polishing monitoring system includes receiving user input selecting a plurality of libraries, each library of the plurality of libraries comprising a plurality of reference spectra for use in matching to measured spectra during polishing, each reference spectrum of the plurality of reference spectra having an associated index value, for a first zone of a substrate, receiving user input selecting a first subset of the plurality of libraries, and for a second zone of the substrate, receiving user input selecting a second subset of the plurality of libraries.02-02-2012
20120231701FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING - A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.09-13-2012
20130288571FEED FORWARD AND FEED-BACK TECHNIQUES FOR IN-SITU PROCESS CONTROL - During polishing of a substrate at a first platen and prior to a first time, a first sequence of values is obtained for a first zone of the first substrate and a second sequence of values is obtained for a different second zone of the substrate with an in-situ monitoring system. A first function is fit to a portion of the first sequence of values obtained prior to the first time, and a second function is fit to a portion of the second sequence of values obtained prior to the second time. At least one polishing parameter is adjusted based on the first fitted function and the second fitted function so as to reduce an expected difference between the zones. A second substrate is polished on the first platen using an adjusted polishing parameter calculated based on the first fitted function and the second fitted function.10-31-2013
20140113524ENDPOINTING WITH SELECTIVE SPECTRAL MONITORING - A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.04-24-2014
20140176949Automatic Initiation Of Reference Spectra Library Generation For Optical Monitoring - A method of generating reference spectra includes polishing a first substrate in a polishing apparatus, measuring a sequence of spectra from the first substrate during polishing with an in-situ optical monitoring system, for each spectrum in the sequence of spectra, determining a best matching reference spectrum from a first plurality of first reference spectra to generate a sequence of reference spectra, calculating a value of a metric of fit of the sequence of spectra to the sequence of reference spectra, comparing the value of the metric of fit to a threshold value and determining whether to generate a second library based on the comparison, and if the second library is determined to be generated, storing the sequence of spectra as a second plurality of reference spectra.06-26-2014
20140242878WEIGHTED REGRESSION OF THICKNESS MAPS FROM SPECTRAL DATA - A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.08-28-2014
20140242879PATH FOR PROBE OF SPECTROGRAPHIC METROLOGY SYSTEM - A method of operating a polishing system includes polishing a substrate at a polishing station, the substrate held by a carrier head during polishing, transporting the substrate to an in-sequence optical metrology system positioned between the polishing station and another polishing station or a transfer station, measuring a plurality of spectra reflected from the substrate with a probe of the optical metrology system while moving the carrier head to cause the probe to traverse a path across the substrate and while the probe remains stationary, the path across the substrate comprising either a plurality of concentric circles or a plurality of substantially radially aligned arcuate segments, and adjusting a polishing endpoint or a polishing parameter of the polishing system based on one or more characterizing values generated based on at least some of the plurality of spectra.08-28-2014
20140242881FEED FORWARD PARAMETER VALUES FOR USE IN THEORETICALLY GENERATING SPECTRA - A method of controlling a polishing operation is described. A controller stores an optical model for a layer stack having a plurality of layers and a plurality of input parameters including a first parameter and a second parameter. The controller stores data defining a plurality of default values for the first parameter and measures an optical property of a substrate and generates a second value. Using the optical model and the second value and iterating over the first values, a number of reference spectra are calculated. A spectrum is measured and the measured spectrum is matched to the reference spectra and the best matched reference spectrum is determined. The first value of the best matched reference spectrum is determined and is used to adjust a polishing endpoint or a polishing parameter of a polishing apparatus.08-28-2014
20140242883DETERMINATION OF WAFER ANGULAR POSITION FOR IN-SEQUENCE METROLOGY - A polishing apparatus includes a carrier head configured to hold a wafer in a first plane, the wafer having a perimeter and a fiducial, a drive shaft having an axis perpendicular to the first plane and configured to rotate the carrier head about the axis, a light source configured to direct light onto an outer face of the wafer at a position adjacent the perimeter of the wafer; a detector configured to detect the light collected from the wafer while the drive shaft rotates the carrier head and the wafer; and a controller configured to receive a first signal indicating an angular position of the drive shaft and receive a second signal from the detector, the controller configured to determine based on the first signal and the second signal an angular position of the fiducial with respect the carrier head.08-28-2014
20140273749DYNAMIC RESIDUE CLEARING CONTROL WITH IN-SITU PROFILE CONTROL (ISPC) - A method for controlling the residue clearing process of a chemical mechanical polishing (“CMP”) process is provided. Dynamic in-situ profile control (“ISPC”) is used to control polishing before residue clearing starts, and then a new polishing recipe is dynamically calculated for the clearing process. Several different methods are disclosed for calculating the clearing recipe. First, in certain implementations when feedback at T0 or T1 methods are used, a post polishing profile and feedback offsets are generated in ISPC software. Based on the polishing profile and feedback generated from ISPC before the start of the clearing process, a flat post profile after clearing is targeted. The estimated time for the clearing step may be based on the previously processed wafers (for example, a moving average of the previous endpoint times). The calculated pressures may be scaled to a lower (or higher) baseline pressure for a more uniform clearing.09-18-2014

Patent applications by Jun Qian, Sunnyvale, CA US

Jun Qian, San Jose, CA US

Patent application numberDescriptionPublished
20100058130PROCESSOR TO JTAG TEST ACCESS PORT INTERFACE - Method and apparatus for operating for operating an Institute of Electrical and Electronics Engineers (IEEE) Standard 1149.1 compliant Joint Test Action Group (JTAG) Test Access Port (TAP) controller are disclosed. An example apparatus includes write logic that is configured to operationally interface with a TAP controller and a processor. The write logic is further configured to receive, from the processor, data for initializing the apparatus and operating the TAP controller, convert at least a portion of the data from a parallel format to a serial format and communicate the converted data to the TAP controller.03-04-2010
20100090743INTERFACE TO REGULATE VOLTAGE FOR ASIC POWER MANAGEMENT - A method and apparatus to regulate voltage used to power an ASIC comprising an ASIC having a signal source and a modulator. The modulator establishes a characteristic of a signal created by the signal source to indicate a voltage level to be used to power the ASIC. The signal is communicated to a voltage regulator to apply an optimal voltage to the ASIC.04-15-2010
20100218058FAULT INJECTION - Systems, methods, and other embodiments associated with programmable application specific integrated circuit (ASIC) fault injection are described. One example ASIC includes a serializer de-serializer (SERDES). The example ASIC may also include logics to process data in the ASIC. At least one of the logics either receives data from the SERDES and/or provides data to the SERDES. The example ASIC may also include an embedded fault injection logic (EFIL) to control injection of a fault to a path (e.g., data, control) associated with at least one of the logics. The example ASIC may also include an embedded set of multiplexers (ESOMs) controlled by the EFIL. The ESOMs are controllable by the EFIL to inject a fault signal to the data path.08-26-2010

Jun Qian, Santa Clara, CA US

Patent application numberDescriptionPublished
20130273812FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING - A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.10-17-2013

Jun Qian, Pasadena, CA US

Patent application numberDescriptionPublished
20140052436SYSTEM AND METHOD FOR UTILIZING MULTIPLE ENCODINGS TO IDENTIFY SIMILAR LANGUAGE CHARACTERS - Described herein are systems and methods for identifying the similarity between language characters. As described herein, a pair of language characters is received at a language character match engine. The language character match engine is adapted to receive encoding configuration information from each of a plurality of encoding components, and is adapted to encode the pair of language characters based on the unique structure of each language character to generate a pair of string identification characters for each encoding component. Thereafter, each pair of string identification characters is compared to one another to generate a similarity score, and the similarity score for each pair of string identification characters is combined to create a composite similarity score. The composite similarity score represents a similarity between the pair of language characters, and is used to identify the similarity between the pair of language characters.02-20-2014

Jun Qian, Wuhan City CN

Patent application numberDescriptionPublished
20140078424PIEZO-CAPACITIVE EFFECT-BASED PRINTED FLEXIBLE TOUCHSCREEN DISPLAY - A piezo-capacitive effect-based printed flexible touch screen, comprising a printable layer, a printing ink layer, a transmissive layer, an electrode layer A, an electrically-controlled optical switch layer, an electrode layer B, a transparent flexible layer, and an electrode layer C disposed successively from bottom to top. The printable layer is a flexible insular material that is foldable and printable. The printing ink layer is a CMYK ink dot matrix printed on the printable layer. The transmissive layer is a flexible transmissive material. The transparent flexible layer is a TPE-thermoplastic elastomer. The electrically-controlled optical switch layer is a PDLC film. The electrode layer A, electrode layer B, and electrode layer C are all ITO conductive film layers having electrode array engraved thereon, while the electrode arrays of the electrode layer A and the electrode layer C are in same direction and are perpendicular in direction to the electrode array of electrode layer B. The screen is a touch screen and allows for facilitated colorization, rapid response time, reduced driving voltage, simplified manufacturing method, and reduced manufacturing costs.03-20-2014
20140098326PRINTED FLEXIBLE DISPLAY HAVING GRATING - A printed flexible display having grating, comprising a printable layer, a printing ink layer, a grating layer, an electrode layer A, an electrically-controlled optical switch layer, and an electrode layer B which are arranged successively from top to bottom. The printable layer is a flexible insulating material that is foldable and printable. The printing ink layer is a CMYK ink dot matrix printed on the printable layer. The grating layer is a lenticular grating plate. The printing ink layer is arranged on a focal plane of the lenticular grating plate. The thickness of the grating layer equals to the absolute value of an object-side focal length of the lenticular grating plate. The electrode layer A and the electrode layer B are both ITO conductive thin film layers having electrode array engraved thereon, while the electrode arrays of both are perpendicular in direction. The electrically-controlled optical switch layer is a PDLC thin film. The display allows for facilitated three-dimensional visual effects, facilitated colorization, shortened response time, reduced driving voltage, comfortable reading, and reduced costs.04-10-2014

Jun Qian, Tualatin, OR US

Patent application numberDescriptionPublished
20140106574GAPFILL OF VARIABLE ASPECT RATIO FEATURES WITH A COMPOSITE PEALD AND PECVD METHOD - Provided herein are methods and apparatus for filling one or more gaps on a semiconductor substrate. The disclosed embodiments are especially useful for forming seam-free, void-free fill in both narrow and wide features. The methods may be performed without any intervening etching operations to achieve a single step deposition. In various implementations, a first operation is performed using a novel PEALD fill mechanism to fill narrow gaps and line wide gaps. A second operation may be performed using PECVD methods to continue filling the wide gaps.04-17-2014
20150147482CHAMBER UNDERCOAT PREPARATION METHOD FOR LOW TEMPERATURE ALD FILMS - Methods and apparatus disclosed herein relate to the formation and use of undercoats on the interior surfaces of reaction chambers used to deposit films on substrates. The undercoats are deposited through atomic layer deposition methods. The disclosed undercoats help prevent metal contamination, provide improved resistance to flaking, and are relatively thin. Because of the superior resistance to flaking, the disclosed undercoats allow more substrates to be processed between subsequent cleaning operations, thereby increasing throughput.05-28-2015
20150249013CAPPED ALD FILMS FOR DOPING FIN-SHAPED CHANNEL REGIONS OF 3-D IC TRANSISTORS - Disclosed herein are methods of doping a fin-shaped channel region of a partially fabricated 3-D transistor on a semiconductor substrate. The methods may include forming a multi-layer dopant-containing film on the substrate, forming a capping film comprising a silicon carbide material, a silicon nitride material, a silicon carbonitride material, or a combination thereof, the capping film located such that the multi-layer dopant-containing film is located in between the substrate and the capping film, and driving dopant from the dopant-containing film into the fin-shaped channel region. Multiple dopant-containing layers of the film may be formed by an atomic layer deposition process which includes adsorbing a dopant-containing film precursor such that it forms an adsorption-limited layer on the substrate and reacting adsorbed dopant-containing film precursor. Also disclosed herein are multi-station substrate processing apparatuses for doping the fin-shaped channel regions of partially fabricated 3-D transistors.09-03-2015
20150332912SINGLE ALD CYCLE THICKNESS CONTROL IN MULTI-STATION SUBSTRATE DEPOSITION SYSTEMS - Disclosed are methods of depositing films of material on multiple semiconductor substrates in a multi-station processing chamber. The methods may include loading a first set of one or more substrates into the processing chamber at a first set of one or more process stations and depositing film material onto the first set of substrates by performing N cycles of film deposition. Thereafter, the methods may further include transferring the first set of substrates from the first set of process stations to a second set of one or more process stations, loading a second set of one or more substrates at the first set of process stations, and depositing film material onto the first and second sets of substrates by performing N′ cycles of film deposition, wherein N′ is not equal to N. Also disclosed are apparatuses and computer-readable media which may be used to perform similar operations.11-19-2015

Jun Qian, Beijing CN

Patent application numberDescriptionPublished
20130024649METHOD AND DEVICE FOR STORING ROUTING TABLE ENTRY - The present invention discloses a method and a device for storing a routing table entry. The method includes: splitting a routing table entry into two points according to a range matching policy; obtaining a storage location of the routing table entry in a hierarchical binary tree; and adding each segment related to the routing table entry to the binary tree of each segment according to the storage location. According to the present invention, the routing table entry is stored in the hierarchical binary tree in segments, which significantly reduces the total amount of memory required to be occupied by storage of the routing table entry.01-24-2013
20140003372ACTIVATING A MOBILE TERMINAL FROM MOBILE NETWORK SIDE01-02-2014
20150319696ACTIVATING A MOBILE TERMINAL FROM MOBILE NETWORK SIDE - Disclosed is a method of activating a mobile terminal from mobile network side and a mobile application gateway system. The method comprises: receiving, by a mobile application gateway, a request for activating the mobile terminal, the request including an unique identification number of the mobile terminal; querying, by the mobile application gateway, a HLR for address of a SGSN where the mobile terminal is located; returning, by the HLR, the queried address of SGSN to the mobile application gateway; sending, by the mobile application gateway, the request for activating the mobile terminal to the SGSN; issuing, by the SGSN, a request to the mobile terminal, requiring the mobile terminal to issue a mobile terminal initiated PDP context activation request. The method enables an instant messaging user at a mobile terminal to automatically open an IP connection if there is any message to be received after the IP connection is closed.11-05-2015

Patent applications by Jun Qian, Beijing CN

Jun Qian, Zhejiang CN

Patent application numberDescriptionPublished
20140170310COLLOIDAL LITHOGRAPHY METHODS FOR FABRICATING MICROSCOPIC AND NANOSCOPIC PARTICLE PATTERNS ON SUBSTRATE SURFACES - A method of surface patterning by transferring particles interfacially trapped at an air-water interface to a substrate includes the steps of: (a) interfacially trapping a plurality of particles at an air-water interface; (b) providing a substrate having a polymer adhesive thereon, the polymer adhesive having a glass transition temperature that is less than 25° C. and an advancing water contact angle greater than 50; and (c) transferring the particles of step (a) to the substrate of (b) by the Langmuir-Schaefer technique.06-19-2014

Jun Qian, Sherwood, OR US

Patent application numberDescriptionPublished
20150243545INHIBITOR PLASMA MEDIATED ATOMIC LAYER DEPOSITION FOR SEAMLESS FEATURE FILL - Systems and methods for depositing film in a substrate processing system includes performing a first atomic layer deposition (ALD) cycle in a processing chamber to deposit film on a substrate including a feature; after the first ALD cycle, exposing the substrate to an inhibitor plasma in the processing chamber for a predetermined period to create a varying passivated surface in the feature; and after the predetermined period, performing a second ALD cycle in the processing chamber to deposit film on the substrate.08-27-2015

Jun Qian, Seattle, WA US

Patent application numberDescriptionPublished
20150379426OPTIMIZED DECISION TREE BASED MODELS - During a training phase of a machine learning model, representations of at least some nodes of a decision tree are generated and stored on persistent storage in depth-first order. A respective predictive utility metric (PUM) value is determined for one or more nodes, indicating expected contributions of the nodes to a prediction of the model. A particular node is selected for removal from the tree based at least partly on its PUM value. A modified version of the tree, with the particular node removed, is stored for obtaining a prediction.12-31-2015
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